SST and UMC Announce Immediate Availability of 28nm SuperFlash® Gen 4 Automotive Grade 1 Platform

Rhea-AI Summary

Microchip subsidiary SST (Nasdaq: MCHP) and UMC announced completion of full qualification and release to production for SST’s embedded SuperFlash Gen 4 (ESF4) with automotive Grade 1 (AEC Q-100 Grade 1) capability on UMC’s 28HPC+ process (Jan 15, 2026). ESF4 delivers read access <12.5ns, >100K endurance cycles, data retention >10 years @125°C, and requires only 1-bit ECC. A 32Mb macro passed AG1 conditions with zero bit failures and peak yield reached 100%.

This production-ready 28nm eNVM aims to help automotive controller makers migrate from 40nm ESF3 to a lower-cost, higher-performance node with fewer masking steps and OTA-capable firmware support.

Positive

• Full production release of ESF4 on 28HPC+
• AEC Q-100 Grade 1 qualified for -40°C to +150°C
• Read access time 12.5ns
• 100K+ endurance cycles and >10-year data retention @125°C
• 32Mb macro qualified at AG1 with zero bit failures
• Peak manufacturing yield reached 100%

Negative

• AG1 qualification shown for a 32Mb macro only, larger densities not reported

News Market Reaction – MCHP

-0.31%

1 alert

-0.31% News Effect

On the day this news was published, MCHP declined 0.31%, reflecting a mild negative market reaction.

Data tracked by StockTitan Argus on the day of publication.

Key Figures

AEC-Q100 Grade 1 temp: -40°C to +150°C Read access time: < 12.5ns Endurance cycles: 100K+ +5 more

8 metrics

AEC-Q100 Grade 1 temp -40°C to +150°C Automotive Electronics Council Q-100 Grade 1 qualification

Read access time < 12.5ns SuperFlash ESF4 read performance on 28HPC+ platform

Endurance cycles 100K+ Program/erase endurance for ESF4 AG1 platform

Data retention > 10 years @ 125°C Non-volatile data retention specification

ECC requirement Only 1-bit ECC Error correction required for ESF4 AG1 operation

Macro capacity 32Mb Qualified ESF4 macro size at auto grade 1

Peak yield 100% Peak yield achieved for qualified 32Mb macro

Fabs capacity 400,000 wafers/month Total 12-in equivalent capacity across UMC fabs

Market Reality Check

Price: $77.69 Vol: Volume 5,255,431 is below...

low vol

$77.69 Last Close

Volume Volume 5,255,431 is below the 20-day average of 7,611,211 ahead of this news. low

Technical Shares at $74.68 trade above the 200-day MA of $61.96 and are 3.26% below the 52-week high of $77.20.

Peers on Argus

Peers show mixed moves: NXPI up 1.77%, MPWR up 0.31%, while ALAB, STM, and CRDO ...

1 Up

Peers show mixed moves: NXPI up 1.77%, MPWR up 0.31%, while ALAB, STM, and CRDO are down. Only one peer (ASX, up 4.08%) appears in the momentum scanner, suggesting this automotive eNVM announcement is more stock-specific than sector-driven.

Historical Context

5 past events · Latest: Jan 13 (Positive)

Pattern 5 events

Date	Event	Sentiment	Move	Catalyst
Jan 13	Defense product launch	Positive	+0.9%	Launch of JANPTX TVS family for aerospace and defense protection needs.
Jan 08	AI firmware release	Positive	-0.6%	Custom MEC1723 firmware enabling secure control for NVIDIA DGX Spark systems.
Jan 05	Business update	Positive	+3.1%	Q3 FY26 net sales outlook raised above prior guidance range.
Dec 08	Conference presentation	Positive	-0.7%	Upcoming presentation at Barclays Global Technology Conference announced.
Dec 03	Power monitor launch	Positive	+12.2%	Introduction of PAC1711/1811 low‑power digital power monitors.

Pattern Detected

Product and business updates have generally produced modestly positive reactions, with occasional divergences on similar positive news.

Recent Company History

Over the last few months, Microchip has released a series of product and business updates. On Dec 3, it launched ultra‑low‑power digital power monitors, followed by a Barclays technology conference appearance on Dec 11. A bullish Q3 FY26 business update on Jan 5 highlighted improving sales and backlog. Subsequent launches for NVIDIA DGX Spark support on Jan 8 and military‑qualified TVS devices on Jan 13 reinforced its focus on industrial, AI, and defense. Today’s automotive‑grade 28nm SuperFlash platform extends this trajectory into advanced automotive controllers.

Market Pulse Summary

This announcement highlights Microchip’s push into advanced automotive controllers via SST’s SuperFl...

