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Kulicke & Soffa Industries Inc. (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions, serving multiple global segments including automotive, consumer, communications, computing, and industrial. Established in 1951, the company has been at the forefront of the semiconductor industry, offering advanced packaging solutions for decades. Headquartered in the United States, Kulicke & Soffa designs, manufactures, and sells capital equipment and expendable tools crucial for assembling semiconductor devices.
The company operates through four main segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services. The Ball Bonding Equipment segment, which represents the bulk of the company's revenue, specializes in the development and sale of ball bonding and wafer-level bonding equipment. Kulicke & Soffa's extensive customer base is primarily located in the Asia-Pacific region.
In recent years, Kulicke & Soffa has expanded its product lineup through strategic acquisitions and organic growth. The company now offers advanced packaging, electronics assembly, wedge bonding, and a broader range of expendable tools. This diversification has strengthened its position in the market, enabling the company to support the next generation of electronic devices with innovative solutions.
Kulicke & Soffa has demonstrated a commitment to innovation and development, continually enhancing its process technology and capabilities. The company's expertise in thermocompression bonding (TCB) has been particularly noteworthy, with multiple orders received for its TCB solutions supporting Silicon Photonics (SiPh) based co-packaged optics (CPO) applications. These solutions cater to high-bandwidth networking transceivers and are integral to emerging AI technologies.
Financially, Kulicke & Soffa has shown resilience and adaptability. The company reported net revenues of $202.3 million and net income of $23.4 million for the fourth fiscal quarter ended September 30, 2023. Despite some challenges in the memory and automotive markets, the company anticipates sequential improvement in demand throughout 2024.
Kulicke & Soffa continues to drive growth and innovation, focusing on advanced packaging, advanced display, and expanding its thermocompression and advanced dispense capabilities. This proactive approach positions the company to capitalize on the evolving needs of the semiconductor industry.
Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) has announced a quarterly dividend of $0.20 per share of common stock. The dividend will be paid on October 8, 2024, to shareholders of record as of September 19, 2024. Kulicke & Soffa, founded in 1951, specializes in developing semiconductor and electronics assembly solutions. The company's products support growth and technology transitions across various markets, including advanced display, automotive, communications, compute, consumer, data storage, energy storage, and industrial sectors.
Kulicke & Soffa (NASDAQ: KLIC) reported Q3 2024 financial results with net revenue of $181.7 million, down 4.9% year-over-year but up 5.6% sequentially. GAAP net income was $12.3 million or $0.22 per diluted share, while non-GAAP net income was $19.3 million or $0.35 per diluted share. The company saw improvement in gross margin and operating margin compared to the previous quarter.
CEO Fusen Chen noted gradual recovery and optimism for capacity and technology expansion across multiple end-markets. K&S highlighted growing momentum for its Thermo-Compression Bonding program with new commercial wins. For Q4 2024, the company expects net revenue of approximately $180 million and non-GAAP EPS of about $0.35.
Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) has announced significant milestones in the adoption of its Thermo-Compression Bonding (TCB) technology. The company has introduced its latest APTURA™ Thermo-Compression platform and secured multiple customer wins for its TCB offerings. K&S has also demonstrated an alternative path to chip-to-wafer hybrid bonding through industry collaborations.
Additionally, K&S has joined the 'US-Joint' consortium, led by Resonac Holdings , to support advanced packaging solutions development. The consortium will establish an R&D facility in Silicon Valley, expected to be fully operational by 2025. K&S reports that its TCB business has grown over 10 times in the past four years, indicating strong market adoption of this technology for advanced chiplet and stacked-die applications in AI, HPC, Mobile, and Edge devices.
Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC), a global leader in semiconductor, LED, and electronic assembly equipment, has announced a conference call scheduled for August 7, 2024, at 4:30 pm EDT. The call will discuss the company's third fiscal quarter 2024 financial results and business outlook. K&S will release its financial results on the same day at approximately 4:00 pm EDT.
Interested parties can access the call by dialing +1-877-407-8037 (US) or +1-201-689-8037 (international). A live webcast and replay will be available at investor.kns.com. A replay of the call will be accessible until August 15, 2024, by calling +1-877-660-6853 (US) or +1-201-612-7415 (international) with the replay ID 13743543.
Kulicke & Soffa Industries (NASDAQ: KLIC) declared a quarterly dividend of $0.20 per share, payable on July 9, 2024, to shareholders of record as of June 20, 2024. The company, founded in 1951, specializes in semiconductor and electronics assembly solutions. Its product range supports various markets, including advanced display, automotive, communications, computing, consumer electronics, data storage, energy storage, and industrial sectors.
Kulicke and Soffa reported financial results for the second quarter of 2024, with a net revenue of $172.1 million and a net loss of $102.7 million. The company experienced a decrease in gross margin and operating margin compared to the previous year. Despite challenges in the Advanced Display market, the company remains focused on operational efficiency. Kulicke & Soffa aims to achieve new milestones in customer and market adoption over the coming quarters.
Kulicke & Soffa announced a significant order for 1,000 RAPID™ Pro systems for a key customer in the Assembly and Test market, supporting the semiconductor industry's digital transformation. The order includes the latest ProSuite technology, enhancing production capabilities for wire bonded packages. The company's Ball Bonding segment revenue has surged by over 50% in the second fiscal quarter of 2024.
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