MACOM Introduces 3.2T Chipset Solution for High Speed Optical Connectivity

MACOM launches a 3.2T PAM-4 chipset platform that unifies drivers, TIAs and photodiodes for high speed AI and data center optical links.

Rhea-AI Summary

MACOM (MTSI) introduced a 3.2T front end chipset solution on September 17, 2026 to support next-generation optical interconnects for AI infrastructure, cloud data centers and high speed networks.

The platform delivers up to 3.2T throughput via eight channels operating at 448 Gbps PAM-4, combining new high performance quad linear TIAs (MATA-42754 and MATA-41754) and the MARP-BP224 backside-illuminated PIN photodiode on the receive side with MACOM’s previously announced 448 Gbps PAM-4 drivers on the transmit side. The TIAs integrate RSSI for photo alignment and power monitoring plus digital control of bandwidth, output amplitude, peaking, gain and loss-of-signal thresholds. The photodiode offers greater than 100 GHz bandwidth and ultra-low parasitics, and is available in multiple layouts. All products in the 3.2T chipset solution are now available and will be shown at ECOC2026 in Málaga, Spain.

Positive

• 3.2T optical throughput across eight 448 Gbps PAM-4 channels targets AI and data center demand
• Integrated chipset combines drivers, TIAs and photodiodes from a single supplier, potentially simplifying module development
• Products are immediately available, enabling customers to begin next-generation optical module designs without delay

Negative

• None.

Argus 15 min delay

+4.34% vs previous close $262.67 last price 1.2x rel. volume Open Argus

Details

Market Reaction – MTSI

$262.67 $262.67 Day Range

$20.06B Market Cap

Following this news, MTSI has gained 4.34%, reflecting a moderate positive market reaction. Our momentum scanner has triggered 5 alerts so far, indicating moderate trading interest and price volatility. The stock is currently trading at $262.67.

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Market Context

MTSI's prior close rose 4.89% before publication, while its Sep 15 ECOC technology announcement move...

Analysis

MTSI's prior close rose 4.89% before publication, while its Sep 15 ECOC technology announcement moved 0.23% over 24 hours; both records concerned the same 3.2T/448 Gbps optical program, but neither establishes causation.

Key Figures

Aggregate throughput: 3.2T Channel configuration: 8 channels Per-channel rate: 448 Gbps PAM-4 +1 more

Aggregate throughput

3.2T

Front-end chipset solution

Channel configuration

8 channels

448 Gbps PAM-4 optical architecture

Per-channel rate

448 Gbps PAM-4

Optical transmit and receive links

Photodiode bandwidth

Greater than 100 GHz

MARP-BP224 backside-illuminated PIN photodiode

Historical Context

1 past event · Latest: Sep 15

1 event

1. Sep 15

   ECOC technology demonstration

   24h Move

   +0.2%

   Showcased 3.2T optical solutions with 448 Gbps-per-lane components at ECOC 2026.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Key Terms

pam-4, transimpedance amplifiers, rssi, pin photodiode

4 terms

pam-4 technical

"eight channels operating at 448 Gbps PAM-4"

A lab-made antibody that binds a specific protein often found on certain tumors, especially pancreatic cancer, used both to help detect cancer and to deliver imaging agents or treatments directly to tumor cells. For investors, PAM4 matters because success or failure in tests and trials using this antibody can change how accurately a disease is diagnosed, how targeted a therapy can be, and therefore a company's clinical prospects, regulatory chances, and potential market value.

transimpedance amplifiers technical

"new high performance transimpedance amplifiers (TIAs)"

A transimpedance amplifier is an electronic circuit that converts a tiny input current from a sensor (for example, a light-detecting photodiode) into a usable output voltage so downstream electronics can read it. Think of it as a translator that turns a whisper of electric current into a clear volume reading; its speed, noise level, and precision directly affect product performance, market appeal, and margins in industries like communications, medical devices, and instrumentation.

rssi technical

"The devices incorporate RSSI functionality for photo alignment"

RSSI (Received Signal Strength Indicator) measures how strong a wireless signal appears to a device, indicating the power level of radio communications between transmitters and receivers. For investors, RSSI is a practical indicator of product and network quality for companies in wireless, telecom and IoT: stronger RSSI generally means more reliable connections, fewer service issues and potentially lower deployment and support costs, like hearing someone clearly across a noisy room.

pin photodiode technical

"backside-illuminated PIN photodiode"

A PIN photodiode is a small semiconductor device that converts incoming light into an electrical signal; think of it like a tiny, fast solar cell designed to detect faint or rapidly changing light rather than produce power. Investors care because these sensors are critical components in fiber‑optic communications, LiDAR, medical imaging and other high‑growth tech products, so their performance, cost and supply can directly affect a maker’s revenue, margins and competitive position.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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LOWELL, Mass., Sept. 17, 2026 (GLOBE NEWSWIRE) -- MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced a front end chipset solution for 3.2T applications, designed to accelerate the development of next generation optical interconnects for AI infrastructure, cloud data centers and high speed networking applications.