Analysis

This announcement highlights Microchip’s push into advanced automotive controllers via SST’s SuperFlash Gen 4 on UMC’s 28HPC+ platform, offering AEC Q-100 Grade 1 reliability and key metrics like 100K+ endurance cycles and >10 years retention at 125°C. Recent history shows steady news flow across power management, aerospace/defense, and AI. Investors may track design wins on this 28nm automotive platform, the mix of automotive revenue within overall sales, and any follow-on disclosures in future business updates or SEC filings.

Key Terms

embedded non-volatile memory, high-k/metal-gate, aec q-100, ecc, +2 more

6 terms

embedded non-volatile memory technical

"deliver enhanced embedded non-volatile memory (eNVM) performance and demonstrated reliability"

Embedded non-volatile memory is storage that is built directly into a chip or device and keeps data even when power is turned off, like a notebook that holds notes without needing electricity. For investors, its presence and quality affect a product’s features, reliability, manufacturing cost and supply chain risk, which in turn influence competitiveness, margins and long-term revenue potential.

high-k/metal-gate technical

"versus other foundries’ 28nm High-k/Metal-Gate Stack (HKMG) eFlash offerings"

A high-k/metal-gate is a modern transistor construction that replaces the older silicon gate and thin oxide with a thicker, higher-quality insulating layer (the “high-k” material) and a metal gate on top. That change reduces unwanted current leakage and lets manufacturers make smaller, faster, and more energy-efficient chips. For investors it matters because the technology affects performance, power use, production cost and yield, influencing competitiveness and capital spending.

aec q-100 regulatory

"Automotive Electronics Council (AEC) Q-100 Grade 1 qualified for temperatures"

AEC Q-100 is an industry standard that specifies durability and stress tests for semiconductor chips used in automotive applications, essentially a certification that a chip can survive the heat, vibration and electrical stress found in cars. For investors, seeing this qualification on a supplier’s parts is like seeing a safety stamp on a product: it reduces the risk of failures, opens access to the large auto market, and can be a key competitive advantage for revenue and contract wins.

ecc technical

"Only 1-bit ECC required"

An earnings conference call (ECC) is a live audio presentation where a company’s leaders discuss recent financial results and answer questions from analysts and investors. Think of it as a post-game locker-room briefing that explains what happened, why it mattered, and what management expects next; investors listen for explanations, tone, and new details that can change the stock’s outlook.

over-the-air (ota) update technical

"firmware that requires over-the-air (OTA) update flexibility"

A over-the-air (OTA) update is a remote software or firmware change delivered wirelessly to devices — like updating apps on a phone but for cars, smart appliances, or networked equipment. Investors care because OTA updates allow companies to fix bugs, add features, improve security, and extend a product’s useful life without physical recalls, which can reduce costs, protect brand value, and create ongoing service revenue opportunities.

iatf 16949 regulatory

"all of them are certified with IATF 16949 automotive quality standard"

An international quality management standard for companies that design and make parts for vehicles, built on a widely used quality framework and tailored to the automotive industry. Like a detailed recipe and inspection checklist that suppliers must follow, it signals consistent production, fewer defects, and eligibility for major auto contracts — information investors use to judge operational reliability, risk of costly recalls, and potential for steady revenue.

AI-generated analysis. Not financial advice.

SST’s innovative ESF4 delivers full auto grade 1 performance and reliability for automotive controllers on UMC’s 28HPC+ process platform while using significantly fewer masking steps

SAN JOSE, Calif. and HSINCHU, Taiwan, Jan. 15, 2026 (GLOBE NEWSWIRE) -- As the automotive industry requirements for increasingly performant vehicle controllers relentlessly drives ahead, Silicon Storage Technology^® (SST^®), a subsidiary of Microchip Technology Inc., (Nasdaq: MCHP) and United Microelectronics Corporation (NYSE: UMC: TWSE: 2303)(“UMC”), a leading global semiconductor foundry, announced today that they have completed full qualification and release to production of SST’s embedded SuperFlash^® Gen 4 (ESF4) with full automotive grade 1 (AG1) capability on UMC’s 28HPC+ foundry process platform.

SST developed ESF4 in close partnership with UMC to deliver enhanced embedded non-volatile memory (eNVM) performance and demonstrated reliability for automotive controllers while simultaneously significantly reducing the number of additional masking steps versus other foundries’ 28nm High-k/Metal-Gate Stack (HKMG) eFlash offerings, bringing customers cost advantages and greater manufacturing efficiency.

Customers currently manufacturing automotive controller products using foundry 40nm ESF3 AG1 platforms are encouraged to explore the UMC 28nm ESF4 AG1 platform as they look to scale to the next process node.

