Interlink Electronics to Present at LD Micro Main Event XIX

Rhea-AI Summary

Interlink Electronics (Nasdaq: LINK) will present at LD Micro Main Event XIX in San Diego on Oct 19-21, 2025, with Chairman & CEO Steven N. Bronson presenting on Oct 20 at 1:00 PM PT and hosting one-on-one investor meetings Oct 20–21. A live webcast and replay will be available.

Recent milestones to be discussed include a $200,000 FDA SBIR grant for electrochemical food-safety sensors, a signed letter of intent to acquire a U.K. engineering and manufacturing company, and the conversion of all Series A preferred stock into common stock to simplify capital structure.

Insights

Corporate Strategy & M&A Analyst

Participation at LD Micro highlights modest near-term catalysts: a small federal grant, an LOI for an acquisition, and capital-structure cleanup.

Interlink shows three concrete actions that can affect value creation: a FDA SBIR grant of $200,000 to advance electrochemical food‑safety sensors, a signed Letter of Intent to acquire a U.K. engineering and manufacturing firm, and conversion of all Series A preferred shares into common stock. The grant funds targeted R&D work and validates a technical path; the LOI signals a planned expansion of European manufacturing capabilities; the capital conversion removes a structural equity overhang and aligns share classes.

Each milestone carries clear dependencies and execution risk. The grant amount is modest relative to product development needs and does not guarantee regulatory clearance or commercial adoption. The LOI is non‑binding; completion depends on due diligence, terms, and closing conditions. The capital conversion reduces complexity but may have diluted ownership effects that are not quantified here. Watch for a signed acquisition agreement and closing timeline, any announced purchase price or financing terms, and management commentary or technical milestones tied to the Oct. 20, 2025 presentation and subsequent one‑on‑one meetings for near‑term detail; expect material updates or firm milestones within the next few months as diligence and integration planning proceed.

FREMONT, Calif., Oct. 16, 2025 (GLOBE NEWSWIRE) -- Interlink Electronics, Inc. (Nasdaq: LINK) (“Interlink” or the “Company”), a global leader in sensor technology and printed electronic solutions, today announced its participation at the LD Micro Main Event XIX on October 19-21, 2025, at the Hotel del Coronado in San Diego, California.

Interlink Chairman and CEO, Steven N. Bronson, is scheduled to present on Monday, October 20, at 1:00 p.m. Pacific Time (PT). A live webcast of the presentation, with a replay available, can be accessed here. In addition, Bronson will host one-on-one meetings with investors during the conference on October 20 and 21.

Bronson will discuss Interlink’s strategic growth initiatives and recent milestones, including:

• FDA SBIR Grant – A recently awarded $200,000 grant to advance development of electrochemical sensors for food safety applications. These next-generation sensors are designed to integrate with AI-driven analytics platforms, enabling faster, more accurate detection of contaminants and helping address one of the largest challenges in food safety and quality assurance.
  
  
• M&A Pipeline Expansion – A signed Letter of Intent to acquire a U.K.-based engineering and manufacturing company, strengthening Interlink’s European footprint and capabilities alongside its 2023 acquisition of Calman Technology.
  
  
• Capital Structure Simplification – The recent conversion of all Series A Preferred Stock into Common Stock, eliminating an overhang and enhancing alignment with shareholders.
  
  

Together, these milestones reflect Interlink’s focus on innovation, disciplined M&A, and operational scale, positioning the Company for sustained growth and momentum heading into 2026.

For additional information or to schedule a one-on-one meeting with Interlink management, please contact the Gateway team at LINK@IESensors.com.

About Interlink Electronics, Inc.
Interlink Electronics is a leading provider of sensors and printed electronic solutions, boasting 40 years of success in delivering mission-critical technologies across diverse markets. Our customers, including global blue-chip companies, trust our products and solutions, which span various markets, including medical, industrial, automotive, wearables, IoT, and other specialty markets. Our expertise in materials science, manufacturing, embedded electronics, firmware, and software enables us to create custom solutions tailored to our customers’ unique needs.

We serve our international customer base from our corporate headquarters and proprietary gas sensor production and product development facility in Fremont, California (Silicon Valley area); our Global Product Development and Materials Science Center and distribution and logistics center in Camarillo, California; and our advanced printed-electronics manufacturing facilities in Shenzhen, China; Irvine, Scotland; and Barnsley, England. For more information, please visit www.InterlinkElectronics.com.

Forward Looking Statements
This release contains “forward-looking statements” within the meaning of the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements can be generally identified by phrases such as “thinks,” “anticipates,” “believes,” “estimates,” “expects,” “intends,” “plans,” and similar words. Forward-looking statements in our press releases include statements about our projected financial and operating performance, our acquisition program, our strategy and prospects, and our opportunities for organic growth and synergies. Forward-looking statements are not guarantees of future performance and are inherently subject to uncertainties and other factors which could cause actual results to differ materially from the forward-looking statement. Such statements are based upon, among other things, assumptions made by, and information currently available to, management, including management’s own knowledge and assessment of the company’s industry, R&D initiatives, competition and capital requirements. Other factors and uncertainties that could affect the company’s forward-looking statements include, among other things, the following: our success in predicting new markets and the acceptance of our new products; efficient management of our infrastructure; the pace of technological developments and industry standards evolution and their effect on our target product and market choices; the effect of outsourcing technology development; changes in the ordering patterns of our customers; a decrease in the quality and/or reliability of our products; protection of our proprietary intellectual property; competition by alternative sophisticated as well as generic products; continued availability of raw materials for our products at competitive prices; disruptions in our manufacturing facilities; risks of international sales and operations including fluctuations in exchange rates and tariffs; compliance with regulatory requirements applicable to our manufacturing operations; and customer concentrations. Additional factors that could cause actual results to differ materially from those anticipated by our forward-looking statements are described under the captions “Risk Factors” and “Management’s Discussion and Analysis of Financial Condition and Results of Operations” in our most recent Annual Report (Form 10-K) or Quarterly Report (Form 10-Q) filed with the Securities and Exchange Commission. Forward-looking statements are made as of the date of the respective release, and we expressly disclaim any obligation to publicly update or revise any forward-looking statements, whether as a result of new information, future events or otherwise.

Company Contact:
Interlink Electronics, Inc.
Steven N. Bronson, CEO
LINK@IESensors.com
805-623-4184

Investor Relations Contact:
Gateway Group, Inc.
Matt Glover and Clay Liolios
LINK@IESensors.com
949-574-3860

FAQ

When will Interlink Electronics (LINK) present at LD Micro Main Event XIX?

Steven N. Bronson will present on October 20, 2025 at 1:00 PM PT.

How can investors watch Interlink Electronics (LINK) presentation at LD Micro on October 20, 2025?

A live webcast will be available with a replay accessible after the presentation.

What grant did Interlink Electronics (LINK) announce ahead of its Oct 2025 presentation?

Interlink announced a $200,000 FDA SBIR grant to advance electrochemical sensors for food safety applications.

What M&A update will Interlink (LINK) discuss at LD Micro Main Event XIX?

Interlink has a signed Letter of Intent to acquire a U.K.-based engineering and manufacturing company to expand its European footprint.

What capital-structure change did Interlink Electronics (LINK) recently complete?

The company converted all Series A preferred stock into common stock to remove an overhang and align with shareholders.