Kulicke & Soffa Inds Inc Stock Price, News & Analysis

Kulicke & Soffa (NASDAQ:KLIC), a global semiconductor assembly technology leader, has scheduled its second fiscal quarter 2025 earnings conference call for May 7, 2025, at 8:00 AM ET. The company will release its Q2 2025 financial results on May 6, 2025, at approximately 4:00 PM ET.

Interested parties can access the conference call via phone at +1-877-407-8037 (US) or +1-201-689-8037 (International). A live webcast and replay will be available at investor.kns.com. The call replay will be accessible through May 14, 2025, using toll-free +1-877-660-6853 or international +1-201-612-7415 with replay ID 13750874.

Kulicke & Soffa (NASDAQ: KLIC) has launched the Asterion-PW, an advanced ultrasonic pin welding solution for power semiconductor applications. The new technology targets the rapidly growing power module market, which is projected to grow at a 12% CAGR through 2029.

The Asterion-PW features the innovative Sonotrode ultrasonic technology, replacing traditional soldering methods with improved accuracy and productivity. Key advantages include environmentally friendly operation by eliminating flux and solder paste, high-resolution linear motor positioning, and superior pin placement precision.

The system incorporates a high-speed bulk pin feeder and optional material handling system with advanced cleaning capabilities. The durable Sonotrode design offers extended operational lifespan, reducing changeover frequency and improving cost efficiency.

Additionally, K&S announced the concurrent launch of ATPremier MEM PLUS, a wafer level packaging solution using Vertical Wire technology for advanced memory applications. Both products will be showcased at SEMICON China 2025.

Kulicke & Soffa (NASDAQ: KLIC) has launched ATPremier MEM PLUS, a new vertical wire technology solution for high-volume memory applications. The innovative wafer-level packaging solution targets at-the-edge AI applications, which are expected to grow at a >25% compound annual growth rate over the next five years.

The technology breaks barriers in DRAM and NAND assembly density, featuring proprietary ProVertical and ProCascade Loop processes. ATPremier MEM PLUS offers an alternative to traditional copper pillar technology by removing two-dimensional packaging limitations, reducing complexity and costs while supporting advanced assembly requirements.

Key features include Response Based Processes, Advanced Optical System with inspection features, and Factory Automation Integration. The company also announced the concurrent launch of Asterion®-PW, an ultrasonic pin welding solution for power semiconductor applications. Both products will debut at SEMICON China 2025 in Shanghai.

Kulicke & Soffa (NASDAQ: KLIC) has announced a quarterly dividend of $0.205 per share of common stock. The dividend will be paid on April 8, 2025, to shareholders of record as of March 20, 2024.

Founded in 1951, Kulicke & Soffa is a technology company specializing in semiconductor and electronics assembly solutions. The company focuses on developing products and services that support growth across various markets, including:

• Advanced display
• Automotive
• Communications
• Compute
• Consumer
• Data storage
• Energy storage
• Industrial

Kulicke & Soffa (NASDAQ: KLIC) reported its Q1 FY2025 financial results with net revenue of $166.1 million, representing a 3% year-over-year decline and 8.4% sequential decrease. The company achieved a net income of $81.6 million, or $1.51 per diluted share (GAAP), and non-GAAP net income of $20.2 million, or $0.37 per diluted share.

Notable metrics include a gross margin of 52.4%, up 570 basis points year-over-year, and operating margin of 52.2%. The company maintained a strong financial position with $538.3 million in cash and investments. During Q1, KLIC repurchased 0.8 million shares for $36.9 million.

For Q2 FY2025, the company projects revenue of approximately $165 million (+/- $10 million) with expected GAAP EPS of $0.03 and non-GAAP EPS of $0.19 (+/- 10%).

Kulicke & Soffa (NASDAQ: KLIC), a global leader in semiconductor, LED and electronic assembly equipment manufacturing, has scheduled its first quarter 2025 financial results conference call for February 5, 2025, at 8:00 AM EST. The company will release its Q1 FY2025 financial results on February 4, 2025, at approximately 4:00 PM EST.

Interested parties can access the conference call via phone at +1-877-407-8037 (US) or +1-201-689-8037 (International). A live webcast and replay will be available at investor.kns.com. The call replay will be accessible until February 13, 2025, through toll-free number +1-877-660-6853 or internationally at +1-201-612-7415, using replay ID 13750873.

Kulicke & Soffa (NASDAQ: KLIC) has completed its $800 million share repurchase program initiated in Q4 2017, buying back approximately 22.7 million shares at an average price of $35.25 per share. The company has announced a new $300 million share repurchase program. Since 2014, K&S has deployed $900 million to repurchase 30.9 million shares at an average price of $29.12 per share. As of Q4 2024, the company holds $577.1 million in cash, cash equivalents and short-term investments, with approximately 54.9 million weighted average shares outstanding.

Kulicke & Soffa (NASDAQ: KLIC) reported Q4 2024 financial results with net revenue of $181.3 million, down 10.4% year-over-year. The company posted net income of $12.1 million and EPS of $0.22 per diluted share. Non-GAAP net income was $18.5 million with EPS of $0.34. For fiscal year 2024, K&S reported revenue of $706.2 million with a net loss of $69.0 million. The company expects Q1 2025 revenue of approximately $165.0 million with GAAP EPS of $1.45 and non-GAAP EPS of $0.28.

Kulicke & Soffa (NASDAQ: KLIC) has secured an order from a leading foundry for multiple APTURA™ Fluxless TCB systems. This order supports the expanding global adoption of advanced packaging in semiconductor production. Kulicke & Soffa has delivered over 30 FTC systems to five different customers. The APTURA™ FTC system is the first to enable high-volume FTC in a production environment, supporting various material configurations and ultra-fine pitch direct Cu-to-Cu bonding down to 8µm, with potential to scale to 3µm. Prior FTC solutions were to 30µm pitch. The growing adoption of FTC technology highlights its potential to lower design costs, reduce yield challenges, and increase transistor density. Kulicke & Soffa anticipates a 40-50% sequential growth in its TCB business for fiscal year 2025, driven by adoption in advanced computing, optical, communications, and industrial markets.