SCHMID Group secures major orders for Panel Level Packaging (PLP) and modified-Semi-Additive (mSAP) production equipment
SCHMID Group (NASDAQ: SHMD) announced on November 10, 2025 that it secured two significant equipment orders for Panel Level Packaging (PLP) and modified-Semi-Additive (mSAP) production. One order supplies a cluster of InfinityLine C+ and InfinityLine H+ systems to a Southeast Asia customer that supplies semiconductors and infrastructure software. The second order supplies InfinityLine H+ and InfinityLine V+ machines to a Chinese electronics interconnect manufacturer to expand mSAP capacity for AI server PCBs.
The release ties the orders to accelerating AI-driven semiconductor demand and cites industry forecasts for rising semiconductor revenues and AI server shipments, positioning SCHMID as an enabler of advanced packaging scale-up.
SCHMID Group (NASDAQ: SHMD) ha annunciato 10 novembre 2025 che ha assicurato due ordini importanti di attrezzature per Panel Level Packaging (PLP) e produzione con Semi-Additive Modificata (mSAP). Un ordine fornisce un cluster di sistemi InfinityLine C+ e InfinityLine H+ a un cliente del Sud-Est asiatico che fornisce semiconduttori e software infrastrutturale. Il secondo ordine fornisce macchine InfinityLine H+ e InfinityLine V+ a un produttore cinese di interconnessioni elettroniche per espandere la capacità mSAP per PCB di server AI.
Il comunicato collega gli ordini all’accelerazione della domanda di semiconduttori guidata dall’AI e cita previsioni di settore per crescenti ricavi dei semiconduttori e spedizioni di server AI, posizionando SCHMID come abilitatore dell’aumento di scala dell’imballaggio avanzato.
SCHMID Group (NASDAQ: SHMD) anunció el 10 de noviembre de 2025 que obtuvo dos importantes pedidos de equipos para Panel Level Packaging (PLP) y producción de Semi-Additive Modificada (mSAP). Un pedido suministra un grupo de sistemas InfinityLine C+ y InfinityLine H+ a un cliente del sudeste asiático que provee semiconductores y software de infraestructura. El segundo pedido suministra máquinas InfinityLine H+ y InfinityLine V+ a un fabricante chino de interconexión electrónica para ampliar la capacidad mSAP para PCBs de servidores AI.
El comunicado vincula los pedidos a la aceleración de la demanda de semiconductores impulsada por la IA y cita previsiones de la industria sobre ingresos de semiconductores en aumento y envíos de servidores AI, posicionando a SCHMID como enabling del escalado de packaging avanzado.
SCHMID Group (NASDAQ: SHMD)는 2025년 11월 10일에 Panel Level Packaging(PLP) 및 수정된 세미-애디티브(mSAP) 생산을 위한 두 건의 중요한 설비 주문을 확보했다고 발표했습니다. 하나의 주문은 남동아시아의 반도체 및 인프라 소프트웨어 공급업체에 InfinityLine C+ 및 InfinityLine H+ 시스템군을 공급합니다. 두 번째 주문은 중국의 전자 인터커넥트 제조업체에 InfinityLine H+ 및 InfinityLine V+ 기계를 공급하여 AI 서버 PCB용 mSAP 생산 능력을 확장합니다.
공시는 AI 주도 반도체 수요의 가속화와 업계 전망에 따라 반도체 매출 증가 및 AI 서버 출하가 증가할 것으로 예측되며, SCHMID를 첨단 패키징의 확장 가능성의 촉진자로 위치시킵니다.
Groupe SCHMID (NASDAQ: SHMD) a annoncé le 10 novembre 2025 avoir obtenu deux importants commandes d'équipements pour le Panel Level Packaging (PLP) et la production mSAP (semi-additive modifiée). Une commande fournit un cluster de systèmes InfinityLine C+ et InfinityLine H+ à un client d’Asie du Sud-Est qui fournit des semiconducteurs et des logiciels d’infrastructure. La seconde commande fournit les machines InfinityLine H+ et InfinityLine V+ à un fabricant chinois d’interconnexions électroniques pour étendre la capacité mSAP pour les PCB de serveurs IA.
