3M participates in JOINT3, a next-generation semiconductor packaging consortium
3M (NYSE:MMM) has joined JOINT3, a next-generation semiconductor packaging consortium led by Japan's Resonac Corporation. The consortium focuses on developing panel-level organic interposers, crucial components for advanced semiconductor packaging that connect different parts of electronic devices.
The initiative aims to optimize designs for 515 x 510mm panel-level organic interposers, shifting from traditional circular wafers to square panels to enhance production yield. This technology is particularly important for emerging markets like generative AI and autonomous vehicles, where 2.xD packages are seeing increased demand due to higher data communication requirements.
3M (NYSE:MMM) si è unita a JOINT3, un consorzio di packaging di semiconduttori di nuova generazione guidato dalla Resonac Corporation del Giappone. Il consorzio si concentra sullo sviluppo di interpositori organici a livello pannello, componenti chiave per l'avanzato packaging dei semiconduttori che collegano le diverse parti dei dispositivi elettronici.
L'iniziativa mira a ottimizzare i progetti per interpositori organici a livello pannello di 515 x 510 mm, passando dai tradizionali wafer circolari a pannelli quadrati per aumentare il rendimento di produzione. Questa tecnologia è particolarmente importante per i mercati emergenti come l'AI generativa e i veicoli autonomi, dove i pacchetti 2.xD vedono una crescente domanda a causa delle maggiori esigenze di comunicazione dati.
3M (NYSE:MMM) se ha unido a JOINT3, un consorcio de encapsulado de semiconductores de próxima generación liderado por Resonac Corporation de Japón. El consorcio se centra en desarrollar interposers orgánicos a nivel de panel, componentes cruciales para el embalaje avanzado de semiconductores que conectan las diferentes partes de los dispositivos electrónicos.
La iniciativa tiene como objetivo optimizar el diseño de interposers orgánicos a nivel de panel de 515 x 510 mm, pasando de obleas circulares tradicionales a paneles cuadrados para mejorar el rendimiento de la producción. Esta tecnología es especialmente importante para mercados emergentes como la IA generativa y los vehículos autónomos, donde los paquetes 2.xD están viendo una demanda creciente debido a mayores requisitos de comunicación de datos.
3M (NYSE:MMM)은 일본의 Resonac Corporation이 이끄는 차세대 반도체 패키징 컨소시엄인 JOINT3에 합류했습니다. 이 컨소시엄은 전자기기의 서로 다른 부품을 연결하는 고급 반도체 패키징에 필수적인 패널 단위 유기 인터포저의 개발에 주력합니다.
이 이니셔티브는 515 x 510mm 패널 단위 유기 인터포저 설계를 최적화하는 것을 목표로 하며, 전통적인 원형 웨이퍼에서 제곱형 패널로 전환해 생산 수율을 높입니다. 이 기술은 특히 생성형 AI와 자율주행차와 같은 신흥 시장에 중요하며, 데이터 통신 요구가 커지면서 2.xD 패키지에 대한 수요가 증가하고 있습니다.
3M (NYSE:MMM) a rejoint JOINT3, un consortium de packaging de semi-conducteurs de prochaine génération dirigé par Resonac Corporation du Japon. Le consortium se concentre sur le développement de interposers organiques au niveau panel, des composants cruciaux pour l'emballage avancé des semi-conducteurs qui relient les différentes parties des dispositifs électroniques.
L'initiative vise à optimiser les conceptions pour des interposers organiques au niveau panneau de 515 x 510 mm, en passant des wafers circulaires traditionnels à des panneaux carrés afin d'améliorer le rendement de production. Cette technologie est particulièrement importante pour les marchés émergents comme l'IA générative et les véhicules autonomes, où les boîtiers 2.xD connaissent une demande croissante en raison des exigences accrues en communication de données.
3M (NYSE:MMM) ist JOINT3 beigetreten, einem Next-Generation-Semiconductor-Packaging-Konsortium unter Führung der japanischen Resonac Corporation. Das Konsortium konzentriert sich auf die Entwicklung von Panel-Level-Organic-Interposers, entscheidende Bauteile für fortschrittliches Halbleiter-Packing, die verschiedene Teile von elektronischen Geräten verbinden.
Die Initiative zielt darauf ab, Designs für Panel-Level-Organic-Interposers 515 x 510 mm zu optimieren, indem von herkömmlichen runden Wafern auf quadratische Panels gewechselt wird, um die Produktionsausbeute zu verbessern. Diese Technologie ist besonders wichtig für aufstrebende Märkte wie generative KI und autonome Fahrzeuge, in denen 2.xD-Pakete aufgrund höherer Datenkommunikationsanforderungen eine steigende Nachfrage verzeichnen.
3M (NYSE:MMM) انضمت إلى JOINT3، وهو ائتلاف تغليف أشباه موصلات من الجيل التالي تقوده Resonac Corporation من اليابان. يركّز الائتلاف على تطوير مَواضع عضوية على مستوى اللوحة، وهي مكوّنات حاسمة لتغليف المعالجات الكبيرة تربط أجزاء الأجهزة الإلكترونية المختلفة.
