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MediaTek develops semiconductor platforms for connected devices, AI computing, mobility, and data-center infrastructure. Company news commonly covers product launches in the Dimensity mobile SoC family, Kompanio processors for Chromebooks, and Genio IoT platforms, with recurring emphasis on on-device AI, connectivity, imaging, gaming, multimedia, and power efficiency.
MediaTek announcements also include technology collaborations with partners in automotive systems, AI computing, optical interconnects, and edge-to-cloud applications. These updates describe custom SoC development, advanced driver-assistance and cockpit systems, MicroLED-based active optical cable designs, and co-designed computing platforms for AI workloads.
MediaTek has unveiled its new M90 5G-Advanced modem at Mobile World Congress 2025, featuring breakthrough connectivity capabilities and AI integration. The modem delivers up to 12Gbps downlink speeds and 20% improved uplink performance with 3GPP Release 17 compliance.
The M90 introduces MediaTek Modem AI (MMAI) technology, which optimizes power consumption and enhances connectivity through AI models. Its Smart Antenna technology achieves 99.5% accuracy in environment identification and increases data throughput by 24%.
Key features include dual 5G SIM support, satellite connectivity (NTN), and MediaTek UltraSave technology reducing power consumption by 18%. The modem has demonstrated impressive performance in trials, achieving 11.6Gbps with Keysight, 5.5Gbps with Verizon and Samsung, and nearly 10Gbps with Telstra and Ericsson. Engineering samples will be available in H2 2025.
MediaTek has launched three new ultra-efficient chipsets: the Dimensity 7400, Dimensity 7400X, and Dimensity 6400. These additions to the Dimensity family are designed to enhance gaming, AI, and connectivity for both high-tech and mainstream mobile devices.
The Dimensity 7400 and 7400X feature an octa-core CPU with 4X Arm Cortex-A78 cores up to 2.6GHz and 4X Arm Cortex-A55 cores up to 2.0GHz, plus an Arm Mali-G615 MC2 GPU. Built on TSMC's 4nm process node, these chipsets use 14% to 36% less power during gaming compared to competitors. They also support MediaTek Advanced Gaming Technology (MAGT) 3.0, AI optimizations, and reduced input lag.
For AI applications, these chipsets integrate MediaTek's NPU 6.0, offering a 15% performance boost over the Dimensity 7300. They also support advanced AI camera features, Google Ultra HDR, and dual display flip phones (7400X). The 5G R16 modem with 3CC carrier aggregation and Tri-band Wi-Fi 6E support ensures fast, reliable connectivity.
The Dimensity 6400 is built on TSMC's 6nm process node and features an octa-core CPU with 2X Arm Cortex-A76 cores up to 2.5GHz and 6X Arm Cortex-A55 cores up to 2.0GHz, plus an Arm Mali-G57 MC2 GPU. It uses up to 19% less power during gaming compared to competitors. Key features include MediaTek Bluetooth Wi-Fi HyperCoex Technology, Release 16 Sub-6 5G Modem, and support for 108MP camera sensors.
The Dimensity 6400 is currently available, while the first smartphones powered by the Dimensity 7400 and 7400X will be available in Q1 2025.
MediaTek announced its collaboration with NVIDIA on the design of the NVIDIA GB10 Grace Blackwell Superchip for Project DIGITS, a personal AI supercomputer. As the world's leading chip supplier for smartphones and smart devices, MediaTek brings its expertise in Arm-based SoC performance and power efficiency to this groundbreaking project.
The collaboration aims to make advanced AI technology more accessible, combining MediaTek's CPU performance and power efficiency with NVIDIA's accelerated computing technologies. This partnership builds on previous joint ventures, including MediaTek's Dimensity Auto Cockpit chips integration with NVIDIA's GPU-accelerated AI computing and RTX graphics.
Additionally, MediaTek has integrated NVIDIA TAO, an AI model training toolkit, with its NeuroPilot SDK to enhance edge AI capabilities for IoT applications. This aligns with MediaTek's vision of bringing AI capabilities across its entire portfolio, including Dimensity, Genio, Pentonic, Kompanio, and Dimensity Auto platforms.
MediaTek announced the winners of its second-annual 'Expect Incredible Awards', recognizing the best MediaTek-powered devices across various categories. The Samsung Galaxy Tab S10 Ultra dominated multiple categories, winning Best Overall, Best in AI, and Best in Computing. The Vivo X100 Pro secured Best in Mobile, while the Archer BE550 won Best in Connectivity and IoT. Amazon Echo Spot claimed Best in Smart Home. Winners were selected by industry analysts and creators, including Counterpoint Research and 91 Mobiles, based on design, performance, and innovation. MediaTek currently powers more than 2 billion devices annually.
MediaTek is set to unveil new products and technologies at COMPUTEX 2024, focusing on AI, Smart TVs, Chromebooks, and IoT. Key highlights include the introduction of two new chipsets: the Kompanio 838 SoC for premium Chromebooks and the Pentonic 800 SoC for 4K smart TVs. These chipsets feature advanced AI processing capabilities for enhanced user experience. Vice Chairman and CEO Dr. Rick Tsai will deliver a keynote on June 4, discussing the role of AI in various sectors. The Kompanio 838 offers improved performance, multitasking, and power efficiency, while the Pentonic 800 enhances video, audio quality, and gaming experience. Both chipsets support the latest connectivity standards, ensuring robust performance for end-users.
MediaTek announced its new Dimensity 7300 and Dimensity 7300X chipsets, designed for high-tech smartphones and foldable devices. These 4nm chips feature octa-core CPUs with Arm Cortex-A78 and Cortex-A55 cores, achieving up to 25% lower power consumption compared to the Dimensity 7050. Enhanced with the Arm Mali-G615 GPU and MediaTek HyperEngine, they offer 20% faster FPS and 20% improved energy efficiency. The 7300X supports dual displays for foldables. They also provide upgraded photography capabilities with the MediaTek Imagiq 950, supporting 200MP cameras, 4K HDR video, and AI-enhanced computing. Key features include 5G UltraSave 3.0+ technology, tri-band Wi-Fi 6E, and dual 5G SIM support.
MediaTek unveiled the Dimensity 9300+, a flagship mobile chip offering increased speeds for generative AI processing, faster LLM inference, and enhanced gaming experiences. With a focus on AI applications, the chip features advanced NeuroPilot technology, support for various LLMs, and on-device LoRA Fusion. It also includes powerful APU 790 AI engine, HyperEngine gaming technologies, and Imagiq 990 ISP for improved photography and videography capabilities. The Dimensity 9300+ integrates a 5G R16 modem for fast and reliable connectivity.
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