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Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors

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Rapidus and IBM announced a joint development partnership to establish mass production technologies for chiplet packages. The collaboration builds on an existing agreement for 2nm node technology. Rapidus will leverage IBM's expertise in semiconductor packaging to innovate in high-performance chips. This partnership is part of Japan's NEDO project focused on developing 2nm-generation semiconductor technology. Engineers from both companies will work at IBM's North American facilities for R&D and manufacturing. The deal aims to strengthen Japan's role in the semiconductor supply chain.

Positive
  • Joint development with IBM focuses on cutting-edge chiplet packaging technology.
  • Agreement builds on a prior collaboration for 2nm node technology.
  • Partnership aims to enhance Japan's role in the semiconductor supply chain.
  • Engineers from both companies will collaborate in North America, ensuring cross-border expertise exchange.
  • Leverages IBM's decades of innovation in advanced packaging.
Negative
  • No immediate financial gains or revenue projections stated.
  • Potential risks with international collaboration logistics and coordination.
  • Dependence on IBM's technology and expertise may limit Rapidus's independent advancements.

The announcement about Rapidus and IBM expanding their collaboration to chiplet packaging technology for 2nm-generation semiconductors represents a significant leap in semiconductor technology. Chiplets are small integrated circuits that can be combined to create more complex and powerful processors. This modular approach allows for greater flexibility and efficiency in manufacturing advanced semiconductors.

IBM's expertise in semiconductor R&D and manufacturing, particularly in advanced packaging, is important for this collaboration. The technology could enhance performance, reduce costs and accelerate the deployment of next-generation computing systems. For investors, this could indicate a potential increase in IBM's market share in the semiconductor space, especially given the growing demand for high-performance computing in AI and data analytics.

Moreover, this collaboration aligns well with Japan's strategic goals in semiconductor technology, supported by NEDO. Rapidus leveraging IBM's experience could shorten the development cycle and bring cutting-edge technology to market faster, which is a critical advantage in the competitive semiconductor industry.

Overall, the cooperation could position both companies more favorably in the global semiconductor market, potentially driving revenue and profit growth in the long term.

From a financial perspective, this joint development partnership between IBM and Rapidus could create substantial value for both companies. The collaboration on chiplet packaging technology for 2nm semiconductors is likely to lead to cost efficiencies and performance improvements, which are important for maintaining competitive advantages in the semiconductor industry.

For IBM, engaging in this high-tech R&D project strengthens its portfolio and commitment to innovation, possibly attracting more clients and partnerships. Investors should note that such advancements in packaging could lower production costs and increase the output of high-performance chips, thus boosting profit margins.

Rapidus, on the other hand, stands to gain significantly from IBM's extensive experience and technological prowess. This partnership allows Rapidus to upscale its technological capabilities, likely improving its market position and revenue growth prospects. Additionally, the support from NEDO adds a layer of financial stability and state-backed endorsement, which is beneficial in mitigating risks associated with high R&D costs.

Investors should keep an eye on the milestones achieved through this collaboration, which could serve as indicators of future financial performance and market positioning.

Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology

TOKYO, June 3, 2024 /PRNewswire/ -- Rapidus Corporation, a manufacturer of advanced logic semiconductors, and multinational technology company IBM (NYSE: IBM), today announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors, and the two companies will collaborate with a goal of further innovating in this space.

This agreement is part of an international collaboration within the framework of the "Development of Chiplet and Package Design and Manufacturing Technology for 2nm-Generation Semiconductors" project being conducted by Japan's New Energy and Industrial Technology Development Organization (NEDO) and builds on an existing agreement with IBM for the joint development of 2nm node technology. As part of the agreement, IBM and Rapidus engineers will work in collaboration at IBM's facilities in North America for R&D and manufacturing of semiconductor packaging for high-performance computer systems.

Over the years, IBM has accumulated R&D and manufacturing technologies for semiconductor packaging for high-performance computer systems. The company also has a wealth of experience with joint development partnerships with Japanese semiconductor manufacturers, as well as manufacturers of semiconductors, package manufacturing equipment, and materials. Rapidus aims to leverage this expertise to quickly establish cutting-edge chiplet packaging technology.

Rapidus President and CEO Dr. Atsuyoshi Koike commented: "Building on our current joint development agreement for 2nm semiconductor technology, we are extremely pleased to officially announce today this partnership with IBM to establish chiplet packaging technology. We will make the most of this international collaboration and pursue initiatives that will allow Japan to play an even more important role in the semiconductor packaging supply chain."

Darío Gil, SVP and Director of Research at IBM, said: "With decades of innovation in advanced packaging, IBM is honored to expand our collaboration with Rapidus to develop state-of-the-art chiplet technology. Through our agreement, we are committed to supporting the development of the most advanced node production processes, design, and packaging, as well as developing new use cases and supporting the semiconductor workforce."

About IBM
IBM is a leading provider of global hybrid cloud and AI, and consulting expertise. We help clients in more than 175 countries capitalize on insights from their data, streamline business processes, reduce costs and gain the competitive edge in their industries. More than 4,000 government and corporate entities in critical infrastructure areas such as financial services, telecommunications and healthcare rely on IBM's hybrid cloud platform and Red Hat OpenShift to affect their digital transformations quickly, efficiently and securely. IBM's breakthrough innovations in AI, quantum computing, industry-specific cloud solutions and consulting deliver open and flexible options to our clients. All of this is backed by IBM's legendary commitment to trust, transparency, responsibility, inclusivity and service. Visit ibm.com for more information.

About Rapidus
Rapidus Corporation aims to develop and manufacture the world's most advanced logic semiconductors. By developing and providing services to shorten cycle times for design, wafer processes, 3D packaging, and other aspects of semiconductor production, Rapidus creates new industries together with customers. We continue to embrace challenges that contribute to the fulfillment, prosperity, and happiness of people's lives using semiconductors.

Media contacts:

Kreab K.K. (Japan)
Kunihiko Yasue, Kreab
E-mail: kyasue@kreab.com

Takano Okumoto, Kreab
E-mail: tokumoto@kreab.com

Miki Yagi, Kreab
E-mail: myagi@kreab.com

Breakaway Communications (U.S.)
Devan Gillick, rapidus@breakawaycom.com

Cision View original content to download multimedia:https://www.prnewswire.com/news-releases/rapidus-and-ibm-expand-collaboration-to-chiplet-packaging-technology-for-2nm-generation-semiconductors-302162355.html

SOURCE Rapidus Corporation

FAQ

What is the new collaboration between Rapidus and IBM focused on?

The collaboration focuses on establishing mass production technologies for chiplet packages for 2nm-generation semiconductors.

When was the partnership between Rapidus and IBM announced?

The partnership was announced on June 3, 2024.

What is the purpose of the Rapidus and IBM agreement?

The purpose is to develop and innovate in the space of high-performance semiconductor packaging.

How does the IBM and Rapidus partnership affect Japan's semiconductor supply chain?

The partnership aims to strengthen Japan's role in the semiconductor packaging supply chain.

Where will the R&D and manufacturing for the Rapidus and IBM project take place?

R&D and manufacturing will take place at IBM's facilities in North America.

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