Kulicke & Soffa Announces Thermo-Compression Adoption & Milestones
Rhea-AI Summary
Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) has announced significant milestones in the adoption of its Thermo-Compression Bonding (TCB) technology. The company has introduced its latest APTURA™ Thermo-Compression platform and secured multiple customer wins for its TCB offerings. K&S has also demonstrated an alternative path to chip-to-wafer hybrid bonding through industry collaborations.
Additionally, K&S has joined the 'US-Joint' consortium, led by Resonac Holdings , to support advanced packaging solutions development. The consortium will establish an R&D facility in Silicon Valley, expected to be fully operational by 2025. K&S reports that its TCB business has grown over 10 times in the past four years, indicating strong market adoption of this technology for advanced chiplet and stacked-die applications in AI, HPC, Mobile, and Edge devices.
Positive
- Introduction of the latest APTURA™ Thermo-Compression platform
- Multiple new customer wins for Thermo-Compression offerings
- Demonstration of an alternative path to chip-to-wafer hybrid bonding
- Joining the 'US-Joint' consortium for advanced packaging solutions development
- TCB business growth of over 10 times in the past four years
Negative
- None.
News Market Reaction 1 Alert
On the day this news was published, KLIC gained 3.16%, reflecting a moderate positive market reaction.
Data tracked by StockTitan Argus on the day of publication.
Several New Customer Wins as TCB Gains Commercial Momentum
New Path to Hybrid Bonding Demonstrated through Fluxless TCB
K&S Joins Resonac-led "US-Joint" Consortium
Recently, several of Kulicke & Soffa's leading Thermo-Compression offerings have been selected at multiple Assembly & Test customers. In support of the rapid needs for advanced chiplet and stacked-die requirements, these tools will support chip-to-substrate processes targeting applications such as AI, HPC, Mobile and Edge-devices. K&S also continues to pursue additional chip-to-wafer engagements and anticipates making further customer announcements over the coming quarter as its Thermo-Compression momentum, specifically in the area of Fluxless Thermo-Compression bonding (FTC), continues.
Additionally, through industry collaborations with the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS), as well as an FTC customer, Kulicke & Soffa's leading APTURA™ platform has demonstrated an alternative path to chip-to-wafer hybrid bonding, enabled by Thermo-Compression. This innovative bumpless-FTC process creates a true chip-to-wafer, hybrid-bond – supporting bonding for both bumpless, Copper-to-Copper interconnects as well as dielectric materials – for advanced logic applications. While direct Copper-to-Copper bonding is a standard feature of the APTURA platform and gathering broad market attention, this innovative new process further extends the market access for Kulicke & Soffa's broadening portfolio of Advanced Packaging solutions.
Finally, on July 8th, Kulicke & Soffa's membership was announced within the "US-Joint" consortium, formed by Resonac Holdings Corporation ("Resonac"), a leading provider of global semiconductor materials. US-Joint is designed to support industry collaboration and market adoption of advanced packaging solutions through research and development and includes participation of ten American and Japanese semiconductor materials and equipment providers. After the initial establishment of two open consortiums in
US-Joint includes the construction of an R&D facility based in Silicon Valley, which will allow end-customers to verify the latest requirements for advanced device packaging, and also validate new concepts in development. Cleanrooms and equipment installations for this
"Our TCB business has grown by over 10 times over the past four years - faster than many other leading-edge interconnect processes – due to our close customer engagements and industry collaborations like these," stated John Molnar, VP of Advanced Solutions, "The broadening adoption of both Thermo-Compression technology, as well as emerging advanced chiplet-based assembly architectures – throughout our broadly served-markets – remains in early stages."
In support of the long-term industry needs for 2.5D and 3D packaging approaches, which are extending Moore's law, K&S anticipates to aggressively ramp customer engagements and production capacity for FTC and bumpless FTC over the coming years. In addition to Kulicke & Soffa's progress in Thermo-Compression technology, High-Power-Interconnect (HPI) utilization in Automotive and Industrials markets, Vertical-Fan-Out targeting dynamic memory adoption, and the growing industry need for System-in-Package (SiP) applications, provide additional growth opportunities over the long-term.
About Kulicke & Soffa
Founded in 1951, Kulicke and Soffa Industries, Inc. specializes in developing cutting-edge semiconductor and electronics assembly solutions enabling a smarter and more sustainable future. Our ever-growing range of products and services supports growth and facilitates technology transitions across large-scale markets, such as advanced display, automotive, communications, compute, consumer, data storage, energy storage and industrial.
Contacts
Kulicke & Soffa
Marilyn Sim
Public Relations
+65-6880 9309
msim@kns.com
Kulicke & Soffa
Joseph Elgindy
Finance
+1-215-784-7500
investor@kns.com
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SOURCE Kulicke & Soffa Industries, Inc.
FAQ
What new technology has Kulicke and Soffa (KLIC) introduced for advanced packaging?
How has Kulicke and Soffa's (KLIC) Thermo-Compression Bonding business performed in recent years?
What consortium has Kulicke and Soffa (KLIC) recently joined for advanced packaging research?
What new bonding process has Kulicke and Soffa (KLIC) demonstrated through industry collaborations?
