MACOM Introduces its Hot Via Chip Scale Technology to Eliminate Wire Bonds

MACOM (NASDAQ:MTSI) announced a chip scale hot via process built on its AlGaAs diode technology, designed to eliminate traditional wire bonds and copper pillar surface mount approaches.

Rhea-AI Summary

MACOM (NASDAQ:MTSI) announced a chip scale hot via process built on its AlGaAs diode technology, designed to eliminate traditional wire bonds and copper pillar surface mount approaches. The technology routes RF signal and ground vertically through the die to simplify assembly, reduce parasitics and support mmWave operation.

The first product using this process is the MASW-011261, a broadband SP2T switch operating from 60–110 GHz with about 0.9 dB insertion loss, 30 dB isolation and sub-20 ns switching speeds in a 1.87 mm x 1.98 mm chip scale package.

Argus Jun 8 session

+4.77% close to close Open Argus

Details

News Market Reaction – MTSI

In the Jun 8 session, MTSI gained 4.77%, reflecting a moderate positive market reaction.

Data tracked by StockTitan Argus on the day of publication.

Market Context

This announcement introduces a hot via chip scale process on MACOM’s AlGaAs diode technology, aiming...

Analysis

This announcement introduces a hot via chip scale process on MACOM’s AlGaAs diode technology, aiming to reduce assembly complexity and improve RF performance into mmWave frequencies. The first device, the MASW-011261 SP2T switch, targets 60–110 GHz with 0.9 dB typical insertion loss and 30 dB isolation in a compact package. In context of prior IMS and SATCOM product news, this reinforces MACOM’s focus on high-frequency applications. Investors may track adoption in switches, limiters, and other control functions.

Key Figures

Operating frequency range: 60 to 110 GHz Insertion loss: 0.9 dB Isolation: 30 dB +4 more

Operating frequency range

60 to 110 GHz

MASW-011261 broadband SP2T switch

Insertion loss

0.9 dB

Typical insertion loss for MASW-011261

Isolation

30 dB

Isolation for MASW-011261 switch

Switching speed

sub-20 ns

Switching speed for MASW-011261

Chip dimensions

1.87 mm x 1.98 mm

Chip scale package size for MASW-011261

IMS 2026 dates

June 9 to 11, 2026

International Microwave Symposium in Boston

Booth number

17035

MACOM booth at IMS 2026

Historical Context

5 past events · Latest: Jun 04

5 events

1. Jun 04

   RF product launches

   24h Move

   -1.9%

   Announced new high-performance RF products for aerospace and defense at IMS 2026.

2. May 07

   Earnings report

   24h Move

   +11.2%

   Reported Q2 2026 revenue growth with strong margins and raised Q3 guidance.

3. Apr 27

   Supply chain deal

   24h Move

   -2.9%

   Entered LTSAs and financing with IQE to strengthen epitaxial supply resilience.

4. Apr 23

   Earnings date notice

   24h Move

   +2.7%

   Announced schedule and access details for upcoming Q2 2026 earnings call.

5. Mar 18

   SATCOM showcase

   24h Move

   -1.1%

   Highlighted RF and optical solutions and demos for SATShow Week 2026.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Key Terms

algaas, rf, mmwave, sp2t

4 terms

algaas technical

"built on its AlGaAs diode technology. As an alternative to traditional chip"

AlGaAs (aluminum gallium arsenide) is a crystalline semiconductor made by combining aluminum, gallium and arsenic; changing the mix tunes how the material carries electricity and responds to light, like adjusting a recipe to get different colors or speeds. It matters to investors because AlGaAs is widely used in lasers, LEDs, photodetectors and high‑speed electronics, so shifts in its supply, cost, manufacturing advances or adoption can affect the performance and value of companies in semiconductors, telecom, medical devices and consumer electronics.

rf technical

"attachment by routing RF signal and ground paths vertically through the die."

rf (commonly written r_f) denotes the risk-free rate — the theoretical return on an investment with no chance of loss, often used as a baseline for valuing other assets. Investors use it like a yardstick: returns above this number compensate for extra risk, so it helps price stocks, bonds and option valuations and guides decisions about whether higher-return opportunities justify their added risk. Think of it as the safe deposit box interest rate against which riskier bets are measured.

mmwave technical

"signal integrity and reliable performance into millimeter wave (mmWave) frequencies."

mmWave is the very high-frequency portion of the radio spectrum (roughly 24–100 GHz) used for ultra-fast wireless links. It matters to investors because it enables much higher data speeds and capacity for services like 5G and fixed wireless, but its short range and sensitivity to obstacles make network deployment and device support more expensive and complex—factors that influence revenue potential, capital spending, and competitive position.

sp2t technical

"product using the AlGaAs hot via process technology is the MASW-011261, a broadband SP2T switch"

An sp2t (single‑pole, double‑throw) switch is an electrical component that directs one input signal to one of two outputs, like a railroad switch that sends a train down one of two tracks. Investors care because this small part can determine how easily a device routes radio or electronic signals, affecting product performance, manufacturing cost, supply chain risk, and competitiveness in markets such as wireless equipment and consumer electronics.

