Welcome to our dedicated page for Teledyne Tech news (Ticker: TDY), a resource for investors and traders seeking the latest updates and insights on Teledyne Tech stock.
Teledyne Technologies Incorporated (NYSE: TDY) regularly issues news covering its activities in digital imaging, instrumentation, aerospace and defense electronics, and engineered systems. This page aggregates company announcements so readers can follow developments across Teledyne’s operating groups, including Teledyne FLIR Defense, Teledyne Brown Engineering, Teledyne LeCroy, Teledyne DALSA, and Teledyne MEMS.
Recent news highlights Teledyne’s role in defense and security programs. Teledyne FLIR Defense has announced contracts with the U.S. Army and U.S. Marine Corps for advanced electro-optical and infrared systems, long-range thermal imaging sights, radars, and Rogue 1 reusable loitering munition systems. Other releases describe support for foreign military sales and modernization efforts, such as integrating reconnaissance sensor kits on Stryker armored vehicles.
Teledyne Brown Engineering news includes contract modifications from the Naval Sea Systems Command to provide spares and support for the MK11 SEAL Delivery Vehicle fleet, a manned platform used to clandestinely deliver Special Operations Forces. These updates illustrate Teledyne’s ongoing work in engineered systems for demanding maritime and defense environments.
In the technology and industrial arena, Teledyne LeCroy reports on new compliance test and debug solutions for high-speed standards like DisplayPort 2.1, while Teledyne DALSA announces high-throughput frame grabbers such as the Xtium3 PCIe Gen4 family for industrial imaging applications. Teledyne MEMS and corporate announcements also address participation in semiconductor initiatives and acquisitions like DD-Scientific, which adds electrochemical gas sensors to Teledyne’s instrumentation portfolio.
Investors, engineers, and industry observers can use this news feed to monitor contract awards, product introductions, acquisitions, governance updates, and investor events involving Teledyne Technologies and its subsidiaries.
Teledyne (NYSE:TDY) technology is integrated into Aitech's SP1, a radiation-tolerant 3U SpaceVPX single-board computer designed for LEO, GEO, lunar and deep-space missions. The SP1 uses Teledyne e2v's QLS1046-Space SoC with four 64-bit Arm Cortex-A72 cores and DDR4 ECC, radiation-tested to 100 krad (Si) and latch-up immune at 67 MeV-cm²/mg. The platform targets onboard AI, autonomous decision-making, high‑performance edge processing, and flexible customer IP via a high-capacity FPGA for C&DH, Earth observation, communications and robotic vision applications.
Teledyne (NYSE:TDY) will present at the TD Cowen 47th Annual Aerospace & Defense Conference on Thursday, February 12 at 11:30 a.m. ET.
George Bobb, President & CEO, and Jason VanWees, Vice Chairman, will speak. A live webcast and the company’s latest investor presentation are available via the investor relations website.
Teledyne FLIR OEM (NYSE:TDY) highlighted its vertical integration and high-volume thermal imaging manufacturing capabilities, supplying tens of thousands of thermal modules weekly and thousands of ITAR-free IR modules daily for defense, commercial, automotive, and uncrewed markets.
Key strengths include in-house ROICs, detectors (InSb, T2SL), microbolometers, coolers, optics, and embedded AI software enabling rapid scale and reduced delivery risk.
Teledyne Technologies (NYSE:TDY) announced the start of production on multiple awards to deliver infrared Focal Plane Modules for the Space Development Agency’s Tracking Layer Tranche 3 program.
The sensors are radiation‑hardened, multi‑megapixel detectors for LEO satellites designed to improve missile warning, tracking, and defense capability and align with SDA’s spiral development model.
Teledyne (NYSE:TDY) demonstrated autonomous Anti-Submarine Warfare systems in Icelandic waters from Jan 17–22, 2026, using Slocum Sentinel and G3 gliders, two APEX floats, passive acoustic arrays and seabed node acoustic exfiltration.
The trials, observed by NATO members and run from Teledyne Gavia in Kópavogur, showed gliders operating to 1,000 meters, real-time data recovery and remote operations piloted with the UK National Oceanographic Centre.
Teledyne FLIR Defense (NYSE:TDY) won a $17.5 million contract from armasuisse to supply Black Hornet 4 Personal Reconnaissance Systems for Switzerland’s Piranha 8x8 armored engineering vehicle program.
Deliveries began in 2025 with remaining systems due in 2026; Black Hornet 4 weighs 70 g, >30-minute endurance, >3 km range, 12MP day camera and thermal imaging. Integration will share live video and target data with vehicle displays via Kongsberg’s ICS.
Teledyne (NYSE:TDY) delivered four GAVIA autonomous underwater vehicle (AUV) systems to the Swedish Defence Materiel Administration (FMV) on a multi-year framework agreement. The GAVIA systems use a modular architecture for rapid reconfiguration across mine countermeasures, hydrography, seabed mapping, intelligence collection, and surveillance.
Teledyne Marine highlighted fleet modernization support for the Swedish Armed Forces and noted scale: over 12,000 APEX floats, 1,275 Slocum gliders (600+ to NATO), and GAVIA sales to 18 navies as of January 2026.
Teledyne Technologies (NYSE:TDY) reported record fourth-quarter and full-year results. Fourth-quarter net sales were $1,612.3M (+7.3% YoY) with GAAP diluted EPS of $5.84 and non-GAAP diluted EPS of $6.30 (+14.1% YoY). Q4 cash from operations was $379.0M and free cash flow was $339.2M. Full-year 2025 net sales were $6,115.4M (+7.9%) and non-GAAP diluted EPS was $21.99. Management issued 2026 guidance of GAAP EPS $19.76–$20.22 and non-GAAP EPS $23.45–$23.85. Capital deployment included ~$850M for acquisitions in 2025 and Q4 share repurchases of $400M; quarter-end leverage was 1.4x.
Teledyne (NYSE:TDY) announced that its Space Imaging division deployed Speedster HyViSI Focal Plane Arrays aboard NASA's BlackCAT CubeSat, which launched on January 11, 2026 on SpaceX's Twilight rideshare.
The Speedster FPA is assembled in a 2x2 mosaic and uses a Si-PIN hybrid CMOS architecture offering event-driven fast readout, low power consumption, radiation-hard performance and high sensitivity to soft X-ray photons—capabilities the release says enable detection of X-ray transients and study of early-universe phenomena.
Teledyne (NYSE: TDY) launched the SCION Family of VIS–SWIR cameras, a new line of high-performance, high-volume cameras with a 10-micron pixel pitch and sensor formats of 640x512 and 1280x1024. Initial sensor options cover 300–1700 nm and 900–2500 nm using VisGaAs and MCT materials. SCION offers high frame rates, sample-up-the-ramp (SUPR) readout enabling sub-one-electron read noise with a one-second acquisition, thermoelectric cooling, and unified sensor-to-electronics integration aimed at reducing supplier count and total cost of ownership. Teledyne will demonstrate SCION at SPIE Photonics West (Jan 20–22, 2026) and SPIE Defense + Commercial Sensing (Apr 28–30, 2026).