“As automotive requirements accelerate, developers need solutions that drive efficiency, speed up time to market and satisfy stringent industry standards. To meet these needs, UMC and SST have delivered a robust 28nm AG1 solution which is now ready for the production of customer designs,” said Mark Reiten, Vice President of Microchip’s licensing business unit. “UMC has been a valuable partner for SST and SuperFlash innovation, and the companies continue to jointly address the rapidly evolving market requirements and deliver technically and economically advanced offerings.”

“As the automotive industry rapidly advances toward more connected, autonomous, and shared vehicles, the demand for highly reliable data storage and high-capacity data updates continues to grow. This has driven customer demand for scaling SuperFlash to the 28nm process,” said Steven Hsu, Vice President of Technology Development at UMC. “Through our close collaboration with SST, we have successfully launched the ESF4 solution, which has been fully integrated into the widely adopted 28HPC+ platform. This enables our customers to leverage the extensive models and IP available in our portfolio to address key markets while simultaneously scaling to a more advanced process node.”

Key SuperFlash performance and reliability metrics for UMC’s 28HPC+ ESF4 AG1 platform include:

• Automotive Electronics Council (AEC) Q-100 Grade 1 qualified for temperatures of -40°C to +150°C (T_j)
• Read access time < 12.5ns
• 100K+ endurance cycles
• Data retention of > 10 years @ 125°C
• Only 1-bit ECC required
• Qualification of 32Mb macro at auto grade 1 conditions:
  • Zero bit failures (no ECC applied)
  • Peak yield reached 100%

Automotive controller shipment volumes continue to rapidly increase year after year, as the transportation industry demands innovative solutions for a widening variety of vehicle applications. Embedding a performant and highly reliable eNVM for code and data storage within the controller is essential to effectively serve this expanding market. SST’s ESF4 solution on UMC’s 28HPC+ AG1 platform is designed to support customers seeking a solution which may include supporting high-capacity controller firmware that requires over-the-air (OTA) update flexibility.

Pricing and Availability
Customers interested in SST’s SuperFlash technology should access the SST website or contact a regional SST sales executive for details. Those interested in UMC’s technology and offerings should visit the UMC website.

Resources
High-res images available through Flickr or editorial contact (feel free to publish):

• Application image: www.flickr.com/photos/microchiptechnology/54935279586/sizes/o/
  

About Microchip Technology:
Microchip Technology Inc. is a broadline supplier of semiconductors committed to making innovative design easier through total system solutions that address critical challenges at the intersection of emerging technologies and durable end markets. Its easy-to-use development tools and comprehensive product portfolio supports customers throughout the design process, from concept to completion. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support and delivers solutions across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. For more information, visit the Microchip website at www.microchip.com

About Silicon Storage Technology (SST):
Microchip Technology’s SST subsidiary is a leading provider of embedded flash technology. SST develops, designs, licenses and markets a diversified range of proprietary and patented SuperFlash memory technology solutions for the consumer, industrial, automotive and Internet of Things (IoT) markets. SST was founded in 1989, went public in 1995 and was acquired by Microchip in April 2010. SST is now a wholly owned subsidiary of Microchip and is headquartered in San Jose, Calif. For more information, visit the SST website at www.sst.com.

About UMC:
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC's 12-in and 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has a total of 12 fabs in production with combined capacity of more than 400,000 wafers per month (12-in equivalent), and all of them are certified with IATF 16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with a worldwide total of 20,000 employees. For more information, please visit: www.umc.com.

Note: The Microchip name and logo, the Microchip logo, Silicon Storage Technology, SST and SuperFlash are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are the property of their respective companies.

Note from UMC Concerning Forward-Looking Statements: Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.

SST Editorial Contact:
Brian Thorsen
480-792-7182
Brian.Thorsen@microchip.com

UMC Media Contact:
Michelle Yun
886-2-2658-9168 x16951
michelle_yun@umc.com

This press release was published by a CLEAR® Verified individual.

FAQ

What did Microchip (MCHP) and UMC announce on January 15, 2026 about ESF4?

SST and UMC announced full qualification and production release of ESF4 SuperFlash on UMC 28HPC+ with automotive Grade 1 capability.

What are the key reliability specs of ESF4 on UMC 28HPC+ (MCHP)?

Key specs include AEC Q-100 Grade 1 (-40°C to +150°C), read <12.5ns, >100K endurance cycles, and >10-year retention @125°C.

Does the ESF4 28nm platform support automotive production for controller makers (MCHP)?

Yes — ESF4 on UMC 28HPC+ is production-ready and intended to help customers migrate from 40nm ESF3 to 28nm.

What error correction and yield results were reported for the ESF4 28nm AG1 platform?

The platform requires only 1-bit ECC; a 32Mb macro passed AG1 with zero bit failures and peak yield reached 100%.

How can customers access SST SuperFlash ESF4 details and availability (MCHP)?

Customers should visit the SST or UMC websites or contact regional SST/UMC sales representatives for pricing and availability.