Teledyne Tech Stock Price, News & Analysis

Teledyne Technologies (NYSE:TDY) appointed Dr. JihFen Lei as Senior Vice President of Teledyne Technologies, effective January 1, 2026. In the role, Dr. Lei will continue to lead Teledyne FLIR Defense and assume responsibility for the Aerospace and Defense Electronics Segment, together forming the Teledyne Defense and Aerospace Group.

Her background includes serving as Deputy Undersecretary of Defense for Research and Engineering and senior DoD R&D roles, prior leadership at NASA Glenn Research Center and the White House Office of Science and Technology Policy, plus earlier Teledyne leadership from 2015–2019 and a return to Teledyne in 2021.

Teledyne LeCroy (NYSE:TDY) announced second-generation QualiPHY 2 support for DisplayPort 2.1 PHY compliance and interoperability debug on December 19, 2025. New options QPHY2-DP2-SOURCE-TX and QPHY2-DP2-SINK-RX run on WaveMaster oscilloscopes or offline via the QPHY2-PC option to automate UHBR, HBR and RBR physical-layer tests.

The solution is VESA-approved for PHY CTS, integrates with Anritsu SQA-R MP1900A and WavePulser 40iX, and adds AUX/USB-PD decoding and DUT automation to reduce lab bottlenecks and improve Source–Sink interoperability.

Teledyne Brown Engineering (NYSE:TDY) announced a $42,882,299 firm-fixed-price contract modification from Naval Sea Systems Command (NAVSEA) to supply Provisioned Items Order spares for the MK11 SEAL Delivery Vehicle (SDV) fleet.

Work will be performed at Teledyne Brown Engineering’s Huntsville, Alabama facility. The award supports continued operational readiness of the MK11 (Shallow Water Combat Submersible) and follows the company’s original 2011 contract to design, develop, manufacture, and test the MK11. Teledyne Brown also reported it is the first company to meet current NAVSEA 07 Certification requirements and received authorization to perform Deep Submergence System—Scope of Certification (DSS) work.

Teledyne FLIR Defense (NYSE:TDY) was awarded a $42.5 million contract by U.S. Marine Corps Systems Command for Delivery Order 3 of the Organic Precision Fires-Light (OPF-L) program.

The company will deliver more than 600 Rogue 1 reusable loitering munition systems plus ground control stations and training kits, with fielding to Marine Corps units starting this summer. Rogue 1 features modular mission-specific payloads, advanced fuzing for safe return and reuse, and electro-optical and FLIR Boson 640+ thermal sensors for day/night reconnaissance and precise targeting.

Teledyne Technologies (NYSE:TDY) announced that Jason VanWees, Vice Chairman, will hold investor meetings at the Goldman Sachs Industrials and Materials Conference on December 4, 2025 in New York City. The company's latest investor presentation is available on its investor website at teledyne.com/investors/events-and-presentations. Teledyne provides digital imaging, instrumentation, aerospace and defense electronics, and engineered systems, with operations concentrated in the United States, Canada, the United Kingdom, and Western and Northern Europe.

The announcement includes a standard cautionary statement on forward-looking statements and directs readers to Teledyne’s SEC filings, including the Annual Report on Form 10-K for the year ended December 29, 2024, for detailed risk factors.

Teledyne (NYSE: TDY) launched the Xtium3 PCIe Gen4 frame grabber series on December 2, 2025, starting with the Xtium3-CLHS PX8 for Camera Link HS over PCIe Gen4.

Key specs: 7 CLHS lanes at 10.3125 Gbps each (72.2 Gbps total), acquisition bandwidth 8.6 GB/s, and host transfer up to 13.2 GB/s via a PCIe Gen4 x8 slot. Features include >97% packet efficiency, 64/66-bit encoding, support for >30 m AOC cables, real-time forwarding to up to 12 computers, multi-plane HDR processing, and Sapera LT SDK compatibility.

Teledyne MEMS (NYSE:TDY) acknowledged a C$656 million strategic investment by the Canadian and Quebec governments in the C2MI expansion to project phase C2MI1.5 on December 1, 2025. The funding is intended to strengthen Canada’s semiconductor and microelectronics ecosystem and enhance infrastructure for advanced packaging and post-processing.

Teledyne MEMS, a C2MI partner since 2011, highlighted 14 years of collaboration that produced 120 jobs and more than 30 customer projects. The company said the investment supports advanced post-CMOS processing on 200mm and 300mm wafers and will help advance imaging sensors, photonics, MEMS, and sensor technologies.

Teledyne Space Imaging (NYSE:TDY) announced that Engineering Models (EMs) of its upscreened industrial CMOS sensors and accompanying evaluation kits and integration tools will be available by end of 2025. Two variants are offered: Ruby 1.3M USV (1.3MP) and Emerald Gen2 12M USV (12MP), developed and tested in Grenoble for New Space uses including Earth observation, star trackers, monitoring cameras, suits, rovers, and moon landers.

Each sensor completed delta space qualification and radiation testing (SEL, SEE, SEFI) and can be delivered as flight models with U1 (ESCC9020-like) or U3 (NASA Class 3 tailored) screening. A live demo of the Emerald Gen2 12M USV is scheduled at Space Tech Expo Europe, Nov 18–20, 2025, booth B09.

Teledyne Technologies (NYSE:TDY) said that CEO George Bobb and Vice Chairman Jason VanWees will hold investor meetings at the Baird 2025 Global Industrial Conference on Wednesday, November 12, 2025. The company noted its investor presentation will be posted at www.teledyne.com/investors/events-and-presentations and that meetings will cover the company’s digital imaging, instrumentation, aerospace and defense electronics, and engineered systems businesses.

The release includes a standard cautionary statement that the presentation contains forward-looking statements and identifies a range of risks that could cause actual results to differ materially.