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SEMIFIVE collaborates with MetisX to develop a CXL-based memory accelerator chip, utilizing Samsung Foundry's 4nm process technology. MetisX aims to revolutionize data center memory challenges with their CXL Computational Memory solution, reducing costs and enhancing efficiency. The collaboration seeks to reshape the data center infrastructure landscape by accelerating applications like Vector DB, Scaleout DB, Graph DB, and DNA analysis.
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DEEPX is expanding its first-generation AI chip lineup to focus on the intelligent video analytics and security system market. The company is forging key industry partnerships to drive this expansion, following successful participation at ISC West. The global AI video analytics market is expected to grow significantly, creating a ripe opportunity for DEEPX's on-device AI solutions. With a technological edge and a robust patent portfolio, DEEPX is well-positioned to capitalize on the growing demand for real-time intelligent video analysis functions.
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SEMIFIVE collaborates with Mobilint to mass produce the ARIES 14nm AI Inference SoC Platform, a high-performance custom chip for AI applications. Mobilint's ARIES chip is designed for advanced vision applications, edge servers, and hyperscale data centers, offering 80 TOPS performance and compatibility with over 200 deep learning models. SEMIFIVE's AI Inference SoC Platform provides a comprehensive solution for custom AI chips, including a quad-core CPU, PCIe Gen4, LPDDR4 interfaces, and the ability to add customer-specific IPs like an AI NPU.
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SEMIFIVE announces the mass production of its 14nm AI Inference SoC Platform in collaboration with Mobilint, delivering the ARIES high-performance custom chip. The chip is designed for advanced vision applications, edge servers, and data centers, showcasing SEMIFIVE's SoC Platform technology and Samsung Foundry's FinFET process technologies.
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DEEPX, a frontrunner in AI chip technology, is revolutionizing on-device AI with ultra-low-power AI chips and has achieved significant milestones at CES 2024 and MWC 2024. The company aims to develop next-generation products capable of real-time processing for generative AI and Large Language Models (LLMs) by 2025. DEEPX's core technology is optimized to enhance performance, reduce power consumption, and optimize costs for on-device AI operation, making it a global leader in comprehensive AI chip technology.
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DEEPX (DEEPX), an original AI chip technology company, is set to revolutionize the on-device AI market with its All-in-4 AI Total Solution, comprising four chips for various edge applications. The company has conducted pre-production verification for over 40 global companies through its EECP program and is slated to begin mass production of the chips later this year, with full implementation in customers' products by 2025.
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SEMIFIVE collaborates with HyperAccel to develop a generative AI chip using Samsung Foundry's 4nm process technology. HyperAccel, a South Korea-based startup, specializes in AI chips for transformer-based Large Language Model (LLM) and has recently released an Orion server mounted with its own LPUs. SEMIFIVE, specializing in SoC platforms and ASIC design solutions, plans to expand its roadmap to meet customer demand for AI custom silicon.
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DEEPX (DEEPX) CEO Lokwon Kim to discuss on-device AI at CES 2024 panel, showcasing ultra-low power AI chip solutions and unveiling 'All-in-4 AI Total Solution' with real-time technology demonstration.
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SEMIFIVE appoints Tatsuo Noguchi, a semiconductor specialist, to lead market entry and global expansion initiatives in Japan. Noguchi's extensive experience at Toshiba and Sony Corporation positions him to introduce SEMIFIVE's AI semiconductor design solution to Japanese semiconductor companies, aiming to propel SEMIFIVE to the forefront of the Japanese semiconductor market.
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DEEPX (DX) surpasses 40 global customers for its flagship AI accelerator chip, DX-M1, combining low power consumption, high efficiency and performance, and cost-effectiveness. The chip has been deployed for hands-on trials across robotics, autonomous vehicles, factory automation, AI-powered security systems, and AI servers, receiving CES Innovation Awards 2024 in Embedded Technology and Robotics.
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