MACOM Technology Solutions Holdings, Inc. reports developments tied to its high-performance semiconductor business for Industrial and Defense, Data Center and Telecommunications markets. The company designs and manufactures RF, microwave, analog and mixed-signal, and optical semiconductor technologies used by original equipment manufacturers and distributors.
Recurring news includes quarterly and annual financial results, GAAP and non-GAAP performance measures, and product announcements across optical transceivers, copper interconnects, linear equalizers, cable drivers, modulator drivers and satellite communications solutions. Company updates also cover technology demonstrations, manufacturing capabilities and quality certifications for automotive, aerospace, international quality and environmental management standards.
MACOM Technology Solutions (MTSI) will exhibit RF and microwave technologies at European Microwave Week in London from October 6 to 8, 2026. Its Booth B45 demonstrations will also cover millimeter-wave and photonic technologies. Thomas Winslow is scheduled to present on two-port feedback analysis on October 5.
MACOM (MTSI) introduced a 3.2T front end chipset solution on September 17, 2026 to support next-generation optical interconnects for AI infrastructure, cloud data centers and high speed networks.
The platform delivers up to 3.2T throughput via eight channels operating at 448 Gbps PAM-4, combining new high performance quad linear TIAs (MATA-42754 and MATA-41754) and the MARP-BP224 backside-illuminated PIN photodiode on the receive side with MACOM’s previously announced 448 Gbps PAM-4 drivers on the transmit side. The TIAs integrate RSSI for photo alignment and power monitoring plus digital control of bandwidth, output amplitude, peaking, gain and loss-of-signal thresholds. The photodiode offers greater than 100 GHz bandwidth and ultra-low parasitics, and is available in multiple layouts. All products in the 3.2T chipset solution are now available and will be shown at ECOC2026 in Málaga, Spain.
MACOM Technology Solutions (MTSI) will showcase its latest optical and high speed connectivity technologies at the European Conference on Optical Communication (ECOC) 2026 in Málaga, Spain, from September 21 - 23, 2026.
At Stand 1055, visitors can see demonstrations spanning 3.2T optical solutions with 448 Gbps/lane components, 1.6T active copper cable and optical products using 224 Gbps/lane devices, Optical PCIe 6.0 and Copper PCIe 7.0 connectivity, near packaged optics (NPO) with 112 and 226 Gbps/lane technologies, and 800G scale-out coherent networking. MACOM will also highlight solutions for 5G Advanced and 6G fronthaul, Free Space Optics and RF over Fiber applications aimed at AI infrastructure, cloud data centers and telecommunications networks.
MACOM (Nasdaq: MTSI) reported fiscal third quarter 2026 revenue of $342.2 million, up 35.8% year over year and 18.4% sequentially. GAAP gross margin was 58.3% and income from operations was $77.1 million (22.5% of revenue). GAAP net income was $100.7 million, or $1.28 per diluted share.
On a non-GAAP basis, MACOM posted adjusted gross margin of 59.7%, adjusted operating income of $107.7 million (31.5% margin) and adjusted net income of $109.8 million, or $1.40 per diluted share. For fiscal Q4 2026, MACOM expects revenue of $415–$425 million, adjusted gross margin of 60.0–61.0% and adjusted EPS of $1.97–$2.03, based on a 3% non-GAAP tax rate and 78.9 million diluted shares.
MACOM (Nasdaq: MTSI) will release its financial results for the third quarter ended July 3, 2026, before market open on Thursday, August 6, 2026. A conference call and live webcast will follow at 8:30 a.m. Eastern Time, hosted by the President & CEO and the CFO.
Investors can register via MACOM’s Investor Relations website for user-specific access to the live call or webcast. A replay will be available within 24 hours and remain accessible for about 90 days.
MACOM (NASDAQ:MTSI) and Elve plan a joint demonstration of a V-Band linearized traveling wave tube amplifier (TWTA) at IMS 2026 in Boston. The demo combines MACOM’s analog predistortion linearization with Elve’s TWTA platform to improve linear power and efficiency for microwave transmitters used in satellite communications, defense, and other ground and space-based applications.
MACOM (NASDAQ:MTSI) announced a chip scale hot via process built on its AlGaAs diode technology, designed to eliminate traditional wire bonds and copper pillar surface mount approaches. The technology routes RF signal and ground vertically through the die to simplify assembly, reduce parasitics and support mmWave operation.
The first product using this process is the MASW-011261, a broadband SP2T switch operating from 60–110 GHz with about 0.9 dB insertion loss, 30 dB isolation and sub-20 ns switching speeds in a 1.87 mm x 1.98 mm chip scale package.
MACOM (MTSI) announced new RF and optical products for the satellite communications (SATCOM) market, to be demonstrated at IMS 2026 in Boston from June 9–11, 2026.
Showcases include L/S‑Band D2D transmit/receive chains, K/Ka‑Band, Q‑Band, W‑Band amplifiers, and Free Space Optical (FSO) transport solutions.
MACOM (MTSI) announced new high-performance RF products for aerospace and defense, to be demonstrated at IMS 2026 in Boston, June 9–11, Booth 17035.
Launches span S-Band, C-Band, X-Band and wideband GaN-based power amplifiers and front-end modules for radar, communications and electronic warfare.
MACOM (Nasdaq: MTSI) reported fiscal Q2 2026 results for the quarter ended April 3, 2026. Revenue was $289.0M (+22.5% YoY, +6.4% QoQ). GAAP gross margin was 56.9% and adjusted gross margin was 58.5%. GAAP net income was $46.3M, $0.60 diluted; adjusted net income was $84.3M, $1.09 diluted. For fiscal Q3 ending July 3, 2026, MACOM expects revenue $331M–$339M, adjusted gross margin 59.0%–60.0%, and adjusted EPS $1.31–$1.37 (78.5M diluted shares, non-GAAP tax rate ~3%).