تهدف المبادرة إلى تحسين التصاميم لـمَواضع عضوية على مستوى اللوحة بحجم 515 × 510 مم، مع التحول من الرقائق الدائرية التقليدية إلى لوحات مربعة لزيادة العائد الإنتاجي. هذهTechnology لا تتضح؟ لنقل: هذه التكنولوجيا مهمة بشكل خاص لـالأسواق الناشئة مثل الذكاء الاصطناعي التوليدي والمركبات ذاتية القيادة، حيث تشهد عبوات 2.xD طلباً متزايداً بسبب متطلبات التواصل البيانات الأعلى.
3M (NYSE:MMM) 已加入 JOINT3，这是由日本 Resonac Corporation 主导的新一代半导体封装联合体。该联盟专注于开发 面板级有机中介层，这是用于高级半导体封装、连接电子设备各部件的关键组件。
该计划旨在优化 515 x 510mm 面板级有机中介层 的设计，将传统的圆形晶圆转为方形面板，以提升生产良率。这项技术对于 生成式 AI 和自动驾驶等新兴市场 非常重要，因为在更高的数据通信需求下，2.xD 封装的需求正在增加。
- Strategic participation in JOINT3 positions 3M at the forefront of next-generation semiconductor packaging innovation
- Access to prototype line for panel-level organic interposers development
- Potential market expansion in growing AI and autonomous vehicle sectors
- None.
Insights
3M's entry into JOINT3 consortium strengthens its position in the growing advanced semiconductor packaging market critical for AI applications.
3M has strategically positioned itself in the high-growth semiconductor packaging space by joining the JOINT3 consortium led by Japan's Resonac Corporation. This collaboration specifically targets panel-level organic interposer technology, which represents a critical evolution in the semiconductor packaging landscape.
The significance of this move lies in the fundamental shift occurring in semiconductor packaging. As chips reach physical limits, packaging innovations have become essential for performance gains. The consortium's focus on 2.xD packages using organic interposers addresses key industry challenges in a market experiencing substantial growth due to AI and autonomous vehicle demands.
The transition from circular wafers to larger square panels (515 x 510mm) for interposer manufacturing is particularly noteworthy as it directly impacts production efficiency and yield rates. This manufacturing approach allows for more efficient material utilization compared to traditional circular wafers, where size increases result in diminishing returns.
3M's materials science expertise complements the consortium's objectives perfectly. With decades of experience in advanced materials, 3M can contribute significantly to developing the specialized films, adhesives, and substrates essential for next-generation interposers. Their participation signals a strategic recognition of where semiconductor innovation is heading—toward advanced packaging rather than just node shrinking.
This collaboration aligns with the semiconductor industry's shift toward heterogeneous integration, where different chips are combined in innovative packages rather than creating monolithic solutions. For 3M, this represents access to cutting-edge development platforms and potential new revenue streams in the high-margin advanced semiconductor materials market.
ST. PAUL, Minn., Sept. 30, 2025 /PRNewswire/ -- 3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, equipment and design.
JOINT3 is a co-creation evaluation platform established by
In recent years, packaging innovations in the back-end process, which involves the interconnection, packaging and testing of manufactured semiconductors, have become one of the key technologies for next-generation semiconductors, which are essential for rapidly expanding markets such as generative AI and autonomous vehicles. Among these technologies, 2.xD packages, which involve arranging multiple semiconductor chips in parallel and connecting them via an interposer, are expected to see further growth in demand due to increasing data communication capacity and speed requirements. As semiconductor performance improves, interposers are becoming larger in size, prompting a shift from silicon to organic materials. Traditionally, interposers are cut from circular wafers, but as their size increases, fewer can be produced per wafer. To counter this, a new manufacturing method using square panels instead of circular wafers is emerging, enhancing interposer yield. Using a prototype line for 515 x 510mm panel-level organic interposers, the consortium is working on designs optimized for panel-level organic interposers.
3M, a global leader in materials science and innovation, is excited to partner with Resonac and other semiconductor industry leaders through the JOINT3 co-creative evaluation platform to advance panel-level organic interposers.
"As crucial drivers of device performance and systems innovation, advanced packaging technologies like panel-level organic interposers are essential for fabricating next-generation AI and high-performance chips," said Steven Vander Louw, 3M's president of display and electronics product platforms. "With increasing demand for speed to solution in advanced semiconductor applications, suppliers must work together to provide comprehensive solutions to tough challenges on increasingly shorter timelines. 3M is eager to contribute our key technology platforms and solutions, providing decades of materials science expertise to help shape the future of advanced packaging and drive progress in semiconductor manufacturing and roadmap advancement."
About 3M
3M (NYSE: MMM) is focused on transforming industries around the world by applying science and creating innovative, customer-focused solutions. Our multi-disciplinary team is working to solve tough customer problems by leveraging diverse technology platforms, differentiated capabilities, global footprint, and operational excellence. Discover how 3M is shaping the future at 3M.com/news.
View original content to download multimedia:https://www.prnewswire.com/news-releases/3m-participates-in-joint3-a-next-generation-semiconductor-packaging-consortium-302571242.html
SOURCE 3M Company
FAQ
What is the JOINT3 consortium that 3M (NYSE:MMM) joined in 2025?
How will 3M's participation in JOINT3 impact semiconductor manufacturing?
What are the dimensions of the panel-level organic interposers being developed through JOINT3?
Why is 3M shifting from circular wafers to square panels in semiconductor packaging?
What markets will benefit from 3M's JOINT3 consortium participation?
