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SEALSQ Corp (LAES) drives innovation in quantum-resistant semiconductor solutions for IoT, automotive, and industrial security. This news hub provides investors and technology professionals with essential updates on the company's advancements in post-quantum cryptography and secure microcontroller development.
Access real-time announcements including earnings reports, product launches, strategic partnerships, and research milestones. Our curated collection ensures you stay informed about SEALSQ's VaultIC security solutions, industry certifications, and emerging applications in smart infrastructure protection.
Key updates cover regulatory developments in hardware encryption, cross-industry adoption of quantum-resistant technologies, and progress in securing connected devices against next-generation cyber threats. Bookmark this page for reliable insights into SEALSQ's role in shaping global cybersecurity standards through silicon-level protection systems.
SEALSQ (NASDAQ: LAES) has announced the planned launch of its Quantum Resistant Chips, QS7001 and QVault TPM, by Q4 2024. Focused on semiconductor and post-quantum technologies, SEALSQ has made rapid progress on its QUASARs project, moving from design to engineering samples ready by the end of 2024. The QS7001 will allow customers to develop their own firmware while QVault TPM will feature pre-provisioned FIPS 140-3 and TCG certified modules. SEALSQ is leveraging this technology to collaborate with large electronics manufacturers, aiming to develop custom quantum resistant chips and expand its business opportunities. This initiative aligns with SEALSQ’s plan to establish a Semiconductor Design and Personalization center.
SEALSQ (NASDAQ: LAES) has announced its support for the Connectivity Standards Alliance in Asia by joining the newly-formed Japanese Interest Group (JIG). The group, part of an international community of over 700 technology companies, aims to foster dialogue and collaboration, focusing on the Internet of Things (IoT) market in Japan. SEALSQ, among 17 founding members, will contribute through its expertise in Semiconductors, PKI, and Post-Quantum technology. The JIG, led by industry leaders including Panasonic and Allion Japan, seeks to advance Matter™ and Aliro™ Smart Home standards. SEALSQ's Japanese team, headed by Sales Director Katsunori Miyahata, will support Japanese device makers in achieving Matter compliance, offering benefits like reduced time-to-market and cost savings through their Matter™ ready PKI-as-a-Service and secure elements.
SEALSQ announced a comprehensive cybersecurity solution for Electric Vehicle (EV) charging stations. Their technology addresses vulnerabilities in EV charging through secure communication protocols and decentralized infrastructure networks (DePINs). The company was selected by a major global electric appliances manufacturer to secure new EV 'Plug & Charge' stations, which use ISO 15118 standards for secure and user-friendly charging.
SEALSQ’s solution includes blockchain technology for secure transactions using SEALCoins, enhancing data integrity and payment efficiency. The global EV charging market, valued at $19.67 billion in 2022, is expected to grow significantly, driven by the rising adoption of EVs. SEALSQ aims to secure this expanding infrastructure with its advanced technology, creating a secure and reliable charging ecosystem.
SEALSQ, a pioneer in RISC-V AI processors, predicts significant market growth for its RISC-V technology by 2030, capturing nearly 25% of the global market share. SEALSQ's RISC-V chips are expected to revolutionize the microchip industry, driven by AI and machine learning demand. The company plans to release engineering samples in late 2024 and launch production-ready chips by Q3 2025. RISC-V's open-source nature allows customization for specific AI workloads, offering cost and energy efficiency over traditional GPUs. The secure microcontroller market is anticipated to grow to $2.2 billion by 2026, while the trusted platform module market could reach $6 billion by 2035. SEALSQ's advancements position it as a key player in the evolving microchip landscape, with new chips undergoing testing for AI recommendation systems and quantum-resistant security.
SEALSQ (NASDAQ: LAES) announced the incorporation of SEALSQ USA in Phoenix, Arizona, aiming to establish an Open Semiconductors Assembly and Test (OSAT) Center by the end of 2025. This strategic initiative aligns with Arizona's robust semiconductor ecosystem and the U.S. CHIPS Act's objectives. The French center's R&D efforts will advance to the U.S. and Spanish centers, focusing on post-quantum cryptographic algorithms and AI integration. The Arizona OSAT center will specialize in wafer and final testing, and assembly services, enhancing SEALSQ's production capabilities for the European and Latin American markets. Collaborative projects will foster innovation, ensure security, and bolster a resilient supply chain.
SEALSQ announced advancements in post-quantum semiconductor solutions designed to ensure secure computing and transaction verification. Their technology integrates quantum computing with IoT, offering enhanced cybersecurity across various industries, including fintech, healthcare, and defense. SEALSQ's chips feature quantum speedup, optimization, machine learning, and post-quantum cryptography to counter quantum threats. The company's innovations aim to revolutionize sectors such as urban planning, healthcare, and logistics through efficient data analysis and decision-making. SEALSQ supports IoT device manufacturers to comply with the upcoming U.S. Cyber Trust Mark program by leveraging its Security by Design expertise. This initiative, led by the FCC, aims to improve consumer cybersecurity standards.
SEALSQ Corp (Nasdaq: LAES) has partnered with The Hashgraph Association to launch SEALCOIN, a new digital asset built on the Hedera Network for the Decentralized Physical Infrastructure Network (DePIN) sector. SEALCOIN is a hybrid payment and utility token enabling seamless data and digital asset exchanges between billions of internet-connected devices, with applications in smart home devices, supply chain management, autonomous vehicles, smart cities, and more. The release of a M2M Proof of Concept (PoC) is scheduled for mid-July 2024, showcasing innovative capabilities in enabling Service vs Payment transactions between machines.
SEALSQ Corp rebranded its semiconductor manufacturing business from WISeKey Semiconductors S.A.S to SEALSQ France S.A.S to enhance post-quantum semiconductor development in Meyreuil, Aix-en-Provence. The strategic move aims to accelerate cutting-edge technology advancements, such as the QUASARS project for quantum-resistant platforms, leading to the production of post-quantum semiconductors like the QS7001™ RISC V. SEALSQ plans to expand its workforce, seek funding under the European Chips Act, and develop custom quantum-resistant chips with major electronics manufacturers. This transformation reinforces SEALSQ's commitment to technological progress, France's position in the semiconductor market, and Europe's goal to boost semiconductor production by 2030.
SEALSQ Corp (NASDAQ: LAES) announces the production phase of engineering samples for its new quantum-resistant hardware platform, QS7001™. The company is also developing custom ASICs for key market players, fueling business growth and revenue opportunities. SEALSQ's focus on post-quantum technology reflects its strategic move towards a new pipeline of business opportunities and revenues.