Nano Dimension’s Additive Electronics Product Line - Essemtec - Received a Global Technology Award

Rhea-AI Summary

Nano Dimension's Tarantula Underfill system from its Essemtec product line has received the Global Technology Award for Innovation at SMTA International 2024 Show in Chicago. The system is designed for the assembly of complex devices in additive electronics, dispensing epoxy-based composite between chips and substrates to enhance mechanical strength and durability.

The system's key innovation lies in its non-contact heating solution and precise dispensing control, enabling underfill processes on two-side populated PCBs. The Tarantula Underfill features five different valve options: time-pressure, volume dispensing, micro screw, solder paste jetting, and glue jetting, allowing for customized solutions across various applications, particularly in aerospace, defense, and heavy-duty sectors.

Positive

• Won Global Technology Award for Innovation at SMTA International 2024
• Features versatile functionality with five different valve options for customized solutions
• Addresses growing market demand in aerospace, defense, and heavy-duty sectors

Negative

• None.

The Tarantula Underfill System Recognized at SMTA International 2024 Show in Chicago

Waltham, Mass., Dec. 11, 2024 (GLOBE NEWSWIRE) -- Nano Dimension Ltd. (Nasdaq: NNDM) (“Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printing solutions, today announced that its Tarantula Underfill system from its Essemtec product lines received the Global Technology Award for Innovation at the SMTA International 2024 Show (the “SMTA Show”) in Chicago, Illinois.

Essemtec’s Tarantula Underfill system is critical in the additive electronics value chain for assembly of complex devices. It involves dispensing an epoxy-based composite along the edge of a chip, which fills the gap between the chip and the substrate, or printed circuit boards, through capillary action.

This innovation enhances mechanical strength by reducing stresses caused by thermal expansion and vibration, while also improving durability, reliability, thermal cycling, and moisture ingress. This process is critical and in growing demand for industries like aerospace, defense, and heavy-duty sectors, where electronics must withstand harsh conditions and require high durability and robust performance.

The heart of Tarantula Underfill’s innovation is in its non-contact heating solution that enables the underfill process on two-side populated printed circuit boards (“PCBs”) and its precise dispensing control of medium.

Olivier Carnal, General Manager for Additive Electronics, shared, “We are proud to be recognized by the SMTA Show for our innovation. Our Tarantula Underfill product is unique yet flexible. In addition to its primary function as an underfill solution, the Tarantula Underfill offers the full range of Essemtec dispensing machine operations. With five different valve options - time-pressure, volume dispensing, micro screw, solder paste jetting, and glue jetting - it allows us to develop customized solutions to meet almost any customer need.”

Yoav Stern, Nano Dimension’s Chief Executive Officer, added, “I am extremely pleased to be able to announce that we have yet again launched another innovative product, which was designed and produced by our Nano Dimension team in Switzerland. This innovation uniquely meets our customers’ needs. Our ability to deliver this technology for production for large printed circuit boards will allow us to address a wide range of industries immediately.”

About Nano Dimension

Nano Dimension’s (Nasdaq: NNDM) vision is to transform existing electronics and mechanical manufacturing into Industry 4.0 environmentally friendly & economically efficient precision additive electronics and manufacturing – by delivering solutions that convert digital designs to electronic or mechanical devices - on demand, anytime, anywhere.

Nano Dimension’s strategy is driven by the application of deep learning-based AI to drive improvements in manufacturing capabilities by using self-learning & self-improving systems, along with the management of a distributed manufacturing network via the cloud.

Nano Dimension has served over 2,000 customers across vertical target markets such as aerospace and defense, advanced automotive, high-tech industrial, specialty medical technology, R&D, and academia. The Company designs and makes Additive Electronics and AM 3D printing machines and consumable materials. Additive Electronics are manufacturing machines that enable the design and development of High-Performance-Electronic-Devices (Hi-PED®s). AM includes manufacturing solutions for the production of metal, ceramic, and specialty polymers-based applications - from millimeters to several centimeters in size with micron precision.

Through the integration of its portfolio of products, Nano Dimension is offering the advantages of rapid prototyping, high-mix-low-volume production, IP security, minimal environmental footprint, and design-for-manufacturing capabilities, which are all unleashed with the limitless possibilities of AM.

For more information, please visit www.nano-di.com.

Forward Looking Statements

This press release contains forward-looking statements within the meaning of the “safe harbor” provisions of the Private Securities Litigation Reform Act of 1995 and other Federal securities laws. Words such as “expects,” “anticipates,” “intends,” “plans,” “believes,” “seeks,” “estimates” and similar expressions or variations of such words are intended to identify forward-looking statements. For example, Nano is using forward-looking statements in this press release when it discusses the potential benefits and advantages of Tarantula Underfill, market demand and the potential to customize solutions, and all other statements other than statements of historical fact that address activities, events or developments that Nano intends, expects, projects, believes or anticipates will or may occur in the future. Such statements are based on management’s beliefs and assumptions made based on information currently available to management. Because such statements deal with future events and are based on Nano Dimension’s current expectations, they are subject to various risks and uncertainties, and actual results, performance or achievements of Nano Dimension could differ materially from those described in or implied by the statements in this press release. The forward-looking statements contained or implied in this press release are subject to other risks and uncertainties, including those discussed under the heading “Risk Factors” in Nano Dimension’s Annual Report on Form 20-F filed with the Securities and Exchange Commission (“SEC”) on March 21, 2024, and in any subsequent filings with the SEC. Except as otherwise required by law, Nano Dimension undertakes no obligation to publicly release any revisions to these forward-looking statements to reflect events or circumstances after the date hereof or to reflect the occurrence of unanticipated events. References and links to websites have been provided as a convenience, and the information contained on such websites is not incorporated by reference into this communication. Nano Dimension is not responsible for the contents of third-party websites.

NANO DIMENSION INVESTOR RELATIONS CONTACT
Investor Relations | ir@nano-di.com

FAQ

What award did NNDM's Tarantula Underfill system win at SMTA International 2024?

Nano Dimension's Tarantula Underfill system won the Global Technology Award for Innovation at the SMTA International 2024 Show in Chicago.

What are the key features of NNDM's Tarantula Underfill system?

The system features non-contact heating for two-side populated PCBs and five valve options: time-pressure, volume dispensing, micro screw, solder paste jetting, and glue jetting.

Which industries are the primary targets for NNDM's Tarantula Underfill system?

The system primarily targets aerospace, defense, and heavy-duty sectors where electronics must withstand harsh conditions and require high durability.

How does NNDM's Tarantula Underfill system improve electronic components?

It enhances mechanical strength by reducing stresses from thermal expansion and vibration, while improving durability, reliability, thermal cycling, and moisture resistance.