Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers

Microchip Technology (Nasdaq:MCHP) introduced 3.3 kV HV‑D3 mSiC power modules aimed at solid‑state transformers (SSTs) for AI hyperscale data centers and other high‑voltage systems.

Rhea-AI Summary

Microchip Technology (Nasdaq:MCHP) introduced 3.3 kV HV‑D3 mSiC power modules aimed at solid‑state transformers (SSTs) for AI hyperscale data centers and other high‑voltage systems.

The 62 mm modules integrate SiC MOSFETs and Schottky diodes, support 6 kV isolation, target 100–300A applications and are designed to improve efficiency, thermal performance and power density in grid‑to‑rack power delivery and industrial, transportation and defense power markets.

Argus May 26 session

+4.94% close to close Open Argus

Details

News Market Reaction – MCHP

On May 26, the day this news came out, MCHP closed 4.94% above the previous close.

Data tracked by StockTitan Argus for the May 26 session.

Key Figures

Module voltage rating: 3.3 kV Isolation rating: 6 kV CTI rating: CTI 600 +5 more

Module voltage rating

3.3 kV

HV‑D3 mSiC power modules for solid-state transformers

Isolation rating

6 kV

Module packaging isolation capability

CTI rating

CTI 600

Creepage and insulation material rating

Current range

100–300A

Targeted product current range for industrial gap

Grid interface voltages

13.8 kV and 34.5 kV

Intended medium-voltage grid levels for SSTs

Experience in SiC

Over 20 years

Company history in SiC devices and power solutions

200-day MA

69.93

Pre-news 200-day moving average for MCHP

Price vs 52-week high

-11.78%

Distance from 52-week high of 105.91

Previous AI Reports

5 past events · Latest: Apr 23

Same Type 5 events

1. Apr 23

   AI timing module launch

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2. Apr 14

   AI power DSC expansion

   24h Move

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   Expanded dsPIC33A controllers targeting AI data center power and intelligent sensing.

3. Feb 10

   Edge AI solutions

   24h Move

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   Unveiled full-stack edge AI solutions for real-time inferencing on MCUs and MPUs.

4. Feb 03

   AI power module launch

   24h Move

   -1.8%

   Launched compact MCPF1525 power module aimed at AI and high-performance compute.

5. Dec 01

   AI conference presentation

   24h Move

   +6.1%

   Announced presentation at UBS Global Technology and AI Conference 2025.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Key Terms

solid-state transformers, silicon carbide, mosfet, schottky diodes, +4 more

8 terms

solid-state transformers technical

"the adoption of solid-state transformers (SSTs) in AI hyperscale data centers"

A solid-state transformer is an electrical device that uses power electronics instead of heavy metal coils to change voltage and steer electricity, acting like a digitally controlled, much lighter version of a traditional transformer. For investors, it matters because these units can boost efficiency, add fast remote control and protection features, and enable modern grid uses — such as electric-vehicle charging and renewable energy integration — which can change infrastructure costs and create new technology markets.

silicon carbide technical

"3.3 kV silicon carbide (SiC) mSiC® MOSFETs and Schottky diodes"

Silicon carbide is a hard, durable material made from silicon and carbon, often used in industrial applications like cutting tools and electronics. Its ability to withstand high temperatures and conduct electricity efficiently makes it valuable in manufacturing advanced electronic devices. For investors, companies working with silicon carbide are seen as key players in the growing market for high-performance electronics and energy-efficient technologies.

mosfet technical

"mSiC MOSFET technology, which offers highly competitive RDS(on) stability"

A MOSFET is a tiny electronic switch used to control the flow of electricity in chips and circuits, functioning like a faucet that turns current on or off and adjusts how much passes through. Investors watch MOSFETs because their performance, cost and availability affect product power efficiency, manufacturing yields and supply chains for industries from consumer electronics to electric vehicles, which in turn can influence companies’ margins and growth prospects.

schottky diodes technical

"mSiC® MOSFETs and Schottky diodes in an industry‑standard 62 mm package"

A Schottky diode is a one-way electronic valve made from a metal-to-semiconductor connection that lets current pass with very little energy loss and responds faster than ordinary diodes. Investors care because these diodes improve efficiency and speed in power supplies, chargers and high-frequency electronics; changes in demand, manufacturing costs or supply shortages can affect product performance, margins and the earnings of companies that make or use them.

