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MACOM Technology Solutions Holdings, Inc. reports developments tied to its high-performance semiconductor business for Industrial and Defense, Data Center and Telecommunications markets. The company designs and manufactures RF, microwave, analog and mixed-signal, and optical semiconductor technologies used by original equipment manufacturers and distributors.
Recurring news includes quarterly and annual financial results, GAAP and non-GAAP performance measures, and product announcements across optical transceivers, copper interconnects, linear equalizers, cable drivers, modulator drivers and satellite communications solutions. Company updates also cover technology demonstrations, manufacturing capabilities and quality certifications for automotive, aerospace, international quality and environmental management standards.
MACOM Technology Solutions's European Semiconductor Center (MESC) has been awarded a multi-year contract from Banque Publique d'Investissement (BPI) to lead the development and manufacturing of advanced semiconductor products. The 'MAGENTA' program aims to develop next-generation Ka-band Monolithic Microwave Integrated Circuit (MMIC) front end products using MESC's Gallium Nitride (GaN) technology.
The program focuses on developing amplifiers with exceptional power-added efficiency to enhance high-frequency communications system performance. These products will support telecommunication systems in 5G-FR2 bands and low earth orbit (LEO) communication systems. MESC will lead the manufacturing of MMICs developed by MAGENTA partners, with the program being financed by the French government under France 2030 framework.
MACOM Technology Solutions has announced production availability of its 227 Gbps per lane family of linear equalizers for active copper cable applications. These devices can more than double the reach of traditional twinax Direct Attach Cables (DAC), enabling longer 1.6 Tbps copper cable assemblies for intra-rack connectivity in high-performance computing clusters.
The company offers two products: the MAEQ-40904, a small form-factor die solution, and the MAEQ-40914, a packaged part version. Both are designed for various small form factor cable connectors, including DSFP, QSFP, QSFP-DD, OSFP, and OSFP-XD. The equalizers use un-retimed, analog equalization techniques for lower power consumption and reduced link latency compared to retimed solutions.
MACOM will showcase these solutions at DesignCon in Santa Clara (January 29-30, 2025), along with their PURE DRIVE technology supporting 227 Gbps per lane for 1.6T linear pluggable optical modules.
MACOM Technology Solutions Holdings (Nasdaq: MTSI) has scheduled the announcement of its first quarter fiscal 2025 financial results for February 6, 2025, before market open. The company will host a conference call at 8:30 a.m. Eastern Time on the same day.
The call will feature President and CEO Stephen G. Daly and Senior VP/CFO John F. Kober. Interested parties can access the live call and webcast through MACOM's Investor Relations Website. A replay will be available for approximately 90 days after the event.
MACOM Technology Solutions (Nasdaq: MTSI) has announced a five-year strategic investment plan worth $345 million to modernize its Massachusetts and North Carolina semiconductor wafer fabrication facilities. The plan is supported by proposed funding through the CHIPS and Science Act, including up to $70 million in direct funding from the U.S. Department of Commerce.
The total government support could reach $180 million through a combination of federal funding, tax credits, and state support, including $15.7 million from the Massachusetts Technology Collaborative. MACOM plans to self-fund the remaining $165 million through operating cash flow over five years.
The investment will focus on expanding clean rooms, modernizing production lines, and upgrading infrastructure at both facilities. The Massachusetts facility will see modernization of 100mm production lines and installation of 150mm GaN-on-SiC manufacturing capabilities, while the North Carolina facility will receive 150mm wafer size production capabilities and advanced MOCVD epitaxial growth capabilities.
MACOM Technology Solutions (Nasdaq: MTSI) announced a refinancing operation of its convertible notes. The company will exchange approximately $288.8 million of existing 0.25% convertible senior notes due 2026 for $257.7 million of new 0% convertible senior notes due 2029 and approximately 1.6 million shares of common stock. Additionally, MACOM will issue $86.6 million in new convertible notes through a private placement.
The transactions are expected to close around December 19, 2024, resulting in a $61.7 million increase in cash balance (after fees) and a $55.5 million increase in debt balance, with a neutral impact on pro forma net leverage. The new notes and common stock issuance are being conducted under Securities Act exemptions and are not being registered.
MACOM Technology Solutions (Nasdaq: MTSI) reported fiscal Q4 2024 results with revenue of $200.7 million, up 33.5% year-over-year. Q4 GAAP net income reached $29.4 million ($0.39 per diluted share), while adjusted net income was $54.2 million ($0.73 per diluted share). For fiscal year 2024, revenue grew 12.5% to $729.6 million, with GAAP net income of $76.9 million ($1.04 per diluted share). Looking ahead, MACOM expects Q1 2025 revenue between $212-218 million with adjusted earnings per share of $0.75-0.81.
MACOM Technology Solutions (NASDAQ: MTSI) has acquired ENGIN-IC, a fabless semiconductor company specializing in Gallium Nitride (GaN) monolithic microwave integrated circuits and microwave assemblies. Founded in 2014, ENGIN-IC focuses on U.S. defense industry solutions with a portfolio of over 60 standard MMICs and custom products. The acquisition, funded with cash-on-hand, aims to strengthen MACOM's market position through ENGIN-IC's design capabilities in wideband and high-efficiency MMIC and module design. The transaction is expected to have minimal impact on MACOM's near-term financial performance.
MACOM Technology Solutions Holdings (Nasdaq: MTSI) announced it will release its fourth quarter and fiscal year 2024 financial results on November 7, 2024, before market open. The company will host a conference call at 8:30 a.m. Eastern Time on the same day, featuring President and CEO Stephen G. Daly and CFO John F. Kober. The call will be accessible via webcast through MACOM's Investor Relations Website, with a replay available for approximately 90 days.
MACOM Technology Solutions Holdings, Inc. (Nasdaq: MTSI), a leading supplier of semiconductor products, has been added to the PHLX Semiconductor Sector Index (SOX). The SOX is a capitalization-weighted index comprising the 30 largest semiconductor companies traded in the USA, ranked by market capitalization.
Stephen G. Daly, President and Chief Executive Officer of MACOM, described the inclusion as a milestone and congratulated the entire team for making it possible. This addition to the index represents a significant achievement for MACOM in the semiconductor industry.
HyperLight , a provider of thin film lithium niobate (TFLN) photonic integrated circuits (PICs), has secured a $37 million Series B investment led by Summit Partners. The funding round includes participation from existing investors Xora Innovation and Foothill Ventures. Peter Chung, Managing Director and CEO of Summit Partners, will join HyperLight's Board of Directors.
HyperLight's TFLN PICs offer superior bandwidth and energy efficiency for AI/data center infrastructure, telecommunications optical networks, and high-performance computing. The company has delivered industrial-scale TFLN PICs with a trusted supply chain since its founding in 2018.
The new financing will enable HyperLight to accelerate product development and meet growing customer demand. The investment is expected to enhance the company's ability to serve as a trusted innovation partner in the photonics industry.