Ichor Announces Participation in 18th Annual CEO Investor Summit

Ichor Holdings (ICHR) will participate in the 18th Annual CEO Investor Summit on October 13, 2026, in San Francisco.

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Company-Hosted Investor Conference to be Held Concurrently with SEMICON West in San Francisco

FREMONT, Calif.--(BUSINESS WIRE)-- Ichor Holdings, Ltd. (NASDAQ: ICHR), a leader in the design, engineering, and manufacturing of critical fluid delivery subsystems and components for semiconductor capital equipment, today announced management’s participation in the 18^th Annual CEO Investor Summit, being held Tuesday, October 13^th, 2026, at the St. Regis Hotel in San Francisco, California.

The presentation material utilized during the CEO Investor Summit will be made accessible on the investor page of the company’s website at https://ir.ichorsystems.com.

About the 18^th Annual CEO Investor Summit 2026

The CEO Investor Summit is held annually each year during the SEMICON West industry trade show. Collectively hosted and funded by participating companies, the CEO Investor Summit features a “round-robin” format consisting of small group meetings with company management teams. During the event, investors and analysts will have the opportunity to meet with the majority of the 11 management teams during the small group meeting sessions and networking events.

The 11 management teams collectively hosting the 18^th Annual CEO Investor Summit include: ACM Research (ACMR), Aehr Test Systems (AEHR), Alpha & Omega Semiconductor (AOSL), Cohu, Inc. (COHU), FormFactor (FORM), Ichor Systems (ICHR), InTEST Corporation (INTT), Kulicke & Soffa (KLIC), Photronics (PLAB), QuickLogic (QUIK), and SkyWater Technology, an IonQ company (IONQ). B Riley Securities, Jefferies and Stifel are sponsors of the conference.

Attendance at the CEO Investor Summit is by invitation only and is available solely to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. Last day for registration is October 2, 2026.

RSVP Contacts for 18^th Annual CEO Investor Summit 2026

To RSVP for the CEO Investor Summit, please visit the CEO Summit Events website or contact either of the event co-chairs:

Laura J. Guerrant-Oiye	Claire E. McAdams
Phone: (808) 960-2642	Phone: (530) 265-9899
Email: lauraoiye@gmail.com	Email: claire@headgatepartners.com

About Ichor

We are a leader in the design, engineering and manufacturing of critical fluid delivery subsystems and components primarily for semiconductor capital equipment, as well as other industries such as defense/aerospace and medical. Our primary product offerings include gas and chemical delivery subsystems, collectively known as fluid delivery subsystems, which are key elements of the process tools used in the manufacturing of semiconductor devices. Our gas delivery subsystems deliver, monitor and control precise quantities of the specialized gases used in semiconductor manufacturing processes such as etch and deposition. Our chemical delivery subsystems precisely blend and dispense the reactive liquid chemistries used in semiconductor manufacturing processes such as chemical-mechanical planarization, electroplating, and cleaning. We also provide precision-machined components, weldments, e-beam and laser welded components, precision vacuum and hydrogen brazing, surface treatment technologies, and other proprietary products. We are headquartered in Fremont, CA.

https://ir.ichorsystems.com/

View source version on businesswire.com: https://www.businesswire.com/news/home/20260928007122/en/

Greg Swyt, CFO 510-897-5200
Claire McAdams, IR & Strategic Initiatives 530-265-9899
IR@ichorsystems.com

Source: Ichor Holdings, Ltd.

Key Terms

chemical-mechanical planarization technical

A manufacturing process used in semiconductor and electronics fabrication that smooths and flattens wafer surfaces by combining a chemical slurry with mechanical polishing. Like sanding and cleaning a tabletop at the same time, it removes tiny bumps and defects so multiple thin layers can be built accurately; it matters to investors because its effectiveness affects chip yields, production costs, performance consistency and the ability of manufacturers to scale advanced devices.