Synopsys Collaborates with TSMC to Enable 2D and 3D Design Solutions

Rhea-AI Summary

Synopsys (NASDAQ: SNPS) announced that TSMC has certified its Ansys portfolio of simulation and analysis solutions for TSMC's advanced manufacturing processes including N3C, N3P, N2P, and A16™. The collaboration includes an AI-assisted design flow for the TSMC-COUPE™ platform.

Key certifications include Ansys RedHawk-SC and Ansys Totem for power integrity verification, HFSS-IC Pro for electromagnetic modeling on TSMC's N5 and N3P processes, and PathFinder-SC™ for ESD current density checking on N2P process. The partnership enables multiphysics analysis flows and AI-driven photonics optimization, supporting the development of chips for AI acceleration, high-speed communications, and advanced computing.

Positive

• Certification for multiple advanced TSMC process nodes (N3C, N3P, N2P, and A16)
• AI-assisted optimization workflow implementation for improved design efficiency
• Expanded multiphysics analysis capabilities for large 3DIC designs
• New certification for ESD current density checking on N2P process

Negative

• None.

Insights

Semiconductor Technology Expert

Synopsys-TSMC collaboration strengthens advanced chip design capabilities, enabling faster development cycles for AI and high-performance computing technologies.

This collaboration between Synopsys and TSMC represents a significant advancement in semiconductor design enablement for cutting-edge process nodes. TSMC has certified Synopsys' Ansys portfolio for their most advanced manufacturing processes including N3C, N3P, N2P, and A16™ technologies, which are critical for next-generation chip development.

The partnership introduces an AI-assisted optimization workflow that enhances TSMC's COUPE™ (compact universal photonic engine) platform. This integration of Ansys optiSLang, Zemax OpticStudio, and Lumerical FDTD tools will substantially reduce design cycle times while improving quality – a crucial advantage for companies developing photonic integrated circuits.

The expansion of multiphysics analysis flows incorporating hierarchical methodologies addresses one of the industry's most pressing challenges: designing increasingly complex 3D integrated circuits efficiently. By enabling thermal-aware and voltage-aware timing analysis through RedHawk-SC and 3DIC Compiler platforms, designers can achieve faster convergence on large-scale 3D designs, which translates to reduced time-to-market for advanced computing products.

Particularly notable is the certification of the HFSS-IC Pro platform for TSMC's N5 and N3P processes, providing accurate electromagnetic modeling capabilities essential for high-frequency applications. This enables designers to better address signal integrity issues that become increasingly critical at advanced nodes. Additionally, the new certification of PathFinder-SC for ESD validation on the N2P process node fills a critical verification gap for system reliability.

The collaboration's emphasis on 3DIC and multi-die systems aligns perfectly with the industry's shift toward chiplet-based architectures, which are becoming the foundation for next-generation AI processors and high-performance computing solutions. With TSMC's A14 process photonic design kit scheduled for late 2025, this partnership positions both companies at the forefront of the emerging silicon photonics market, which is becoming essential for ultra-high-speed data center interconnects.

Collaboration enables workflows for TSMC advanced node technologies, accelerating AI, high-speed data communications, and advanced computing

Key Highlights

• An AI-assisted optimization workflow helps shorten design cycle times on TSMC's compact universal photonic engine (COUPE) platform and strengthens design quality using Ansys optiSLang®, Ansys Zemax OpticStudio®, and Ansys Lumerical FDTD™ simulation software
• Ansys HFSS-IC Pro™ platform is certified for system-on-chip electromagnetic extraction with TSMC's N5 and N3P process technologies
• Ansys RedHawk-SC™ and Ansys Totem™ power integrity platforms are certified for the latest TSMC N3C, N3P, N2P, and A16™ process technology releases

SUNNYVALE, Calif., Sept. 24, 2025 /PRNewswire/ -- Synopsys, Inc., (NASDAQ: SNPS) today announced TSMC has certified the Ansys portfolio of simulation and analysis solutions, enabling accurate final checks on chip designs targeted for TSMC's most advanced manufacturing processes including TSMC N3C, N3P, N2P, and A16™. The companies also collaborated on an AI-assisted design flow for the TSMC-COUPE™ platform. Together, Synopsys and TSMC empower customers to effectively design chips for a range of applications including AI acceleration, high-speed communications, and advanced computing.

