Teledyne e2v Has Started Production of Its 16GB DDR4-X1 Flight Models for Space Applications

Key Terms

ddr4 technical

DDR4 is a generation of high-speed computer memory used in personal computers, laptops and servers to temporarily hold the data a processor is actively working on — think of it as a short-term workspace that lets devices run programs smoothly. Its prevalence, pricing and compatibility affect demand and upgrade cycles for PCs, servers and components, influencing revenue, margins and product road maps for hardware and chip makers.

single-event latch-up technical

Single-event latch-up is when a single energetic particle (for example from cosmic rays or radioactive contamination) strikes an integrated circuit and creates a short-circuit condition that makes the chip draw excessive current, stop functioning, or overheat. Like a small pebble jamming the gears of a clock, this sudden failure can be intermittent or permanent and matters to investors because it increases product reliability risk, potential warranty and recall costs, and can hurt sales and reputation if not properly tested and mitigated.

total ionizing dose technical

Total ionizing dose (TID) is the cumulative amount of ionizing radiation energy absorbed by a material or electronic component over time. Investors should care because TID measures long‑term wear from radiation—like how prolonged sun exposure fades fabric—so it affects product reliability, compliance testing, warranty costs and marketability for devices used in medical, aerospace, defense and industrial environments.

flight model technical

A flight model is the finished, fully functional version of a product built for real-world use or final testing rather than early prototypes. For investors it signals that a project has moved past design experiments toward a shippable, testable item—similar to a production car compared with a concept vehicle—and therefore typically reduces technical and commercial risk and brings the company closer to sales, certifications, or revenue.

GRENOBLE, France--(BUSINESS WIRE)-- Teledyne e2v is pleased to announce the start of full production of its 16GB DDR4-X1 Flight Model (FM), expanding its portfolio of high-density, radiation-tolerant memory solutions for space applications.

Teledyne 16GB DDR4 Memory for Space

The new device is designed to support the growing processing and data storage requirements of AI-enabled satellites, large constellations, broadband Internet-from-Space, Direct-to-Device services, and optical inter-satellite communications. By combining high memory density, radiation resilience, and a compact footprint, the component enables spacecraft to handle increasingly demanding onboard computing workloads.

Initial samples of the 16GB DDR4-X1 Flight Models were delivered to customers in October 2025, allowing early system integration and evaluation. The device supports data rates up to 2400 MT/s, provides single-event latch-up immunity above 43 MeV·cm²/mg, and offers radiation tolerance up to 35 krad TID, enabling reliable operation in mission-critical space environments.

Maintaining the same 15 × 20 × 1.92 mm footprint as other devices in Teledyne e2v’s DDR4 family, the new memory is pin-to-pin compatible with lower-density versions, allowing satellite integrators to upgrade memory capacity without redesigning their boards.

“Reaching production for our 16GB DDR4 Flight Models confirms that the program is progressing exactly as planned,” said Luca Lo Coco, VP Marketing at Teledyne e2v. “Our documentation, radiation reports, and customer support structure are already in place to support adoption across multiple space programs.”

The 16GB DDR4-X1 device is also used in Teledyne e2v’s Qormino® QLS1046 space computing modules, which integrates a radiation-tolerant processor with DDR4 memory for advanced onboard processing tasks such as AI inference, sensor fusion, and autonomous spacecraft operations.

Teledyne e2v’s DDR4 portfolio also includes 8GB Flight Models and NASA Level 1 16GB versions for GEO and long-duration missions, expected to be available in Q3 2026. This portfolio gives satellite designers the flexibility to select the optimal memory density and quality flow for their mission profiles while ensuring compatibility and long‑term continuity.

ABOUT TELEDYNE e2v SEMICONDUCTORS

Teledyne e2v delivers advanced solutions for healthcare, life sciences, space, transportation, defense, and industrial markets. The company offers high-reliability semiconductors—including data converters, microprocessors, and radiation-tolerant memories—alongside specialized manufacturing and test services. As part of the Teledyne Imaging Group and a Teledyne Technologies Incorporated (NYSE:TDY) company, Teledyne e2v partners with customers to develop innovative, tailored technologies that enhance system performance. E2V Semiconductors

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Media Contacts:

Jane Rohou - MarCom Manager

Email: jane.rohou@teledyne.com

Source: Teledyne