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Media Tek Inc - MDTKF STOCK NEWS

Welcome to our dedicated news page for Media Tek (Ticker: MDTKF), a resource for investors and traders seeking the latest updates and insights on Media Tek.

Our selection of high-quality news articles is accompanied by an expert summary from Rhea-AI, detailing the impact and sentiment surrounding the news at the time of release, providing a deeper understanding of how each news could potentially affect Media Tek's stock performance. The page also features a concise end-of-day stock performance summary, highlighting the actual market reaction to each news event. The list of tags makes it easy to classify and navigate through different types of news, whether you're interested in earnings reports, stock offerings, stock splits, clinical trials, fda approvals, dividends or buybacks.

Designed with both novice traders and seasoned investors in mind, our page aims to simplify the complex world of stock market news. By combining real-time updates, Rhea-AI's analytical insights, and historical stock performance data, we provide a holistic view of Media Tek's position in the market.

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MediaTek (MDTK) Chairman Ming-Kai Tsai awarded IEEE Robert N. Noyce Medal for outstanding contributions to the semiconductor industry
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MediaTek introduces the Dimensity 8300 chipset, a power-efficient and high-performance SoC designed for premium 5G smartphones. The chipset boasts generative AI capabilities, low-power savings, adaptive gaming technology, and fast connectivity. It features an octa-core CPU with 20% faster CPU performance and 30% peak gains in power efficiency compared to the previous generation. The Mali-G615 MC6 GPU upgrade provides up to 60% greater performance and 55% better power efficiency. The chipset supports full generative AI and 14-bit HDR-ISP Imagiq 980 for enhanced photography and video capturing. It also offers advanced power savings enhancements for gaming and ultra-fast 5G speeds with a 3GPP Release-16 standard modem. The Dimensity 8300 will power 5G devices launching in the global market before the end of 2023.
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MediaTek (MDTK) debuts RedCap modem technology and chipset family to expedite the transition to 5G-NR for consumer, enterprise, and industrial IoT applications. The new solutions, the M60 modem IP and the MediaTek T300 chipset series, will facilitate the transition to 5G-NR for a wide range of applications that require long-lasting and efficient battery life. RedCap, designed to bring the benefits of 5G to NR consumer, enterprise, and industrial devices, promises reliability for devices with low bandwidth requirements, offering many benefits of 5G without the cost and complexity of typical 5G solutions.
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MediaTek Introduces Filogic 860 and Filogic 360 Wi-Fi 7 Chipsets for Peak Performance and Always-On Reliability
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MediaTek | MediaTek-powered devices win first-annual 'Expect Incredible Awards', showcasing tech advancements. Winners include motorola defy satellite link, OPPO Find N2 Flip, Amazon Echo Show 5, Sony PlayStation VR2, OnePlus Pad, and Logitech Sight.
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MediaTek has announced the Dimensity 9300, its newest flagship mobile chip with an All Big Core design. The chip combines extreme performance with power efficiency and supports on-device generative AI processing. It features the APU 790 AI processor, which improves generative AI performance and energy efficiency. The Dimensity 9300 also offers a boost in GPU performance for mobile gaming and enhances mobile photography and video capture capabilities. It supports Wi-Fi 7 speeds and provides superior security for flagship Android devices. The first smartphones with the Dimensity 9300 will be available by the end of 2023.
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MediaTek's Vice Chairman and CEO Dr. Rick Tsai has been awarded the 2023 Dr. Morris Chang Exemplary Leadership Award by the Global Semiconductor Alliance (GSA). This prestigious recognition highlights Dr. Tsai's remarkable business acumen and influential contributions to the semiconductor industry. Under his leadership, MediaTek has achieved record revenue and expansion in various market segments. Dr. Tsai is also committed to investing in key technologies such as edge AI and automotive.
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MediaTek successfully develops its first chip using TSMC's 3nm technology, with volume production expected next year. TSMC's 3nm process offers up to 18% speed improvement or 32% power reduction compared to its N5 process. MediaTek's flagship Dimensity SoC built with TSMC's 3nm process will empower various devices starting in H2 2024.
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MediaTek partners with Meta to build an edge computing ecosystem for AI application development. MediaTek's use of Llama 2 models enables generative AI applications to run directly on-device, providing advantages such as seamless performance, greater privacy, and lower latency. MediaTek's next-generation flagship chipset will feature optimized software to run Llama 2 and upgraded APU for enhanced performance. Llama 2-based AI applications expected to be available by the end of the year.
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MediaTek has launched its new Dimensity 6000 series along with the Dimensity 6100+ chipset, designed to enhance mainstream 5G devices. The chipset offers premium features and improved power efficiency at an accessible price point. It integrates an enhanced 5G modem, supports AI-powered cameras and 10-bit displays, and reduces power consumption. The first smartphones with the chipset will be available in Q3 2023.
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