Silicon Labs Unveils First Series 3 SoCs, Powering the Next Wave of IoT Breakthroughs
- Advanced 22nm process node enables higher performance and efficiency
- SiXG301 features high memory capacity with 4MB Flash and 512kB RAM
- Concurrent multi-protocol support reduces manufacturing costs and simplifies SKUs
- SiXG302 achieves 30% lower power consumption at 15 µA/MHz compared to competitors
- SiXG302 won't be available for customer sampling until 2026
- General availability of SiXG301 delayed until Q3 2025
Insights
Silicon Labs' new 22nm SoCs deliver significant IoT advancements with improved processing power, efficiency, and security for smart devices.
Silicon Labs has made a significant technological leap with its first Series 3 SoCs fabricated at the 22nm process node. This represents a major manufacturing advancement from their previous generations, enabling substantial improvements in performance and efficiency.
The new families - SiXG301 (for line-powered applications) and SiXG302 (for battery-powered devices) - directly address two critical IoT market segments with tailored solutions. The SiXG301's 4MB Flash and 512kB RAM specifications are particularly noteworthy, offering substantial overhead for future-proofing against expanding Matter protocol requirements.
From a technical perspective, the concurrent multi-protocol operation is a standout feature. Supporting Zigbee, Bluetooth and Matter over Thread simultaneously addresses a major pain point in IoT deployments - protocol fragmentation. This could significantly streamline manufacturing and deployment challenges that have hampered IoT adoption.
The SiXG302's power efficiency metrics are equally impressive, with 15 µA/MHz active current consumption representing a 30% improvement over competitive offerings. This level of efficiency is crucial for extending battery life in deployed IoT sensors, one of the most significant barriers to widespread adoption.
The migration to 22nm process technology isn't just about power efficiency - it enables greater integration of peripheral functions like the LED pre-driver in the SiXG301, reducing component count and board space requirements. This should translate to smaller form factors and potentially lower manufacturing costs for OEMs adopting these chips.
The staggered release schedule (SiXG301 in Q3 2025 with SiXG302 sampling in 2026) suggests Silicon Labs is prioritizing the higher-margin, line-powered market first while perfecting the more challenging battery-optimized designs.
The introduction of Silicon Labs' Series 3 platform represents a meaningful evolution for IoT implementers facing increasing complexity in smart device deployments. By delivering multiprotocol support (Bluetooth, Zigbee, and Thread with Matter) on a single chip, these SoCs directly address the fragmentation issues that have complicated IoT ecosystems.
For commercial and industrial IoT deployments, the SiXG301's concurrent multi-protocol operation is particularly valuable. It enables devices to simultaneously communicate across different network types, reducing gateway requirements and simplifying network architecture. This translates to fewer SKUs for manufacturers and more flexible deployment options for system integrators.
The advanced 22nm process node represents a significant architectural advancement that enables better performance without sacrificing energy efficiency. This is critical for edge computing applications where local processing reduces cloud dependencies and improves response times for time-sensitive applications.
For battery-powered applications, the SiXG302's 15 µA/MHz active current consumption addresses one of the most persistent challenges in IoT deployments - battery replacement logistics. Extended battery life dramatically improves the economics of large-scale sensor networks in applications like industrial monitoring, smart agriculture, and commercial building management.
The high memory specifications (4MB Flash, 512kB RAM) are forward-looking, accounting for the increasing complexity of IoT protocols and application requirements. This future-proofing is particularly important as Matter continues to evolve and expand its capabilities, preventing premature hardware obsolescence.
While Silicon Labs isn't the first to reach the 22nm node for IoT applications, their focus on wireless performance and protocol flexibility positions these SoCs as specialized solutions rather than generic microcontrollers with wireless capabilities bolted on. This integration-first approach aligns with the industry trend toward purpose-built IoT silicon.
SiXG301 and SiXG302, Silicon Labs' first wireless SoC families at the 22 nm process node, deliver breakthroughs in compute, power efficiency, integration and security
As smart devices grow more sophisticated and compact, the need for powerful, secure, and highly integrated wireless solutions has never been greater. The new Series 3 SoCs deliver on this promise with advanced processing capabilities, flexible memory options, best-in-class security, and streamlined external component integration. Silicon Labs' Series 1, Series 2, and Series 3 platforms will continue to complement one another in the market and address the full breadth of IoT applications.
The new Series 3 families of SoCs include:
- SiXG301: Optimized for Line-Powered Applications
Purpose-built for line-powered smart devices, the SiXG301 includes an integrated LED pre-driver and offers an ideal solution for advanced LED smart lighting and smart home products, supporting Bluetooth, Zigbee, and Thread with support for Matter. Built with high Flash and RAM overhead of 4 MB and 512 kB, respectively, the SiXG301 helps future-proof customer designs as the requirements for Matter and other more demanding IoT applications continue to grow. This SoC enables concurrent multi-protocol operation for Zigbee, Bluetooth and Matter over Thread networks at the same time, which helps simplify manufacturing SKUs, reduce costs, save board space for additional device integrations, and improve consumer usability. Already in production with select customers, the SiXG301 is slated for general availability in Q3 2025. - SiXG302: Designed for Battery-Powered Efficiency
Expanding Series 3 to battery-powered applications, the upcoming SiXG302 will deliver groundbreaking energy efficiency without sacrificing performance. Featuring Silicon Labs' advanced power architecture, the SiXG302 is designed to use only 15 µA/MHz active current,30% lower than competitive devices in its class. This makes it ideal for battery-powered wireless sensors and actuators for both Matter and Bluetooth applications. The SiXG302 is planned for customer sampling in 2026.
"Smart devices are becoming more complex, and designers are challenged to pack greater functionality into smaller spaces while maintaining energy efficiency," said Ross Sabolcik, Senior Vice President of Product Lines at Silicon Labs. "With the SiXG301 and upcoming SiXG302 families, we're delivering flexible, highly integrated solutions that enable next-generation IoT devices—whether they're plugged in or running on battery power."
The SiXG301 and SiXG302 families will initially include "M" devices for multiprotocol, the SiMG301 and SiMG302, and "B" devices optimized for Bluetooth LE communications, the SiBG301 and SiBG302.
By leveraging the 22 nm process node for all Series 3 devices, Silicon Labs is addressing the growing demand for more powerful and efficient far-edge devices across a wide range of IoT applications—from smart cities and industrial automation to healthcare, smart homes, and beyond. These new SoCs offer device makers a scalable, secure platform to create the next wave of innovative, high-performance IoT products.
Learn More About the Series 3 Platform at Works With 2025
To learn more about the Series 3 platform and how it is advancing wireless connectivity, visit:
Additionally, Silicon Labs will highlight the SiXG301 along with its portfolio of industry-leading innovations during the 2025 Works With conference series. This global event brings together industry experts to explore the best practices, emerging technologies, and transformative trends shaping the industry. The conference will be hosted across multiple international locations, with a virtual edition available for broader accessibility:
- Works With Summit: October 1-2 in
Austin, TX - Works With Shenzhen: October 23
- Works With Bangalore: October 30
- Works With Virtual: November 19-20
Learn more about Works With today.
About Silicon Labs Silicon Labs (NASDAQ: SLAB) is the leading innovator in low-power wireless connectivity, building embedded technology that connects devices and improves lives. Merging cutting-edge technology into the world's most highly integrated SoCs, Silicon Labs provides device makers with the solutions, support, and ecosystems needed to create advanced edge connectivity applications. Headquartered in Austin,
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