Kulicke & Soffa Unveils ACELON™ - A Revolutionary High-Performance Dispenser for Advanced Manufacturing Applications
Rhea-AI Summary
Kulicke & Soffa (NASDAQ: KLIC) has unveiled ACELON™, a next-generation precision dispensing solution for semiconductor, SMT, and automotive assembly applications. The system leverages K&S's established wire bonding architecture and delivers sub-20µm wet accuracy with enhanced process stability.
Key features include automatic calibration, Twin Valve capability, sub-180µm keep-out zones, and AI-powered Auto Parameter Tuning. ACELON™ will debut at SEMICON Taiwan 2025 (September 10-12) and is scheduled for general availability by March 2026.
Positive
- Advanced sub-20µm wet accuracy capability enhances precision manufacturing
- AI-powered Auto Parameter Tuning system optimizes production efficiency
- Expanded working area accommodates larger substrates and complex assemblies
- Twin Valve/Dual Valve option increases production throughput
Negative
- Product won't be generally available until March 2026, indicating a significant wait time for implementation
News Market Reaction 1 Alert
On the day this news was published, KLIC declined 0.50%, reflecting a mild negative market reaction.
Data tracked by StockTitan Argus on the day of publication.
ACELON™ tackles the most demanding advanced dispense challenges with greater process stability for the most critical production environments. Additionally, ACELON™ provides flexibility for handling larger substrates and complex assembly configurations through a significantly expanded working area. The system delivers industry-leading precision with sub-20µm wet accuracy, ensuring consistent material placement for critical applications where dimensional tolerances are paramount.
Key technological advancements of ACELON™ include:
- Automatic calibration functions that streamline setup procedures and reduce operator intervention.
- An optional Twin Valve/Dual Valve capability is specifically designed to enhance throughput and configuration flexibility within the highest-volume production environments.
- Precision placement accuracy with exceptional repeatability enables sub-180µm keep-out zones (KOZ) enabling higher-component density designs in support of advanced packaging trends.
- Quality and throughput are further extended with AI-powered Auto Parameter Tuning (APT) – intelligent software which continuously optimizes system parameters based on process results and historical performance data.
These new capabilities reduce setup time, enhance production consistency and help customers better address advanced packaging production challenges.
"We are excited to offer customers new levels of capability, reliability and cost of ownership through ACELON™. Leveraging on the unparalleled dependability of our market-leading system architecture in wire bonding, combined with ultra precision dispensing capabilities and AI-driven optimization – ACELON™ is positioned to set a new benchmark for precision, performance, and reliability," stated Meng Kwong Han, Senior Vice President, Advanced Dispensing Solutions Business Unit.
Visit K&S at SEMICON Taiwan 2025
Together with a broad portfolio of K&S solutions, ACELON™ will debut at the SEMICON Taiwan Trade Show in Taipei, from September 10, 2025 through September 12, 2025, at Level 4 Booth #L0616. ACELON™ is targeted to be generally available by March 2026. Please contact your regional K&S sales team for additional information.
About Kulicke & Soffa
Kulicke & Soffa is a global leader in semiconductor assembly technology, advancing device performance across automotive, compute, industrial, memory and communications markets. Founded on innovation in 1951, K&S is uniquely positioned to overcome increasingly dynamic process challenges – creating and delivering long-term value by aligning technology with opportunity.
Contacts
Kulicke & Soffa
Marilyn Sim
Public Relations
+65-6880 9309
msim@kns.com
Kulicke & Soffa
Joseph Elgindy
Finance
+1-215-784-7500
investor@kns.com
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SOURCE Kulicke & Soffa Industries, Inc.