SCHMID Group Expands Advanced Packaging Portfolio to Power the AI Era
SCHMID Group (NASDAQ:SHMD) announced an expanded advanced packaging portfolio on Oct 8, 2025, adding new InfinityLine models and substrate technologies to target AI-driven demand for server boards and advanced substrates.
Key product moves include InfinityLine C+ and plans to launch InfinityLine L+ (CMP) and InfinityLine P+ (single panel plating) in late 2025, plus QuantumLine, AVACO plasma equipment, and ET-Board Cu-damascene panel technology to support glass core substrates and CoWoP solutions.
The company cites market assumptions (semiconductor/advanced packaging ~10% CAGR, PCBs ~8% CAGR, AI server boards ~20% CAGR, IC-substrates ~15% CAGR) and describes 2025 as a transition year with expectations of above-market growth from 2026 onward.
SCHMID Group (NASDAQ:SHMD) ha annunciato un portfolio ampliato di packaging avanzato il 8 ottobre 2025, aggiungendo nuovi modelli InfinityLine e tecnologie di substrato per soddisfare la domanda guidata dall'IA per schede server e substrati avanzati.
Le principali mosse di prodotto includono InfinityLine C+ e piani per lanciare InfinityLine L+ (CMP) e InfinityLine P+ (placcatura singola pannello) nel tardo 2025, oltre a QuantumLine, attrezzature al plasma AVACO e tecnologia del pannello ET-Board Cu-damascene per supportare substrati in vetro e soluzioni CoWoP.
L'azienda cita ipotesi di mercato (semiconduttori/packaging avanzato ~10% CAGR, PCB ~8% CAGR, server AI boards ~20% CAGR, substrati IC ~15% CAGR) e descrive il 2025 come anno di transizione con aspettative di crescita oltre il mercato dal 2026 in poi.
Schmid Group (NASDAQ:SHMD) anunció una cartera ampliada de packaging avanzado el 8 de octubre de 2025, añadiendo nuevos modelos InfinityLine y tecnologías de sustrato para apuntar a la demanda impulsada por IA de placas servidor y sustratos avanzados.
Entre los movimientos clave de productos se incluyen InfinityLine C+ y planes para lanzar InfinityLine L+ (CMP) y InfinityLine P+ (galvanoplastia de un único panel) en finales de 2025, además de QuantumLine, equipo de plasma AVACO y tecnología de panel Cu-damascene ET-Board para apoyar sustratos de núcleo de vidrio y soluciones CoWoP.
La empresa cita supuestos de mercado (semiconductores/paquetes avanzados ~10% CAGR, PCB ~8% CAGR, placas de servidor AI ~20% CAGR, sustratos IC ~15% CAGR) y describe 2025 como año de transición con expectativas de crecimiento por encima del mercado a partir de 2026.
SCHMID Group (NASDAQ:SHMD)는 2025년 10월 8일에 확장된 첨단 패키징 포트폴리오를 발표하며, AI 구동 서버 보드 및 첨단 기판에 대한 수요를 겨냥해 새로운 InfinityLine 모델과 기판 기술을 추가했습니다.
핵심 제품 동향으로는 InfinityLine C+와 plans to launch InfinityLine L+ (CMP) 및 InfinityLine P+ (단일 패널 도금)를 2025년 말에 출시 계획이 포함되며, 또한 QuantumLine, AVACO 플라즈마 설비, ET-Board Cu-damascene 패널 기술이 글래스 코어(substrate) 기판 및 CoWoP 솔루션을 지원합니다.
회사는 시장 가정(반도체/고급 패키징 ~10% CAGR, PCB ~8% CAGR, AI 서버 보드 ~20% CAGR, IC 기판 ~15% CAGR)을 인용하고 2025년을 전환기로 설명하며 2026년 이후 시장보다 높은 성장 기대를 제시합니다.
Groupe SCHMID (NASDAQ:SHMD) a annoncé un portefeuille élargi d'emballage avancé le 8 octobre 2025, ajoutant de nouveaux modèles InfinityLine et des technologies de substrat pour cibler la demande alimentée par l'IA pour les cartes serveur et les substrats avancés.
Les principales évolutions produits incluent InfinityLine C+ et des plans pour lancer InfinityLine L+ (CMP) et InfinityLine P+ (plaque unique sur dalle) à la fin 2025, ainsi que QuantumLine, l'équipement plasma AVACO et la technologie de panneau Cu-damascene ET-Board pour soutenir les substrats à noyau en verre et les solutions CoWoP.
L'entreprise cite des hypothèses de marché (semiconducteurs/emballage avancé ~10% CAGR, PCB ~8% CAGR, serveurs IA cartes ~20% CAGR, substrats IC ~15% CAGR) et décrit 2025 comme une année de transition avec des attentes de croissance supérieur à celle du marché à partir de 2026.
SCHMID Group (NASDAQ:SHMD) kündigte am 8. Oktober 2025 ein erweitertes Portfolio im Bereich fortschrittliches Packaging an, indem neue InfinityLine-Modelle und Substrat Technologien hinzugefügt wurden, um die IA-gesteuerte Nachfrage nach Serverboards und fortschrittlichen Substraten zu bedienen.
Wichtige Produktentwicklungen umfassen InfinityLine C+ und Pläne, InfinityLine L+ (CMP) und InfinityLine P+ (Einzelpanel-Veredelung) im späten Jahr 2025 einzuführen, sowie QuantumLine, AVACO-Plasmaausrüstung und ET-Board Cu-Damascene-Paneltechnologie zur Unterstützung von Glaskern-Substraten und CoWoP-Lösungen.
Das Unternehmen nennt Markterwartungen (Halbleiter/fortschrittliches Packaging ~10% CAGR, PCBs ~8% CAGR, AI-Serverboards ~20% CAGR, IC-Substrate ~15% CAGR) und beschreibt 2025 als Übergangsjahr mit Erwartungen, über dem Marktdurchschnitt zu wachsen ab 2026.
مجموعة SCHMID (NASDAQ:SHMD) أعلنت عن توسيع محفظة التغليف المتقدم في 8 أكتوبر 2025، مضيفة طرازات InfinityLine جديدة وتقنيات رقاقة فرعية لاستهداف الطلب المدفوع بالذكاء الاصطناعي لبطاقات الخادم والركائز المتقدمة.
تشمل تحركات المنتجات الرئيسية InfinityLine C+ وخطط لإطلاق InfinityLine L+ (CMP) وInfinityLine P+ (طلاء لوحة واحدة) في أواخر 2025، بالإضافة إلى QuantumLine ومعدات بلازما AVACO وتكنولوجيا لوحة ET-Board Cu-damascene لدعم الركائز الزجاجية والحلول CoWoP.
تستشهد الشركة بافتراضات السوق (الموصّلات/التغليف المتقدم ~10% CAGR، لوحات الدارات المطبوعة PCB ~8% CAGR، لوحات خادم AI ~20% CAGR، ركائز IC ~15% CAGR) وتصف عام 2025 بأنه عاماً انتقالياً مع توقعات بنمو يفوق السوق اعتباراً من 2026 فصاعداً.
SCHMID Group (NASDAQ:SHMD) 在 2025年10月8日宣布扩大高端封装产品组合，新增InfinityLine型号与基板技术，以应对AI驱动的服务器板和高级基板需求。
关键产品动向包括 InfinityLine C+，并计划在 2025年晚些时候推出 InfinityLine L+（CMP）和 InfinityLine P+（单面镀层）以及 QuantumLine、AVACO等离子设备和 ET-Board Cu-damascene 面板技术，以支持玻璃芯基板和 CoWoP 解决方案。
公司列出市场假设（半导体/高级封装 ~10% CAGR，PCB ~8% CAGR，AI服务器板 ~20% CAGR，IC基板 ~15% CAGR），并描述 2025年为转型年，预计从 2026年起实现超出市场的增长。
- Expanded InfinityLine portfolio with new C+, L+, and P+ models
- Planned L+ and P+ launches in late 2025
- Technology add-ons: QuantumLine, AVACO plasma, ET-Board Cu-damascene
- Positioning for AI server-board demand with CoWoP capabilities
- Company describes 2025 as a transition year
- Key revenue uplift deferred to 2026 and beyond
- Product launches concentrated in late 2025 (timing risk)
Insights
SCHMID expands equipment lines to target AI-driven advanced packaging and server‑PCB demand, positioning for above‑market growth from
SCHMID broadened its InfinityLine family with new models (C+, L+, P+) and highlights QuantumLine, AVACO plasma, and ET‑Board Cu‑damascene technology to address advanced substrates and AI server boards. The announcement ties product expansion directly to specific market segments and growth rates: semiconductor/advanced packaging ~
Key dependencies and risks include successful commercialization and customer adoption of the new tools, on‑time launches in late
New InfinityLine Products and Glass Core Substrate Solutions Position SCHMID as a Key Enabler of Next-Generation Advanced Packaging Demands.
FREUDENSTADT, Germany, Oct. 08, 2025 (GLOBE NEWSWIRE) -- SCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product portfolio to meet the surging demand for two types of products: Advanced packaging substrates and high-performance server boards, in the era of Artificial Intelligence (AI).
The AI revolution is reshaping the semiconductor landscape. Global industry analysts project a compound annual growth rate (CAGR) of around
At the same time, the tradionell PCB industry is projected to grow at an
SCHMID expanded its Equipment Portfolio
To address these growth markets, SCHMID has broadened its InfinityLine product family:
- The existing InfinityLine H+ remains SCHMID’s top-selling equipment and continues to grow strongly in line with the market.
- The existing InfinityLine V+ meets the demands for increasingly complex high-end PCBs.
- The new InfinityLine C+ is on the way to becoming SCHMID’s second-largest revenue contributor.
- The new InfinityLine L+, a Chemical Mechanical Planarization (CMP) solution for panel-level substrates and
- The new InfinityLine P+, SCHMID’s next-generation single panel plating equipment, both to be launched in late 2025, are required to realize next generation substrate and AI-Server-PCB requirements.
With the existing product lines and the newly developed and introduced production equipment, SCHMID is positioned as a leader in enabling next-generation package substrates and AI-server PCBs with a now even broader product portfolio.
Enabling Next-Generation Substrates
Beyond the InfinityLine product family, SCHMID is driving technology leadership with:
- SCHMID QuantumLine and SCHMID-AVACO Plasma Equipment, enabling high-yield glass core substrate production.
- SCHMID ET-Board technology, supporting Cu-damascene manufacturing at panel level to deliver miniaturization at scale.
As AI companies increasingly demand Chip-on-Wafer-on-PCB (CoWoP) solutions, SCHMID is uniquely positioned to deliver best-in-class yield and the lowest cost of ownership across the industry.
Strong Outlook
With its expanded product portfolio and strong positioning in high-growth markets, SCHMID expects 2025 to remain a transition year. From 2026 onwards, the company anticipates above-market growth, particularly with its AI-driven product lines. These segments are projected to deliver disproportionate growth in 2026 and 2027, establishing themselves as the primary drivers of SCHMID’s overall revenue expansion.
Executive Statement
“The AI era is fundamentally transforming the electronics and semiconductor industries. SCHMID is proud to provide the critical technologies that enable glass core substrates, panel-level Cu damascene, and manufacturing solutions for next-generation AI-server boards. With our expanded InfinityLine portfolio, we are ready to lead this transformation together with our customers,” said Christian Schmid, CEO of SCHMID Group.
Forward-Looking Statements
This press release contains statements that constitute "forward-looking statements." All statements other than statements of historical fact included in this press release are forward-looking statements. Forward-looking statements are subject to numerous conditions, many of which are beyond the control of the Company, including those set forth in the "Risk Factors" section of the Company’s registration statement and final prospectus for the offering filed with the SEC. Copies are available on the SEC’s website, www.sec.gov. The Company undertakes no obligation to update these statements for revisions or changes after the date of this release, except as required by law.
About the SCHMID Group
The SCHMID Group is a global leader in providing solutions for the high-tech industry in the fields of electronics, photovoltaics, glass, and energy systems. SCHMID N.V. and Gebr. SCHMID GmbH are headquartered in Freudenstadt, Germany. Founded in 1864, the company currently employs over 800 people worldwide and operates technology centers and production facilities at multiple locations, including Germany and China, along with several global sales and service locations. The Group focuses on developing customized equipment and process solutions for a variety of industries, including electronics, renewable energy, and energy storage. Our system and process solutions for the production of substrates, printed circuit boards, and other electronic components ensure cutting-edge technology, high yields at low production costs, maximum efficiency, quality, and sustainability through environmentally friendly manufacturing processes.
For more information about the SCHMID Group, please visit: www.schmid-group.com
Contact:
press@schmid-group.com
A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/ebcafa56-c16a-4a36-ba96-ac9a090a2c22
FAQ
What did SCHMID (SHMD) announce on October 8, 2025 regarding product expansion?
How does SCHMID say its new products address AI server-board demand for SHMD shareholders?
When does SCHMID (SHMD) expect the product expansion to drive above-market growth?
What market growth rates did SCHMID cite that support its strategy for SHMD?
Which SCHMID technologies are highlighted to improve manufacturing yields for substrates?