rds(on) technical

"mSiC MOSFET technology, which offers highly competitive RDS(on) stability"

rds(on) is the electrical resistance of a power transistor (usually a MOSFET) when it is switched fully on; think of it as how narrow a pipe the current must flow through. Lower rds(on) means less energy lost as heat, better efficiency, and less cooling or larger batteries required. Investors watch rds(on) because it influences product performance, power consumption, component cost and reliability — all of which can affect margins and competitive position.

silicon nitride technical

"A silicon nitride (Si₃N₄) substrate delivers enhanced thermal conductivity"

A very hard, lightweight ceramic material made from silicon and nitrogen that resists heat, wear and corrosion. Think of it as industrial-grade pottery that can take extreme conditions where metals or plastics would fail. For investors, its use in high-performance bearings, engine parts, electronics and medical implants can signal exposure to premium, durable products, specialized manufacturing margins and markets with long-term replacement cycles.

si₃n₄ technical

"A silicon nitride (Si₃N₄) substrate delivers enhanced thermal conductivity"

A hard, heat-resistant ceramic made of silicon and nitrogen (chemical formula Si3N4). Think of it as an advanced, high-temperature substitute for metal that keeps its strength and wears slowly under stress; it’s used in bearings, engine parts, cutting tools, semiconductor components, and certain medical implants. Investors track its demand and supply because shifts in usage or availability can affect costs, manufacturing choices, and profit margins across industries like aerospace, automotive, electronics and energy.

pmbus technical

"It includes PMBus™ and I2C programmability, on-board EEPROM"

PMBus (Power Management Bus) is an open digital communication protocol used to monitor and control power supplies and power-management chips inside electronic systems. It matters to investors because PMBus-enabled products let manufacturers remotely read voltage, current and temperature and adjust power settings, improving reliability, shortening development time and enabling smarter features—like a dashboard and remote controls for a device’s power system— which can influence product competitiveness and sales.

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New silicon carbide modules deliver the required thermal performance and efficiency for SSTs to increase power available for token generation

CHANDLER, Ariz., May 26, 2026 (GLOBE NEWSWIRE) -- Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV‑D3 mSiC^® Power Modules, designed to simplify and accelerate the adoption of solid-state transformers (SSTs) in AI hyperscale data centers and other high‑voltage power applications. The new modules integrate 3.3 kV silicon carbide (SiC) mSiC^® MOSFETs and Schottky diodes in an industry‑standard 62 mm package, enabling efficient power delivery from the medium‑voltage grid directly to the server rack.

As AI data centers continue to scale, token generation is limited by power availability, while efficiency is a defining factor for return on investment. Traditional architectures based on bulky, low‑frequency transformers add complexity, increase losses and limit flexibility. Solid-state transformers represent a foundational shift in power delivery, reducing conversion stages and enabling higher system efficiency. The industry's shift toward higher-voltage DC rack distribution in next-generation AI facilities further amplifies the value of SSTs, which are intended to deliver regulated DC directly from the medium-voltage grid with fewer conversion stages.

Microchip’s HV‑D3 mSiC modules are engineered specifically to meet these requirements. The modules use Microchip’s mSiC MOSFET technology, which offers highly competitive R_DS(on) stability over temperature, with packaging that supports 6 kV isolation, incorporates CTI 600‑rated materials and features extended creepage distances, designed to allow safe series connection for high‑voltage operation. A silicon nitride (Si₃N₄) substrate delivers enhanced thermal conductivity and power‑cycling capability, helping designers achieve higher power density with less aggressive cooling.

“As AI datacenters continue to push limits in supplying power from the grid to the GPU, the need for solid-state transformers becomes increasingly important,” said Clayton Pillion, vice president of Microchip’s high-power solutions business unit. “Our 3.3 kV HV-D3 mSiC power modules enable designers to reduce the number of series connected devices by roughly half versus lower-voltage SiC alternatives when interfacing to 13.8 kV or 34.5 kV grids. The devices also address a key gap in the industrial market for 100–300A products, bridging discrete SiC devices and much larger power modules.”

