3M participates in JOINT3, a next-generation semiconductor packaging consortium

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3M (NYSE:MMM) has joined JOINT3, a next-generation semiconductor packaging consortium led by Japan's Resonac Corporation. The consortium focuses on developing panel-level organic interposers, crucial components for advanced semiconductor packaging that connect different parts of electronic devices.

The initiative aims to optimize designs for 515 x 510mm panel-level organic interposers, shifting from traditional circular wafers to square panels to enhance production yield. This technology is particularly important for emerging markets like generative AI and autonomous vehicles, where 2.xD packages are seeing increased demand due to higher data communication requirements.

Positive

• Strategic participation in JOINT3 positions 3M at the forefront of next-generation semiconductor packaging innovation
• Access to prototype line for panel-level organic interposers development
• Potential market expansion in growing AI and autonomous vehicle sectors

Negative

• None.

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ST. PAUL, Minn., Sept. 30, 2025 /PRNewswire/ -- 3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, equipment and design. 

JOINT3 is a co-creation evaluation platform established by Japan-based Resonac Corporation with the aim of accelerating the development of tools optimized for panel-level organic interposers, the thin layers made from organic materials that connect different parts of an electronic device, helping to manage electrical signals and power between components.

In recent years, packaging innovations in the back-end process, which involves the interconnection, packaging and testing of manufactured semiconductors, have become one of the key technologies for next-generation semiconductors, which are essential for rapidly expanding markets such as generative AI and autonomous vehicles. Among these technologies, 2.xD packages, which involve arranging multiple semiconductor chips in parallel and connecting them via an interposer, are expected to see further growth in demand due to increasing data communication capacity and speed requirements. As semiconductor performance improves, interposers are becoming larger in size, prompting a shift from silicon to organic materials. Traditionally, interposers are cut from circular wafers, but as their size increases, fewer can be produced per wafer. To counter this, a new manufacturing method using square panels instead of circular wafers is emerging, enhancing interposer yield. Using a prototype line for 515 x 510mm panel-level organic interposers, the consortium is working on designs optimized for panel-level organic interposers.

3M, a global leader in materials science and innovation, is excited to partner with Resonac and other semiconductor industry leaders through the JOINT3 co-creative evaluation platform to advance panel-level organic interposers.

"As crucial drivers of device performance and systems innovation, advanced packaging technologies like panel-level organic interposers are essential for fabricating next-generation AI and high-performance chips," said Steven Vander Louw, 3M's president of display and electronics product platforms. "With increasing demand for speed to solution in advanced semiconductor applications, suppliers must work together to provide comprehensive solutions to tough challenges on increasingly shorter timelines. 3M is eager to contribute our key technology platforms and solutions, providing decades of materials science expertise to help shape the future of advanced packaging and drive progress in semiconductor manufacturing and roadmap advancement."

About 3M 
3M (NYSE: MMM) is focused on transforming industries around the world by applying science and creating innovative, customer-focused solutions. Our multi-disciplinary team is working to solve tough customer problems by leveraging diverse technology platforms, differentiated capabilities, global footprint, and operational excellence. Discover how 3M is shaping the future at 3M.com/news.

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SOURCE 3M Company

FAQ

What is the JOINT3 consortium that 3M (NYSE:MMM) joined in 2025?

JOINT3 is a co-creation evaluation platform established by Resonac Corporation, focusing on developing panel-level organic interposers for next-generation semiconductor packaging.

How will 3M's participation in JOINT3 impact semiconductor manufacturing?

3M will contribute its materials science expertise and technology platforms to advance panel-level organic interposers, essential for fabricating next-generation AI and high-performance chips.

What are the dimensions of the panel-level organic interposers being developed through JOINT3?

The consortium is working with a prototype line for 515 x 510mm panel-level organic interposers.

Why is 3M shifting from circular wafers to square panels in semiconductor packaging?

Square panels enhance interposer yield compared to circular wafers, as larger interposer sizes mean fewer can be produced per traditional circular wafer.

What markets will benefit from 3M's JOINT3 consortium participation?

The technology will primarily benefit generative AI and autonomous vehicles markets, which require increased data communication capacity and speed.