The solution is designed to support new optical architectures, delivering up to 3.2T throughput through eight channels operating at 448 Gbps PAM-4. This solution combines MACOM's new high performance transimpedance amplifiers (TIAs) and photodiodes in a receiver platform with its previously introduced 448 Gbps PAM-4 drivers on the transmit side. By offering key transmit and receive building blocks from a single supplier, MACOM helps customers simplify development, accelerate time-to-market and optimize overall link performance.

“MACOM’s 3.2T chipset solution has been engineered and optimized as a platform, helping customers optimize link performance while reducing development and qualification efforts,” said Stephen G. Daly, President and Chief Executive Officer, MACOM.

Optimized for 448 Gbps PAM-4 Optical Links
MACOM’s receive-side solution combines advanced photodiodes and TIA technologies engineered to work together in demanding 448 Gbps PAM-4 optical applications.

This solution includes MACOM’s MATA-42754 and MATA-41754 quad linear TIAs, designed to support the bandwidth requirements of next-generation optical links. The devices incorporate RSSI functionality for photo alignment and power monitoring, as well as digital control of bandwidth, output amplitude, peaking, gain and loss-of-signal thresholds.

The TIAs are paired with MACOM’s MARP-BP224 backside-illuminated PIN photodiode, optimized for 448 Gbps PAM-4 receiver applications. The photodiode features greater than 100 GHz bandwidth and ultra-low parasitics to maximize performance and signal integrity in high speed optical links. Leveraging a proprietary design for high coupling efficiency, the device is available in multiple layouts to support a variety of optical interface implementations. Together, these components provide a scalable building block approach for transceivers supporting eight channels at 448 Gbps PAM-4 and aggregate data rates reaching 3.2T.

The new receive-side solution complements MACOM’s previously announced MAOM-025408 and MAOM-022404 driver solutions, which support 448 Gbps PAM-4 optical transmit architectures. By combining drivers, photodiodes and TIAs within a single portfolio, MACOM is providing customers with a comprehensive set of technologies for next-generation optical module development.

Availability
All products within the 3.2T chipset solution are readily available. Please visit www.macom.com or contact your local MACOM sales representative for more information. The products will also be on display at MACOM’s Booth 1055 at ECOC2026 from September 21 to 23, 2026 in Málaga, Spain.

About MACOM
MACOM designs and manufactures semiconductor products for telecommunications, industrial and defense and data center applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. To learn more, visit https://www.macom.com/.

Company Contact:
MACOM Technology Solutions Inc.
Stephen Ferranti
Senior Vice President, Corporate Development and Investor Relations
P: 978-656-2977
E: stephen.ferranti@macom.com

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

What components are included in MACOM’s 3.2T chipset solution?

The 3.2T solution includes receive-side components MATA-42754 and MATA-41754 quad linear TIAs and the MARP-BP224 backside-illuminated PIN photodiode, along with previously announced MAOM-025408 and MAOM-022404 driver solutions for 448 Gbps PAM-4 optical transmit architectures.

What key features do the MATA-42754 and MATA-41754 TIAs provide?

The quad linear TIAs are designed for the bandwidth requirements of next-generation 448 Gbps PAM-4 optical links and incorporate RSSI functionality for photo alignment and power monitoring, plus digital control of bandwidth, output amplitude, peaking, gain and loss-of-signal thresholds.

How is the MARP-BP224 photodiode optimized for high speed links?

The MARP-BP224 backside-illuminated PIN photodiode offers greater than 100 GHz bandwidth and ultra-low parasitics to maximize performance and signal integrity in 448 Gbps PAM-4 receiver applications, and is available in multiple layouts to support different optical interface implementations.

When and where will MACOM showcase the 3.2T chipset solution?

The products will be on display at MACOM’s Booth 1055 at ECOC2026, held from September 21 to 23, 2026 in Málaga, Spain.

How can customers obtain more information or purchase the 3.2T chipset products?

All products in the 3.2T chipset solution are readily available. Customers can visit www.macom.com or contact their local MACOM sales representative for more information.