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SEMIFIVE announced a collaboration with Synopsys to develop a high-performance computing (HPC) platform that integrates SEMIFIVE's CPU chiplet with third-party I/O chiplet technology. The platform, built on 4nm process technology, will incorporate Synopsys' UCIe controller and PHY IP solutions. This initiative aims to reduce costs, optimize performance, and provide development flexibility compared to traditional chiplet platforms. The collaboration leverages SEMIFIVE's pre-designed and validated SoC platforms on advanced process nodes to improve development efficiency for HPC customers.

SEMIFIVE, a design solution provider specializing in platform-based custom silicon solutions, has been selected to join the World Economic Forum's Global Innovators Community. This community brings together promising growth-stage companies leading innovation in their industries. Founded in 2019, SEMIFIVE focuses on developing SoC design platforms for AI chips and has already created three platforms, completing over seven large-scale AI semiconductor projects. The company will participate in Forum initiatives to address critical global issues and share expertise in AI semiconductors with public and private sector leaders.

SEMIFIVE, a leading design solution provider, has extended its partnership with Arm to enhance AI and HPC SoC platforms. This collaboration aims to integrate Arm Neoverse Compute Subsystems (CSS) into custom chips, leveraging a wide range of Arm IP. As part of the Arm Total Design ecosystem, SEMIFIVE's Arm-based SoC platforms have already enabled several AI silicon startups to develop advanced AI accelerator SoCs over the past three years.

The expanded partnership allows SEMIFIVE to offer more comprehensive Arm-based solutions, bringing cutting-edge computing technology to a broader customer base. SEMIFIVE plans to showcase its advancements at the upcoming Open Compute Project (OCP) Global Summit in San Jose. CEO Brandon Cho expressed gratitude for Arm's support and anticipates continued innovation through the Arm Total Design ecosystem.

SEMIFIVE, a leading design solution provider, has announced a contract with HyperAccel to develop and mass-produce a generative AI chip called Bertha. The chip will be developed using 4nm process technology, with mass production targeted for Q1 2026. HyperAccel's LLM Processing Unit (LPU) is designed specifically for transformer-based Large Language Models, offering up to 2 times performance improvement and a 19 times better price/performance ratio compared to typical supercomputers.

SEMIFIVE specializes in SoC platforms and ASIC design solutions, focusing on AI chip expert SoC design platforms. The collaboration aims to provide cost-effective and power-efficient LLM features, potentially reducing data center operational expenses and expanding into industries requiring LLMs.

DEEPX, an AI semiconductor technology company led by CEO Lokwon Kim, has become the first AI semiconductor firm invited to the World Economic Forum. This historic invitation was to the Summer Davos Forum held in Dalian, China, from June 25-27, 2024. The forum focused on themes such as the new global economy, AI entrepreneurship, and energy efficiency. Kim proposed an 'energy trading system for AI computing' to combat excessive power and carbon emissions in AI processes. DEEPX aims to advance human civilization through more energy-efficient AI technologies.

SEMIFIVE and OPENEDGES have signed a Memorandum of Understanding to develop a cutting-edge chiplet platform featuring LPDDR6 memory interface for high-performance computing (HPC) applications. By combining SEMIFIVE's expertise in SoC design with OPENEDGES' advanced LPDDR6 memory subsystem, the collaboration aims to deliver cost-effective, high-performance, and flexible semiconductor solutions. This partnership, initiated in 2019, has produced multiple SoC platforms for AI, IoT, and HPC applications. The new platform promises to reduce development costs and time while enhancing performance and efficiency, potentially revolutionizing the semiconductor industry.

SEMIFIVE announced its collaboration with Arm Total Design to develop a high-performance computing (HPC) platform using Arm Neoverse Compute Subsystems (CSS) and Samsung's SF4X technology. This platform aims to drive innovation in semiconductor design by offering cost reduction, performance optimization, and development flexibility. SEMIFIVE, which specializes in SoC platforms and ASIC design solutions, plans to leverage the power-efficient benefits of Neoverse technology to cater to various AI SoC markets. The partnership benefits from Arm's ecosystem expertise and Samsung's advanced 4nm process technology. SEMIFIVE will showcase its solutions at the Samsung Foundry Forum from June 12-13 in San Jose, CA.

SEMIFIVE, a leader in platform-based custom silicon solutions, has signed a Memorandum of Understanding (MOU) with Atron Technologies on May 23, 2024, to collaborate on semiconductor design and turnkey manufacturing. The agreement aims to expand their business in China, leveraging Atron's expertise in high-end ASIC design and SEMIFIVE's SoC platform solutions. Atron has a strong background in AI/HPC, automotive, networking, and AIoT semiconductor designs. SEMIFIVE has been expanding globally, with offices in San Jose and Shanghai. Recently, SEMIFIVE announced the mass production of an AI inference chip using its 14nm platform and commenced commercialization of an NPU chip for HPC applications using its 5nm platform.

DEEPX, a leading AI semiconductor technology startup, secured $80.5M in Series C funding led by private equity firms, accelerating product development and global distribution. Notable investors include SkyLake Equity Partners, BNW Investments, and AJU IB. The funding round, endorsed by semiconductor industry experts, signals DEEPX's growth potential and market confidence.