Le communiqué relie les commandes à une accélération de la demande de semiconducteurs stimulée par l’IA et cite des prévisions d’industrie pour des revenus de semiconducteurs en hausse et des expéditions de serveurs IA, positionnant SCHMID comme un facilitateur de l’augmentation d’échelle de l’empaquetage avancé.
SCHMID Group (NASDAQ: SHMD) gab am 10. November 2025 bekannt, dass es zwei bedeutende Anlagenaufträge für Panel Level Packaging (PLP) und modifiziertes Semi-Additiv (mSAP) in der Produktion erhalten hat. Einer der Aufträge liefert einen Cluster von InfinityLine C+ und InfinityLine H+ Systemen an einen Kunden in Südostasien, der Halbleiter und Infrastruktursoftware anbietet. Der zweite Auftrag liefert InfinityLine H+ und InfinityLine V+ Maschinen an einen chinesischen Hersteller elektronischer Interconnects, um die mSAP-Kapazität für AI-Server-PCBs zu erweitern.
Die Pressemitteilung verbindet die Aufträge mit der beschleunigten AI-getriebenen Nachfrage nach Halbleitern und nennt Branchenaussichten für steigende Halbleiterumsätze und AI-Server-Lieferungen, wodurch SCHMID als Ermöglicher der Skalierung fortschrittlicher Packaging-Lösungen positioniert wird.
مجموعة SCHMID (ناسداك: SHMD) أعلنت في 10 نوفمبر 2025 أنها أتمت صفقتين كبيرتين من الطلبات للمعدات من أجل تغليف المستوى اللوحي (PLP) والإنتاج المعدَّل شبه الإضافي (mSAP). أحد الطلبات يزوّد كتلة من أنظمة InfinityLine C+ وInfinityLine H+ لعميل في جنوب شرق آسيا يزوّد شرائح ومكونات برمجيات البنية التحتية. الطلب الآخر يزوّد آلات InfinityLine H+ وInfinityLine V+ إلى مصنع صيني للربط الإلكتروني لتوسيع سعة mSAP للوحات الدوائر المطبوعة لخوادم AI.
يربط البيان بين الطلبات وزيادة الطلب المدفوع بالذكاء الاصطناعي على الرقائق، ويستشهد بتوقعات الصناعة لارتفاع عوائد الرقائق وشحنات الخوادم AI، مما يضع SCHMID كمُمكِّن لتوسع التغليف المتقدم.
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Insights
SCHMID secured major PLP and mSAP equipment orders, signaling near-term revenue tailwinds tied to AI-driven capacity expansion.
SCHMID Group will supply cluster configurations of InfinityLine C+, H+, and V+ systems to two large customers in Southeast Asia and China, directly expanding panel-level packaging and mSAP production capacity for AI server and advanced PCB supply chains. The transactions represent concrete equipment orders that typically translate into multi‑quarter delivery, installation, and service revenue streams.
These orders depend on customer capital deployment and successful on-site integration; execution risk centers on delivery schedules, acceptance testing, and potential customization needs. The release cites industry demand drivers with
Watch order delivery milestones, machine acceptance dates, and any disclosed contract values or cadence over the next 6–18 months to gauge revenue recognition and margin impact. If published, monitor installation timelines and service/backlog metrics in upcoming company disclosures around
FREUDENSTADT, Germany, Nov. 10, 2025 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD), a global equipment maker and solution provider for Printed Circuit Boards (PCB) and IC-Substrate manufacturing, today announced the successful acquisition of two significant orders in the fast-growing field of Panel Level Packaging and mSAP production Equipment.
In one project, SCHMID will deliver a cluster configuration of its InfinityLine C+ as well as InfinityLine H+ equipment to one of its customers in Southeast Asia. A leading global technology company that operates at the intersection of semiconductors and infrastructure software, delivering connectivity, storage, and computing solutions that power data centers, mobile networks, and enterprise systems worldwide. Its portfolio spans high-performance chips, custom silicon, and security-driven software platforms that enable cloud, AI, and 5G innovation. Through strategic acquisitions and continuous R&D investment, the company has built a resilient, diversified business model combining hardware excellence with recurring software revenue, positioning it as a key enabler of next-generation digital infrastructure. in Southeast Asia.
