MACOM Introduces its Hot Via Chip Scale Technology to Eliminate Wire Bonds
Rhea-AI Summary
MACOM (NASDAQ:MTSI) announced a chip scale hot via process built on its AlGaAs diode technology, designed to eliminate traditional wire bonds and copper pillar surface mount approaches. The technology routes RF signal and ground vertically through the die to simplify assembly, reduce parasitics and support mmWave operation.
The first product using this process is the MASW-011261, a broadband SP2T switch operating from 60–110 GHz with about 0.9 dB insertion loss, 30 dB isolation and sub-20 ns switching speeds in a 1.87 mm x 1.98 mm chip scale package.
AI-generated analysis. Not financial advice.
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Key Figures
Market Reality Check
Peers on Argus
Momentum scanner shows 3 semiconductor peers (e.g., RMBS, PI, ALGM) moving up with a median gain near 5%, suggesting broader sector strength even as MTSI trades lower from its prior close.
Historical Context
| Date | Event | Sentiment | Move | Catalyst |
|---|---|---|---|---|
| Jun 04 | RF product launches | Positive | -1.9% | Announced new high-performance RF products for aerospace and defense at IMS 2026. |
| May 07 | Earnings report | Positive | +11.2% | Reported Q2 2026 revenue growth with strong margins and raised Q3 guidance. |
| Apr 27 | Supply chain deal | Positive | -2.9% | Entered LTSAs and financing with IQE to strengthen epitaxial supply resilience. |
| Apr 23 | Earnings date notice | Neutral | +2.7% | Announced schedule and access details for upcoming Q2 2026 earnings call. |
| Mar 18 | SATCOM showcase | Positive | -1.1% | Highlighted RF and optical solutions and demos for SATShow Week 2026. |
Product and strategic news has often seen muted or negative next-day moves, while strong earnings updates have aligned with positive reactions.
Over the last several months, MACOM has repeatedly highlighted RF and microwave product innovation and ecosystem positioning. On May 7, 2026, strong fiscal Q2 earnings with $289.0M revenue and raised guidance saw a 11.19% next-day gain. In contrast, news on SATCOM showcases, supply-chain LTSAs, and IMS 2026 product announcements (e.g., June 4, 2026) produced modest declines. Today’s chip-scale hot via technology news fits this pattern of technical/product disclosures around major industry events.
Market Pulse Summary
This announcement introduces a hot via chip scale process on MACOM’s AlGaAs diode technology, aiming to reduce assembly complexity and improve RF performance into mmWave frequencies. The first device, the MASW-011261 SP2T switch, targets 60–110 GHz with 0.9 dB typical insertion loss and 30 dB isolation in a compact package. In context of prior IMS and SATCOM product news, this reinforces MACOM’s focus on high-frequency applications. Investors may track adoption in switches, limiters, and other control functions.
Key Terms
rf technical
mmwave technical
AI-generated analysis. Not financial advice.
LOWELL, Mass., June 08, 2026 (GLOBE NEWSWIRE) -- MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced a chip scale hot via process built on its AlGaAs diode technology. As an alternative to traditional chip and wire bonding and copper pillar-based surface mount technologies, MACOM’s hot via process simplifies surface mount assembly while delivering low insertion loss and high isolation.
Hot via technology enables direct surface mount attachment by routing RF signal and ground paths vertically through the die. By removing bond wires, customers can reduce assembly complexity, improve manufacturing consistency and minimize parasitics, thereby achieving high signal integrity and reliable performance into millimeter wave (mmWave) frequencies.
“MACOM continues to build on its deep expertise in microwave technologies to address our customers’ evolving performance and integration challenges. Our new hot via-based AlGaAs process can reduce assembly complexity while improving the high frequency performance of our integrated components,” said Stephen G. Daly, President and Chief Executive Officer, MACOM.
Ideal for applications including switches, limiters and other control functions, the new process will be deployed on MACOM’s proven AlGaAs diode technology.
MACOM’s first product using the AlGaAs hot via process technology is the MASW-011261, a broadband SP2T switch operating from 60 to 110 GHz. It delivers typical insertion loss of 0.9 dB, 30 dB isolation, and sub-20 ns switching speeds, all in a compact 1.87 mm x 1.98 mm chip scale package.
The MASW-011261 and MACOM’s hot via process will be on display at MACOM’s Booth #17035 at the International Microwave Symposium (IMS 2026) on June 9 to 11, 2026 in Boston, MA.
About MACOM
MACOM designs and manufactures semiconductor products for telecommunications, industrial and defense and data center applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. To learn more, visit https://www.macom.com/.
Company Contact:
MACOM Technology Solutions Inc.
Stephen Ferranti
Sr. Vice President, Corporate Development and Investor Relations
P: 978-656-2977
E: stephen.ferranti@macom.com
