Synopsys Inc Stock Price, News & Analysis

Synopsys (Nasdaq: SNPS) has scheduled its third quarter fiscal year 2025 earnings release and conference call. The company will announce its financial results on Tuesday, September 9, 2025, after market close, followed by a conference call at 2:00 p.m. Pacific Time / 5:00 p.m. Eastern Time.

The earnings conference call will be accessible via live webcast on the company's investor relations website, where financial and statistical information will be available before the call. A replay will be available following the call until the Q4 and fiscal year 2025 results announcement.

Ansys (NASDAQ: ANSS) has unveiled its 2025 R2 release, introducing significant AI-powered enhancements across its simulation portfolio. The key innovation is Ansys Engineering Copilot, an AI assistant integrated into Ansys products that provides instant access to over 50 years of simulation expertise.

The release features seven products with built-in AI+ functionality, including the new Missions AI+ ODTK tool for orbital accuracy. Notable improvements include 17x faster radiation pattern calculations, expanded Python compatibility with over 40 libraries, and enhanced data management capabilities. The update also introduces GPU acceleration in Icepak software and Cloud Burst Compute availability across six products.

This release focuses on three main areas: AI-driven tools for intuitive simulations, improved data handling and automation, and advanced computation capabilities for real-world modeling.

Synopsys (NASDAQ: SNPS) has completed its acquisition of Ansys, creating a powerhouse in engineering solutions from silicon to systems. The strategic combination, initially announced on January 16, 2024, positions Synopsys to compete in an expanded $31 billion total addressable market.

The merger brings together leaders in silicon design, IP, and simulation analysis, enabling faster innovation in AI-powered products. Former Ansys executives Ajei Gopal and Ravi Vijayaraghavan are joining Synopsys' board of directors. The company plans to launch its first integrated capabilities in H1 2026, focusing on multiphysics across the EDA stack and multi-die advanced packaging.

Synopsys (Nasdaq: SNPS) has secured all required regulatory approvals for its planned acquisition of ANSYS (Nasdaq: ANSS). The transaction is expected to close around July 17, 2025, pending satisfaction of remaining customary conditions.

The strategic acquisition, initially announced on January 16, 2024, will combine Synopsys' silicon design and IP solutions with Ansys' simulation and analysis portfolio. This merger aims to create a leading provider of engineering solutions from silicon to systems, enhancing capabilities for AI-powered product innovation.

Synopsys (Nasdaq: SNPS) announced that the U.S. Department of Commerce's Bureau of Industry and Security has lifted certain export restrictions to China that were previously imposed on May 29, 2025. The company received official notification on July 2, 2025, confirming the immediate rescission of these restrictions.

The company is now actively working to restore access to previously restricted products in the Chinese market while continuing to evaluate the broader impact of export restrictions on its business operations, results, and financial performance.

Synopsys (Nasdaq: SNPS) and Ansys (NASDAQ: ANSS) provided an update on their pending acquisition's regulatory approval status. The companies have successfully obtained merger clearance in all jurisdictions except China, where they are in advanced stages of obtaining approval from the State Administration for Market Regulation.

The companies emphasized that the transaction has been approved in other jurisdictions based on its merits and anticipated benefits for stakeholders and future technology innovation. They continue to work collaboratively with Chinese regulators to secure the final necessary approval.

Synopsys (NASDAQ: SNPS) and Ansys (NASDAQ: ANSS) provided an update on their pending acquisition's regulatory approval status. The companies have successfully obtained merger clearance in all jurisdictions except China, where they are in advanced discussions with the State Administration for Market Regulation (SAMR).

The companies emphasized that the merger approvals received so far were based on the transaction's merits and its expected benefits for stakeholders and future technology innovation. They continue to work collaboratively with Chinese regulators to secure the final necessary approval.

Synopsys and Samsung Foundry announced a strengthened collaboration to advance AI and multi-die design innovation. Key highlights include a successful HBM3 customer tape-out on Samsung's SF2 process using Synopsys 3DIC Compiler, reducing turnaround time by 10X. The partnership features new AI-driven digital and analog flows certified for Samsung's SF2P process, along with design technology co-optimization delivering superior power, performance, and area results. Synopsys is expanding its IP portfolio on Samsung's advanced nodes, including 224G, UCIe, MIPI, and LPDDR6 technologies. The collaboration achieved significant improvements in HBM routing time (reduced to 4 hours) and enhanced worst-case eye opening by 6%. The partnership encompasses comprehensive IP solutions across Samsung's process nodes from 14LPP/U to SF2P/A, supporting various applications in HPC, consumer electronics, mobile, IoT, and automotive markets.

Synopsys (SNPS) has achieved a significant PCIe 6.x interoperability milestone with Broadcom's PEX90000 series switch, demonstrated at PCI-SIG DevCon 2025. The collaboration showcases successful interoperability between Synopsys' PCIe 6.x IP solution and Broadcom's switch, operating at 64 GT/s. This achievement is crucial for next-generation AI infrastructures, as PCIe switches are essential for scaling modern AI workloads. Synopsys' PCIe 6.x IP solution includes PHY and controller components, and the company has completed over 100 PCIe 6.x IP implementations and 3,800 customer tapeouts across seven PCIe generations. The interoperability demonstration validates that future products integrating these solutions will work seamlessly within the ecosystem, reducing design risk and accelerating time-to-market for high-performance computing and AI data center systems.