The second project involves the supply of horizontal InfinityLine H+ and vertical InfinityLine V+ machines for a customer in China for the expansion of its mSAP capacities, mainly for AI Server PCB and similar products. This customer is a leading manufacturer in the electronics interconnect industry specializes in high-end printed circuit boards (PCBs), IC substrates, and electronic assembly solutions that support advanced computing, communication, and automotive systems worldwide. The company provides comprehensive design-to-manufacturing capabilities, enabling large-scale production for AI servers, 5G infrastructure, and consumer electronics. With continuous investment in R&D, automation, and sustainable production, it has established a reputation for technological excellence and reliability, serving as a key enabler of next-generation semiconductor packaging and system integration.
Market Context: AI and Semiconductor Growth
The orders once again underscore SCHMID Group’s growing role in enabling advanced electronics manufacturing at a time of unprecedented AI-driven demand.
According to IDC, global semiconductor revenues are projected to reach
This surge in AI infrastructure investment is reshaping the IC-substrate and advanced PCB ecosystem. TechSearch International notes a sharp rise in demand for large-body substrates as designs integrate more high-bandwidth memory (HBM) stacks and adopt co-packaged optics (CPO) to meet next-generation performance and bandwidth requirements. These dynamics further underscore the strategic relevance of SCHMID’s advanced process equipment portfolio, which enables scalable, high-yield manufacturing for next-generation packaging technologies.
Executive Statement
“These projects reflect our customers’ confidence in SCHMID’s capability to deliver reliable, scalable production solutions for next-generation Advanced Packaging,” said Roland Rettenmeier, CSO of SCHMID Group. “The surge in AI-driven semiconductor demand is redefining requirements for IC-substrates and advanced PCBs. With our InfinityLine product family and our innovative technologies, we enable our partners to achieve the performance, yield, and sustainability targets essential for this new era of high-density packaging.”
Forward-Looking Statements
This press release contains statements that constitute "forward-looking statements." All statements other than statements of historical fact included in this press release are forward-looking statements. Forward-looking statements are subject to numerous conditions, many of which are beyond the control of the Company, including those set forth in the "Risk Factors" section of the Company’s registration statement and final prospectus for the offering filed with the SEC. Copies are available on the SEC’s website, www.sec.gov. The Company undertakes no obligation to update these statements for revisions or changes after the date of this release, except as required by law.
About the SCHMID Group
The SCHMID Group is a global leader in providing solutions for the high-tech industry in the fields of electronics, photovoltaics, glass, and energy systems. SCHMID N.V. and Gebr. SCHMID GmbH are headquartered in Freudenstadt, Germany. Founded in 1864, the company currently employs over 800 people worldwide and operates technology centers and production facilities at multiple locations, including Germany and China, along with several global sales and service locations. The Group focuses on developing customized equipment and process solutions for a variety of industries, including electronics, renewable energy, and energy storage. Our system and process solutions for the production of substrates, printed circuit boards, and other electronic components ensure cutting-edge technology, high yields at low production costs, maximum efficiency, quality, and sustainability through environmentally friendly manufacturing processes.
For more information about the SCHMID Group, please visit: www.schmid-group.com
Sources for market data:
TechSearch International, Advanced Packaging Update, Volume 2 – July 2025; IDC; TrendForce.
Contact
Press@schmid-group.com
A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/51ef63b0-fb14-455d-a887-b3184224753a
FAQ
What did SCHMID (SHMD) announce on November 10, 2025?
Which SCHMID InfinityLine systems are included in the November 10, 2025 orders for SHMD?
Which regions are the customers located in for SCHMID's (SHMD) recent PLP and mSAP orders?
What end markets do SCHMID's ordered systems target in the November 10, 2025 announcement?
How does SCHMID (SHMD) position these orders versus industry trends?
Will SCHMID (SHMD) update financial guidance related to the November 10, 2025 orders?
