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Kulicke & Soffa Declares Quarterly Dividend of $0.19

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Kulicke and Soffa Industries declares quarterly dividend of $0.19 per share of common stock.
Positive
  • Quarterly dividend payment authorized
Negative
  • None.

SINGAPORE, Aug. 23, 2023 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa," "K&S" or the "Company"), today announced that its Board of Directors has declared and authorized a quarterly dividend of $0.19 per share of common stock. This upcoming dividend payment will be made on October 10, 2023, to holders of record as of September 21, 2023.

About Kulicke & Soffa
Founded in 1951, Kulicke & Soffa specializes in developing cutting-edge semiconductor and electronics assembly solutions enabling a smart and more sustainable future. Our ever-growing range of products and services supports growth and facilitates technology transitions across large-scale markets, such as advanced display, automotive, communications, compute, consumer, data storage, energy storage and industrial.

Contacts
Kulicke & Soffa 
Joseph Elgindy
Finance
P: +1-215-784-7500
investor@kns.com

 

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SOURCE Kulicke & Soffa Industries, Inc.

Kulicke & Soffa Industries Inc

NASDAQ:KLIC

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2.67B
54.28M
3.52%
96.28%
7.29%
Semiconductor and Related Device Manufacturing
Manufacturing
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United States of America
SINGAPORE

About KLIC

kulicke & soffa (nasdaq: klic) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. as a pioneer in the semiconductor space, k&s has provided customers with market leading packaging solutions for decades. in recent years, k&s has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. combined with its extensive expertise in process technology and focus on development, k&s is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices.