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SCHMID Group Records More than €26 Million Order Intake since Mid-May, Driven by AI Infrastructure and Optical Module Demand

SCHMID Group (NASDAQ: SHMD) reported order intake of more than €26 million since mid-May 2026, mainly for InfinityLine equipment used in AI infrastructure and optical module supply chains.

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SCHMID Group (NASDAQ: SHMD) reported order intake of more than €26 million since mid-May 2026, mainly for InfinityLine equipment used in AI infrastructure and optical module supply chains.

Total order intake from January 1 to June 15, 2026 reached approximately €43 million, with demand led by HDI-ML and mSAP technologies in Asia and Europe.

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Positive

  • Order intake of more than €26 million since mid-May 2026
  • Total 2026 order intake about €43 million through June 15
  • Demand centered on HDI-ML and mSAP InfinityLine equipment for AI and networking
  • Orders primarily from China, Taiwan, South Korea plus incremental business in Europe

Negative

  • None.
Argus Jun 16 session
-0.64% close to close Open Argus
Details

News Market Reaction – SHMD

On Jun 16, the day this news came out, SHMD closed 0.64% below the previous close.

Data tracked by StockTitan Argus for the Jun 16 session.

Key Figures

Order intake since mid-May 2026: more than €26 million Order intake YTD 2026: approximately €43 million Yield performance: above 99%
Order intake since mid-May 2026
more than €26 million
Combined customer orders for InfinityLine equipment
Order intake YTD 2026
approximately €43 million
Total from Jan 1, 2026 to Jun 15, 2026
Yield performance
above 99%
Targeted yield performance supported by SCHMID equipment

Previous AI Reports

3 past events · Latest: Mar 11
Same Type 3 events
  1. Mar 11

    AI equipment order

    24h Move
    +10.6%

    Major wet-process equipment order for AI and HPC infrastructure production lines.

  2. Oct 22

    AI server PCB orders

    24h Move
    -3.7%

    Significant wet-process orders for AI server PCB production equipment in Asia.

  3. Oct 08

    AI packaging portfolio

    24h Move
    -7.8%

    Expanded advanced packaging portfolio targeting AI server boards and substrates.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Key Terms

high-density interconnect multilayer (hdi-ml), modified semi-additive processing (msap)
2 terms
high-density interconnect multilayer (hdi-ml) technical
"InfinityLine Production Equipment for High-Density Interconnect Multilayer (HDI-ML) and modified"
A high-density interconnect multilayer (HDI-ML) is a type of printed circuit board built with many thin conductive layers and tightly packed connections, allowing more electronic components in a smaller area. Think of it like a multi-story apartment with lots of compact wiring between floors, enabling faster signals and smaller, lighter devices. Investors care because HDI-ML technology supports high-performance consumer and industrial electronics, influencing product competitiveness, manufacturing complexity, and supply-chain costs.
modified semi-additive processing (msap) technical
"Interconnect Multilayer (HDI-ML) and modified Semi-Additive Processing (mSAP) applications serving"
Modified semi-additive processing (mSAP) is a manufacturing method used to create very thin, precise metal traces on semiconductor chips and circuit boards by building up metal only where needed rather than carving it away. Investors care because mSAP enables smaller, faster, and more power-efficient electronic components while often lowering material waste and manufacturing cost, so adoption can improve a supplier’s product performance, yield, and competitive position in chip and package markets.

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FREUDENSTADT, Germany, June 16, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD) (the “Company” or "SCHMID") announces a strong combined order intake of more than €26 million since mid-May 2026, reflecting multiple customer orders and continued market momentum in advanced PCB and substrate manufacturing technologies for AI infrastructure and next-generation optical module supply chains.

The recent order intake reflects continued momentum across SCHMID’s InfinityLine Production Equipment, driven primarily by orders secured in China, Taiwan, and South Korea and complemented by incremental business in Europe. Together, these wins confirm sustained customer investment in high-performance electronics manufacturing and further strengthen SCHMID’s position in next-generation interconnect technologies.

The orders, secured from several customers, cover InfinityLine Production Equipment for High-Density Interconnect Multilayer (HDI-ML) and modified Semi-Additive Processing (mSAP) applications serving AI servers, high-speed networking, optical communication modules, advanced interconnect platforms, and next-generation data infrastructure. The orders demonstrate that the market pipeline for advanced PCB technologies is not only building, but converting into confirmed technology and capacity investment.

Executive Statement

“AI infrastructure is driving a step-change in advanced interconnect manufacturing. As layer counts increase and design rules become more demanding, yield performance becomes the decisive factor for profitable high-volume production. This is where SCHMID creates measurable customer value. Our equipment delivers the process stability, uptime, and manufacturing precision required to support yield performance above 99%. The recent order intake confirms that the market is moving from technology evaluation and qualification into capacity investment — and that SCHMID is strongly positioned to capture the next growth wave in HDI-ML and mSAP for AI infrastructure, high-speed networking, and optical module applications. We see a strong second half of 2026 and continued momentum into 2027, as customers accelerate capacity investments for the next phase of AI infrastructure build-out,” said Roland Rettenmeier, Chief Sales Officer of SCHMID Group.

Market Development

HDI-ML remains the strongest contributor to the recent order intake, with multiple investments secured primarily from customers in China, Taiwan, and South Korea, complemented by additional business in Europe. These projects are linked to capacity expansion and technology upgrades for advanced multilayer printed circuit boards used in high-performance computing, data center, high-speed networking, and communication infrastructure applications.

This regional mix supports SCHMID’s view that advanced interconnect demand remains structurally strong, led by Asia’s core electronics manufacturing ecosystem and selectively expanding in other regions. Customers are investing in higher layer counts, tighter design rules, improved signal integrity, and scalable production for next-generation electronics.

mSAP also contributed to the recent business, underlining SCHMID’s position in the transition toward finer-line PCB manufacturing. mSAP technology is increasingly relevant as the industry moves toward higher routing density, improved electrical performance, and more compact system architectures.

Combined, these orders represent a total order intake of more than €26 million since mid-May 2026. The total order intake from January 1, 2026 until June 15, 2026 thus amounted to approximately €43 million.

SCHMID expects continued momentum in these segments as customers move from evaluation and qualification into capacity investment. SCHMID's pipeline for HDI-ML and mSAP production equipment continues to strengthen, supported by structural growth trends in AI infrastructure, advanced networking, optical communication, and high-density electronics manufacturing.

Forward-Looking Statements

This press release contains statements that constitute "forward-looking statements". All statements other than statements of historical fact included in this press release are forward-looking statements. Forward-looking statements are subject to numerous conditions, many of which are beyond the control of the Company, including those set forth in the "Risk Factors" section of the Company’s registration statement and final prospectus for the offering filed with the SEC. Copies are available on the SEC’s website, www.sec.gov. The Company undertakes no obligation to update these statements for revisions or changes after the date of this release, except as required by law.

About the SCHMID Group

The SCHMID Group is a global leader in providing solutions for the high-tech industry in the fields of electronics, photovoltaics, glass, and energy systems. SCHMID N.V. and Gebr. SCHMID GmbH are headquartered in Freudenstadt, Germany. Founded in 1864, the company currently employs over 800 people worldwide and operates technology centers and production facilities at multiple locations, including Germany and China, along with several global sales and service locations. The Group focuses on developing customized equipment and process solutions for a variety of industries, including electronics, renewable energy, and energy storage. Our system and process solutions for the production of substrates, printed circuit boards, and other electronic components ensure cutting-edge technology, high yields at low production costs, maximum efficiency, quality, and sustainability through environmentally friendly manufacturing processes.
For more information about the SCHMID Group, please visit: www.schmid-group.com

Contact
Press@schmid-group.com


FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

What order intake did SCHMID Group (NASDAQ: SHMD) report since mid-May 2026?

SCHMID Group reported order intake of more than €26 million since mid-May 2026. According to SCHMID Group, these orders cover InfinityLine equipment for HDI-ML and mSAP applications in AI servers, high-speed networking, optical communication modules, and next-generation data infrastructure.

What is SCHMID Group's total 2026 order intake as of June 15, 2026?

SCHMID Group reported total order intake of approximately €43 million from January 1 to June 15, 2026. According to SCHMID Group, this figure includes more than €26 million of orders booked since mid-May, highlighting ongoing demand in advanced PCB and substrate manufacturing technologies.

Which regions are driving SCHMID Group (SHMD) orders for AI infrastructure equipment in 2026?

SCHMID Group indicates that China, Taiwan, and South Korea are the main drivers of recent orders. According to SCHMID Group, these Asian customers, complemented by incremental business in Europe, are investing in capacity expansion and technology upgrades for advanced multilayer PCBs and interconnect platforms.

How is SCHMID Group's InfinityLine equipment used in AI servers and optical modules?

InfinityLine equipment is used for HDI-ML and mSAP PCB processes serving AI servers and optical modules. According to SCHMID Group, these systems support higher layer counts, tighter design rules, and improved signal integrity for high-performance computing, high-speed networking, and advanced communication infrastructure.

What outlook did SCHMID Group provide for HDI-ML and mSAP demand into 2027?

SCHMID Group expects continued momentum in HDI-ML and mSAP as customers shift from evaluation to capacity investment. According to SCHMID Group, structural growth in AI infrastructure, advanced networking, optical communication, and high-density electronics underpins a strengthening equipment pipeline into the second half of 2026 and 2027.

How does SCHMID Group describe yield performance for its InfinityLine production equipment?

SCHMID Group states its equipment supports yield performance above 99% for demanding advanced interconnect manufacturing. According to SCHMID Group, process stability, uptime, and manufacturing precision are key factors as layer counts rise and design rules tighten in AI infrastructure and high-speed networking applications.

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