Interlink Electronics, Inc. reports developments tied to sensor technology and printed electronics for human-machine interface, IoT, medical, industrial, automotive, wearables, environmental monitoring and specialty applications. Recurring updates include quarterly results, customer design wins, custom piezoelectric and force-sensing resistor solutions, printed electrode work for healthcare diagnostics, and electrochemical sensor projects for food-safety and quality monitoring.
Company news also covers business development appointments, international manufacturing and product-development capabilities, capital-structure actions such as preferred stock conversion, conference presentations and strategic acquisition activity. These announcements reflect Interlink's single operating focus on designing, developing and manufacturing sensor technologies and integrated sensing systems.
Interlink Electronics (LINK) will exhibit its sensing technologies at the Electronica and Medica trade fairs in Germany in November 2026. Electronica runs November 10–13 in Munich, where the company will present its sensor portfolio and custom solutions at booth B4 223. Declan Flannery, Vice President of Force Sensing Solutions, will give a presentation on November 12 at 1:40 pm on the Smart Mobility Stage in Hall B4.
At Medica, November 16–19 in Düsseldorf, Interlink will showcase medical-grade sensing technologies and healthcare applications, including wearables, at booth 12D54. Engineers and product specialists will offer demonstrations and discuss custom sensor development and integration support at both events.
Interlink Electronics (NASDAQ: LINK) will present at the LD Micro Main Event on October 21, 2026, outlining its growth strategy.
CEO Steven Bronson will present at 10:30 AM PT at the Luxe Sunset Boulevard Hotel in Los Angeles. The company targets $100 million in revenue through organic growth and acquisitions, building on four completed acquisitions and a proposed fifth transaction. Interlink says the pending acquisition could increase pro forma revenue, reflecting the combined businesses, to over USD 45 million, and potentially above USD 50 million upon completion.
Interlink Electronics (LINK) will present and hold investor meetings at the virtual Lytham Partners Fall 2026 Investor Conference on September 29–30, 2026.
The webcast is scheduled for 2:15 p.m. ET on September 29 and will be available for replay afterward.
Interlink Electronics (NASDAQ: LINK) announced it will present at the Moody Capital Solutions 2026 Disruptive Growth & Life Sciences Conference in New York City on September 9–10, 2026. CEO Steven N. Bronson is scheduled to deliver an investor presentation and hold 1-on-1 meetings with investors.
The presentation is set for Thursday, September 10, 2026, at 1:20 p.m. ET at The Westin New York Grand Central, 212 E 42nd St, New York, NY. According to Interlink Electronics, the conference provides a platform to highlight its sensor and printed electronics technologies and discuss its growth story with the investment community.
Interlink Electronics (Nasdaq: LINK) will participate in a webcast presentation at the Lytham Partners 2026 Consumer & Technology Investor Summit, held virtually on Tuesday, August 18, 2026. The company’s webcast is scheduled for 11:30 a.m. ET and can be accessed via the conference home page or directly at the provided Lytham Partners links, with a replay available through the same URLs.
Interlink Electronics (Nasdaq: LINK) reported Q2 2026 revenue of $3.77 million, up 10.4% from $3.41 million in Q2 2025. First-half 2026 revenue rose 12.6% to $6.84 million. Growth was driven by higher shipments of force-sensing and printed electronics, partially offset by weaker gas-sensor sales.
Q2 2026 gross margin was 44.4% versus 45.0% a year earlier, while first-half gross margin improved to 44.0% from 40.9%. Net income in Q2 increased to $248,000 (earnings per diluted share of $0.02), compared with $100,000 in Q2 2025. For the first half, net loss narrowed to $90,000 from $705,000.
Adjusted EBITDA reached $421,000 in Q2 2026 and $255,000 for the first half, versus $323,000 and $(300,000) in the prior-year periods. The company expects its strategic acquisition announced in May 2026 to close by end of October 2026, subject to customary conditions, and is exploring debt financing. Cash and equivalents were $1.83 million at June 30, 2026, down from $2.72 million at December 31, 2025.
Interlink Electronics (Nasdaq: LINK) announced selection for inclusion in the Russell Microcap Index, effective after US markets open on June 29, 2026.
According to Interlink, this milestone supports its growth strategy, may boost visibility with institutional investors, and aligns with its focus on sustainable, profitable growth and shareholder value.
Interlink Electronics (Nasdaq: LINK) reported Q1 2026 revenue of $3.07 million, up 15% year over year, driven by higher force-sensing and printed electronics shipments. Gross margin rose to 43.5% from 35.6%.
According to Interlink Electronics, Q1 2026 net loss improved to $338,000 from $805,000, and adjusted EBITDA to $(168,000) from $(623,000). The company signed a non-binding LOI to acquire a high-performance manufacturing provider, is supporting electrodes for connected testing platforms heading toward clinical trials, is developing a third-generation wearable using its conductive transfer process, and plans a new R&D and production facility in South Yorkshire, England in July 2026.
Interlink Electronics (NASDAQ: LINK) will present at the LD Micro Invitational XVI in Los Angeles. CEO Steven N. Bronson is scheduled to present on Tuesday, May 19, 2026 at 1:30 pm PDT at the Luxe Sunset Boulevard Hotel.
The two-day event, held May 18-19, 2026, features micro and small-cap companies across all sectors, each presenting in half-hour increments and meeting privately with investors.
Interlink Electronics (Nasdaq: LINK) signed a non-binding letter of intent for a potential strategic acquisition of a high-performance manufacturing solutions provider serving semiconductor, defense, laser/photonics, commercial high-tech and aerospace sectors.
The target reportedly generated over $33 million revenue and about $4 million EBITDA in 2025.
Financing is expected to combine new debt and equity issued at $5–$10 per share, subject to final terms.