Kulicke & Soffa Unveils ACELON™ - A Revolutionary High-Performance Dispenser for Advanced Manufacturing Applications

Rhea-AI Summary

Kulicke & Soffa (NASDAQ: KLIC) has unveiled ACELON™, a next-generation precision dispensing solution for semiconductor, SMT, and automotive assembly applications. The system leverages K&S's established wire bonding architecture and delivers sub-20µm wet accuracy with enhanced process stability.

Key features include automatic calibration, Twin Valve capability, sub-180µm keep-out zones, and AI-powered Auto Parameter Tuning. ACELON™ will debut at SEMICON Taiwan 2025 (September 10-12) and is scheduled for general availability by March 2026.

Positive

• Advanced sub-20µm wet accuracy capability enhances precision manufacturing
• AI-powered Auto Parameter Tuning system optimizes production efficiency
• Expanded working area accommodates larger substrates and complex assemblies
• Twin Valve/Dual Valve option increases production throughput

Negative

• Product won't be generally available until March 2026, indicating a significant wait time for implementation

Insights

Semiconductor Equipment Analyst

K&S launches advanced ACELON™ dispenser, expanding its semiconductor equipment portfolio with high-precision capabilities for next-gen packaging technologies.

Kulicke & Soffa's new ACELON™ precision dispensing system represents a significant expansion of their advanced packaging equipment portfolio, strategically positioning the company to capitalize on the growing demand for heterogeneous integration solutions. By leveraging their established wire bonding architecture—a cornerstone technology with proven reliability in high-volume manufacturing—K&S has created a differentiated offering in the competitive advanced dispensing market.

The technical specifications reveal substantial performance advantages, particularly the sub-20µm wet accuracy and sub-180µm keep-out zones, which directly address the miniaturization requirements driving advanced packaging. These capabilities enable the higher component densities essential for next-generation semiconductor designs, where space constraints and thermal management are critical challenges.

Most compelling is the system's AI-powered Auto Parameter Tuning functionality, which provides continuous optimization based on process results and historical data. This feature addresses a major pain point in semiconductor manufacturing—the need to reduce setup times while maintaining process consistency across high-volume production runs.

The expanded working area for larger substrates positions ACELON™ to serve growing applications in automotive semiconductors and advanced memory packaging, where larger form factors are common. The optional Twin Valve/Dual Valve capability creates a compelling throughput advantage for high-volume manufacturers facing increasing production demands.

With general availability targeted for March 2026, K&S is laying groundwork for revenue growth in FY2026-2027, though near-term financial impact will be minimal. This product complements their existing portfolio and strengthens their value proposition in advanced packaging—a segment experiencing accelerated growth due to heterogeneous integration trends and AI-driven computing demands.

SINGAPORE, Sept. 9, 2025 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company") today announced the launch of ACELON™, a next-generation precision dispensing solution designed for a broad-range of semiconductor, SMT, and automotive assembly applications. This new advanced dispense platform leverages the Company's market-leading machine architecture in wire bonding, which is already successfully deployed by leading customers in critical high-reliability and high-volume production environments worldwide for decades.

ACELON™ tackles the most demanding advanced dispense challenges with greater process stability for the most critical production environments. Additionally, ACELON™ provides flexibility for handling larger substrates and complex assembly configurations through a significantly expanded working area. The system delivers industry-leading precision with sub-20µm wet accuracy, ensuring consistent material placement for critical applications where dimensional tolerances are paramount.

Key technological advancements of ACELON™ include:

• Automatic calibration functions that streamline setup procedures and reduce operator intervention.
• An optional Twin Valve/Dual Valve capability is specifically designed to enhance throughput and configuration flexibility within the highest-volume production environments.
• Precision placement accuracy with exceptional repeatability enables sub-180µm keep-out zones (KOZ) enabling higher-component density designs in support of advanced packaging trends.
• Quality and throughput are further extended with AI-powered Auto Parameter Tuning (APT) – intelligent software which continuously optimizes system parameters based on process results and historical performance data.

These new capabilities reduce setup time, enhance production consistency and help customers better address advanced packaging production challenges.

"We are excited to offer customers new levels of capability, reliability and cost of ownership through ACELON™. Leveraging on the unparalleled dependability of our market-leading system architecture in wire bonding, combined with ultra precision dispensing capabilities and AI-driven optimization – ACELON™ is positioned to set a new benchmark for precision, performance, and reliability," stated Meng Kwong Han, Senior Vice President, Advanced Dispensing Solutions Business Unit.

Visit K&S at SEMICON Taiwan 2025

Together with a broad portfolio of K&S solutions, ACELON™ will debut at the SEMICON Taiwan Trade Show in Taipei, from September 10, 2025 through September 12, 2025, at Level 4 Booth #L0616. ACELON™ is targeted to be generally available by March 2026. Please contact your regional K&S sales team for additional information.

About Kulicke & Soffa

Kulicke & Soffa is a global leader in semiconductor assembly technology, advancing device performance across automotive, compute, industrial, memory and communications markets. Founded on innovation in 1951, K&S is uniquely positioned to overcome increasingly dynamic process challenges – creating and delivering long-term value by aligning technology with opportunity.

Contacts

Kulicke & Soffa
Marilyn Sim
Public Relations
+65-6880 9309
msim@kns.com

Kulicke & Soffa
Joseph Elgindy
Finance
+1-215-784-7500
investor@kns.com

 

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SOURCE Kulicke & Soffa Industries, Inc.

FAQ

What are the key features of Kulicke & Soffa's new ACELON™ dispensing system?

ACELON™ features sub-20µm wet accuracy, automatic calibration, Twin Valve capability for enhanced throughput, sub-180µm keep-out zones, and AI-powered Auto Parameter Tuning for continuous optimization.

When will Kulicke & Soffa's ACELON™ system be available for purchase?

ACELON™ is scheduled to be generally available by March 2026.

What industries can benefit from KLIC's ACELON™ dispensing solution?

ACELON™ is designed for semiconductor, SMT (Surface Mount Technology), and automotive assembly applications, particularly in high-reliability and high-volume production environments.

Where will Kulicke & Soffa showcase the new ACELON™ system?

ACELON™ will debut at SEMICON Taiwan Trade Show in Taipei, from September 10-12, 2025, at Level 4 Booth #L0616.

What manufacturing advantages does ACELON™ offer compared to existing solutions?

ACELON™ offers greater process stability, expanded working area for larger substrates, sub-20µm wet accuracy, and AI-powered optimization, while reducing setup time and enhancing production consistency.