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LOWELL, Mass., June 08, 2026 (GLOBE NEWSWIRE) -- MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced a chip scale hot via process built on its AlGaAs diode technology. As an alternative to traditional chip and wire bonding and copper pillar-based surface mount technologies, MACOM’s hot via process simplifies surface mount assembly while delivering low insertion loss and high isolation.

Hot via technology enables direct surface mount attachment by routing RF signal and ground paths vertically through the die. By removing bond wires, customers can reduce assembly complexity, improve manufacturing consistency and minimize parasitics, thereby achieving high signal integrity and reliable performance into millimeter wave (mmWave) frequencies.

“MACOM continues to build on its deep expertise in microwave technologies to address our customers’ evolving performance and integration challenges. Our new hot via-based AlGaAs process can reduce assembly complexity while improving the high frequency performance of our integrated components,” said Stephen G. Daly, President and Chief Executive Officer, MACOM.

Ideal for applications including switches, limiters and other control functions, the new process will be deployed on MACOM’s proven AlGaAs diode technology.

MACOM’s first product using the AlGaAs hot via process technology is the MASW-011261, a broadband SP2T switch operating from 60 to 110 GHz. It delivers typical insertion loss of 0.9 dB, 30 dB isolation, and sub-20 ns switching speeds, all in a compact 1.87 mm x 1.98 mm chip scale package.

The MASW-011261 and MACOM’s hot via process will be on display at MACOM’s Booth #17035 at the International Microwave Symposium (IMS 2026) on June 9 to 11, 2026 in Boston, MA.

About MACOM

MACOM designs and manufactures semiconductor products for telecommunications, industrial and defense and data center applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. To learn more, visit https://www.macom.com/.

Company Contact:
MACOM Technology Solutions Inc.
Stephen Ferranti
Sr. Vice President, Corporate Development and Investor Relations
P: 978-656-2977
E: stephen.ferranti@macom.com

FAQ

What is MACOM's new hot via chip scale technology announced on June 8, 2026 for MTSI?

MACOM's hot via chip scale technology is an AlGaAs diode-based process enabling direct surface mount by routing RF signals vertically through the die. According to MACOM, it replaces traditional wire bonds, simplifying assembly, lowering parasitics, and supporting high signal integrity into millimeter wave frequencies.

How does MACOM's hot via process reduce wire bonds and assembly complexity for MTSI products?

The hot via process removes external bond wires by routing RF signal and ground paths vertically through the die. According to MACOM, this allows direct surface mount attachment, reduces assembly complexity, improves manufacturing consistency, and minimizes parasitics for better high-frequency performance and reliability.

What are the key specifications of MACOM's MASW-011261 SP2T switch using hot via technology?

The MASW-011261 is a broadband SP2T switch operating from 60 to 110 GHz using MACOM's hot via AlGaAs process. According to MACOM, it offers about 0.9 dB insertion loss, 30 dB isolation, sub-20 ns switching speeds and a compact 1.87 mm x 1.98 mm chip scale package.

Which applications can use MACOM's AlGaAs hot via process technology (MTSI)?

MACOM indicates the AlGaAs hot via process is suitable for RF switches, limiters and other control functions. According to MACOM, the approach targets applications that need simplified assembly, improved high-frequency performance and reliable signal integrity up to millimeter wave bands.

Where will MACOM showcase its hot via chip scale technology and MASW-011261 switch in 2026?

MACOM plans to showcase the hot via process and MASW-011261 at the International Microwave Symposium (IMS 2026) in Boston. According to MACOM, they will be displayed at Booth #17035 from June 9 to 11, 2026 for industry attendees.

How does MACOM describe performance benefits of its hot via AlGaAs process for MTSI investors?

MACOM describes the hot via AlGaAs process as reducing assembly complexity while improving high-frequency performance of integrated components. According to MACOM, the technology supports low insertion loss, high isolation and reliable performance into millimeter wave frequencies, which may enhance competitiveness in advanced RF and microwave markets.