The HV‑D3 mSiC power modules are available in half‑bridge and common‑source configurations, with and without anti‑parallel Schottky diodes, addressing applications in the 100-300A range. Microchip’s mSiC MOSFET technology, offers balanced switching losses for both hard‑switched and soft‑switched topologies, making the devices well suited for SST designs and other high‑frequency, high‑voltage systems.

While optimized for solid-state transformers in AI data centers, the HV‑D3 mSiC power modules also address a wide range of applications, including megawatt charging infrastructure for heavy‑duty vehicles, auxiliary power supplies for rail/heavy transportation, medium‑voltage motor drives, industrial and defense power systems. These markets benefit from the same combination of high isolation, thermal robustness, and efficient power conversion.

Microchip has over 20 years of experience in the development, design, manufacturing and support of SiC devices and power solutions, to help customers adopt SiC with ease, speed and confidence. The company’s mSiC products and solutions are designed to provide lower system cost, faster time to market and lower risk. Microchip offers a broad and flexible portfolio of SiC diodes, MOSFETs and gate drivers. For more information, visit www.microchip.com/sic.

Development Tools

The 3.3 kV power modules are supported by an application note, design guide, device and simulation models for rapid prototyping. Additionally, Microchip provides global technical support, design services and field application engineering support.

Pricing and Availability

The 3.3 kV mSiC power modules are available to purchase in production quantities. You can purchase directly from Microchip or contact a Microchip sales representative or authorized worldwide distributor.

Resources

High-res images available through Flickr or editorial contact (feel free to publish):

• Application image: www.flickr.com/photos/microchiptechnology/55264371024/sizes/l

About Microchip Technology:
Microchip Technology Inc. is a broadline supplier of semiconductors committed to making innovative design easier through total system solutions that address critical challenges at the intersection of emerging technologies and durable end markets. Its easy-to-use development tools and comprehensive product portfolio supports customers throughout the design process, from concept to completion. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support and delivers solutions across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. For more information, visit the Microchip website at www.microchip.com. 

Note: The Microchip name and logo, the Microchip logo and mSiC are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are the property of their respective companies.

Editorial Contact:
Kim Dutton
480-792-4386
kim.dutton@microchip.com

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

What did Microchip (Nasdaq:MCHP) announce on May 26, 2026 about 3.3 kV mSiC power modules?

Microchip announced 3.3 kV HV‑D3 mSiC power modules designed for solid-state transformers and high-voltage systems. According to Microchip, these 62 mm SiC-based modules target AI data centers and industrial applications needing efficient, high-isolation grid-to-load power conversion in the 100–300A range.

How do Microchip’s 3.3 kV HV‑D3 mSiC modules support AI data center solid-state transformers for MCHP investors?

The modules are designed to enable solid-state transformers that deliver regulated DC from medium-voltage grids directly to server racks. According to Microchip, they can reduce series-connected devices versus lower-voltage SiC, helping address power, efficiency and density demands in next-generation AI facilities.

What technical features distinguish Microchip’s 3.3 kV mSiC power modules for high-voltage applications?

Microchip’s HV‑D3 modules integrate mSiC MOSFETs and optional anti-parallel Schottky diodes in a 62 mm package. According to Microchip, they offer 6 kV isolation, CTI 600-rated materials, extended creepage distances and a silicon nitride substrate for enhanced thermal conductivity and power-cycling capability.

Which current and topology ranges do Microchip’s HV‑D3 mSiC power modules target?

The 3.3 kV HV‑D3 mSiC modules address applications in the 100–300A range. According to Microchip, they are offered in half-bridge and common-source configurations, with balanced switching losses for both hard-switched and soft-switched topologies suitable for high-frequency, high-voltage systems.

Beyond AI data centers, what markets can use Microchip’s 3.3 kV mSiC power modules (MCHP)?

These modules target megawatt charging for heavy-duty vehicles, auxiliary rail and transportation power, medium-voltage motor drives and industrial and defense systems. According to Microchip, these markets benefit from the modules’ high isolation, thermal robustness and efficient power-conversion characteristics.

Are Microchip’s 3.3 kV HV‑D3 mSiC power modules for MCHP available now and what support is offered?

The 3.3 kV mSiC power modules are available in production quantities for purchase from Microchip and distributors. According to Microchip, support includes an application note, design guide, device and simulation models, plus global technical support and field application engineering services.