SK hynix Starts Supplying Mobile DRAM with Highly Efficient Heat Dissipation

Rhea-AI Summary

SK hynix (HXSCL) has pioneered the industry's first mobile DRAM with enhanced heat dissipation capabilities by implementing High-K Epoxy Molding Compound (EMC) technology. The innovation improves thermal conductivity by 3.5 times and reduces thermal resistance by 47% compared to traditional solutions.

The breakthrough addresses critical heat management challenges in smartphones running on-device AI applications, particularly in flagship models using Package on Package (PoP) architecture. By adding Alumina to existing Silica-based EMC material, SK hynix has created a solution that promises to extend battery life and device longevity while maintaining optimal performance.

• Company first in industry to develop High-K EMC material, improves thermal conductivity by 3.5 times, thermal resistance by 47%
• Customers expect achievement to help address heat issue generated from on-device AI
• SK hynix to lead next-generation DRAM for mobile device through technological innovation of materials

SEOUL, South Korea, Aug. 27, 2025 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has started supplying mobile DRAM products with highly efficient heat dissipation by adopting the High-K Epoxy Molding Compound* material for the first time in the industry.

* EMC(Epoxy Molding Compound): a critical material for semiconductor packaging that protects chips from various external conditions such as water, heat, impact and electronic charge and provides a channel where heat can be dissipated. High-K EMC raises thermal conductivity with adoption of a material with high heat-transfer coefficient in EMC

The development comes as heat generated in the process of fast data transfer for on-device AI applications results in performance degradation of smartphones. Global smartphone companies welcome the launch of the product on expectations that it will help address the heat issue of high-performance flagship smartphones.

The structure of package on package, or PoP**, that most flagship smartphones adopt and stacks DRAM onto the application processor***, allows efficient use of limited space, while improving data transfer speed. Such system, however, also triggers a performance degradation of the device itself as heat generated within the mobile AP stays inside DRAM.

** PoP(Package on Package): a packaging method commonly used for mobile products. Different types of chips are stacked vertically to improve space efficiency, performance and flexibility of combinations

*** Mobile AP(Application Processor): chip referred to the brain of mobile devices such as smartphones and tablets

SK hynix found the solution in improvement of thermal conductivity of EMC, a critical material that covers DRAM package and developed High-K EMC by adding Alumina to Silica, which has been adopted for EMC material so far.

With thermal conductivity improved by 3.5 times and thermal resistance in the vertical course of the heat improved by 47%, the new technology is expected to contribute to a longer battery runtime and  product lifespan by improving performance of a smartphone and reducing power consumption.

"It's a meaningful achievement that goes beyond a simple performance improvement as it addresses the inconvenience that many high-performance smartphone users may have had," Lee Gyujei, Head of Package Product Development, said. "We are committed to firmly establishing our technological leadership in the next-generation mobile DRAM market with our technological innovation in materials."

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world's top tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

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SOURCE SK hynix Inc.

FAQ

What is SK hynix's new High-K EMC technology for mobile DRAM?

SK hynix's High-K EMC is an innovative material that improves thermal conductivity by 3.5 times and reduces thermal resistance by 47% in mobile DRAM, achieved by adding Alumina to traditional Silica-based EMC material.

How does SK hynix's new mobile DRAM technology improve smartphone performance?

The technology enhances heat dissipation in smartphones, leading to improved device performance, longer battery runtime, and extended product lifespan by better managing heat generated during on-device AI operations.

What problem does SK hynix's new mobile DRAM technology solve?

It addresses the heat management challenges in flagship smartphones, particularly those using Package on Package (PoP) architecture, where heat generated by the application processor can affect DRAM performance.

When will SK hynix (HXSCL) begin supplying the new mobile DRAM products?

SK hynix has already started supplying the new mobile DRAM products with High-K EMC technology as of August 27, 2025.

What are the key benefits of SK hynix's new mobile DRAM for smartphone manufacturers?

The technology offers improved thermal conductivity, reduced power consumption, better device performance, and longer battery life, particularly beneficial for high-performance flagship smartphones running AI applications.