Multiphysics and AI-Driven Photonics Design Enablement
Synopsys continues to work with TSMC to expand multiphysics analysis flows for larger designs with hierarchical analysis methodology. The multiphysics flow includes Ansys RedHawk-SC, Ansys RedHawk-SC Electrothermal platform, and Synopsys 3DIC Compiler™ exploration-to-signoff platform to enable hierarchical thermal-aware timing analysis and voltage-aware timing analysis. This multiphysics approach can help customers accelerate the convergence of large 3DIC designs.

Ansys optiSLang software and Ansys Zemax OpticStudio software transform the design of optical coupling systems in TSMC-COUPE™ architecture by applying AI-assisted optimization along with sensitivity analysis to shorten customer's design cycle times and strengthen design quality. These tools enable engineers to incorporate custom components, such as grating couplers optimized with photonic inverse design using Ansys Lumerical FDTD.

Advanced Process Technology Certifications
Ansys RedHawk-SC and Ansys Totem are foundational solutions for digital/analog power integrity that verify products can function reliably and meet performance goals. The solutions aid in validating power integrity of chips using TSMC N3C, N3P, N2P, and A16™ process technologies. Likewise, Ansys HFSS-IC Pro solution for electromagnetic modeling of chips is certified for TSMC's N5 and N3P processes. In addition, Synopsys is collaborating with TSMC on design flow development for TSMC's A14 process with the first photonic design kit release scheduled for the later part of 2025.

Ansys PathFinder-SC™ is a newly certified electrostatic discharge current density (ESD CD) / Point-to-Point (P2P) checker for the N2P process, validating chip resilience against electrical overstress surges and instilling confidence in engineering teams. Unique in its capacity to quickly check even the largest chips earlier in the design cycle, the solution accelerates the design process and increases product durability. Ansys Pathfinder-SC is enabled to support complex 3D integrated circuit (3DIC) and multi-die systems. Synopsys is working with TSMC to expand the tool capability for large scale 3DIC design analysis.

Ansys HFSS-IC Pro is certified by TSMC for die-level analysis on its advanced 5nm and 3nm process technologies. This collaboration enables customers to meet the demands of complex applications including AI, HPC, 5G/6G communications, and automotive electronics.

"Synopsys provides a broad range of design solutions to help semiconductor and system designers tackle the most advanced and innovative products for AI enablement, data center, telecommunications, and more," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Synopsys. "Our strong and continuous partnership with TSMC has been a key factor in maintaining our position at the forefront of technology while providing consistent value to our shared customers."

"TSMC's advanced process, photonics, and packaging innovations are accelerating the development of high-speed communication interfaces and multi-die chips that are essential for high-performance, energy-efficient AI systems," said Aveek Sarkar, director of the ecosystem and alliance management division at TSMC. "Our collaboration with OIP ecosystem partners such as Synopsys has delivered an advanced thermal, power and signal integrity analysis flow, along with an AI-driven photonics optimization solution for the next generation of designs."

About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Learn more at www.synopsys.com.

© 2025 Synopsys, Inc. All rights reserved. Synopsys, Ansys, the Synopsys and Ansys logos, and other Synopsys trademarks are available at https://www.synopsys.com/company/legal/trademarks-brands.html. Other company or product names may be trademarks of their respective owners.

Contacts
Media	Pete Smith
	pete.smith@synopsys.com
	corp-pr@synopsys.com

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SOURCE Synopsys, Inc.

FAQ

What new certifications did Synopsys receive from TSMC in September 2025?

Synopsys received certifications for its Ansys portfolio, including RedHawk-SC and Totem for N3C, N3P, N2P, and A16 processes, and HFSS-IC Pro for N5 and N3P processes.

How does the Synopsys-TSMC collaboration benefit chip designers?

The collaboration enables designers to perform accurate final checks on chip designs, utilize AI-assisted optimization, and implement multiphysics analysis flows for large 3DIC designs, accelerating development for AI, high-speed communications, and advanced computing applications.

What is the significance of PathFinder-SC certification for TSMC's N2P process?

PathFinder-SC certification enables validation of chip resilience against electrical overstress surges, allowing faster checking of large chips earlier in the design cycle and supporting complex 3DIC and multi-die systems.

When will Synopsys release the first photonic design kit for TSMC's A14 process?

The first photonic design kit for TSMC's A14 process is scheduled for release in late 2025.

What tools are included in the AI-assisted optimization workflow for TSMC-COUPE platform?

The workflow includes Ansys optiSLang, Ansys Zemax OpticStudio, and Ansys Lumerical FDTD simulation software to optimize optical coupling systems and strengthen design quality.