Teledyne announces Xtium3 PCIe Gen4 frame grabber series for ultra-fast image acquisition
Rhea-AI Summary
Teledyne (NYSE: TDY) launched the Xtium3 PCIe Gen4 frame grabber series on December 2, 2025, starting with the Xtium3-CLHS PX8 for Camera Link HS over PCIe Gen4.
Key specs: 7 CLHS lanes at 10.3125 Gbps each (72.2 Gbps total), acquisition bandwidth 8.6 GB/s, and host transfer up to 13.2 GB/s via a PCIe Gen4 x8 slot. Features include >97% packet efficiency, 64/66-bit encoding, support for >30 m AOC cables, real-time forwarding to up to 12 computers, multi-plane HDR processing, and Sapera LT SDK compatibility.
Positive
- Host throughput up to 13.2 GB/s via PCIe Gen4 x8 slot
- Acquisition bandwidth of 8.6 GB/s with 7 CLHS lanes
- Real-time forwarding to up to 12 computers for distributed processing
- Software support with Sapera LT SDKs and third-party compatibility
Negative
- Initial Xtium3 model does not support CoaXPress (planned in a future model)
- Max performance requires a PCIe Gen4 x8 slot, limiting older-system compatibility
News Market Reaction – TDY
In the Dec 2 session, TDY gained 0.64%, reflecting a mild positive market reaction.
Data tracked by StockTitan Argus on the day of publication.
Key Figures
Historical Context
| Date | Event | Sentiment | 24h Move | Catalyst |
|---|---|---|---|---|
| Dec 09 | Defense contract win | Positive | -0.1% | NAVSEA contract modification for MK11 SEAL Delivery Vehicle PIO spares. |
| Dec 05 | Defense drone award | Positive | +0.8% | USMC contract for over 600 Rogue 1 loitering munitions and support. |
| Dec 03 | Investor conference | Positive | +1.7% | Participation in Goldman Sachs Industrials and Materials investor meetings. |
| Dec 02 | Imaging product launch | Positive | +0.6% | Launch of Xtium3 PCIe Gen4 frame grabber with high throughput specs. |
| Dec 01 | Strategic investment news | Positive | -1.4% | C$656M government investment in C2MI expansion, supporting MEMS ecosystem. |
24h Move is the share-price change in the day after each event; other market factors may also have contributed.
Recent TDY news, mainly positive contracts and strategic updates, has produced small single-day moves, with a mix of modest alignments and divergences versus the upbeat tone.
Over the last week, Teledyne issued several positive updates, including a $42.9M NAVSEA contract modification, a $42.5M Marine Corps drone contract, and participation in a Goldman Sachs conference on Dec 4, 2025. The company also highlighted a C$656M strategic investment in partner C2MI. The Dec 2 launch of the Xtium3 PCIe Gen4 frame grabber extends its digital imaging portfolio, fitting into a pattern of steady contract wins and product/technology development.
Key Terms
pcie gen 4.0 technical
camera link hs technical
aoc cables technical
hdr technical
sdk technical
AI-generated analysis. How Rhea-AI works. Not financial advice.
MONTREAL, Dec. 02, 2025 (GLOBE NEWSWIRE) -- Teledyne DALSA, a Teledyne Technologies [NYSE: TDY] company, announces the release of the Xtium™3 PCIe Gen4 family, a next-generation frame grabber engineered to deliver maximum sustained throughput and ready-to-use image data for high-performance industrial applications.
Building on the proven Xtium2 platform, the first model, Xtium3-CLHS PX8 supports the Camera Link HS® (CLHS) standard over the PCI Express™ Gen 4.0 interface. This single-slot, single-cable solution accommodates up to seven CLHS lanes, each operating at 10.3125 Gbps (72.2 Gbps in total), enabling acquisition bandwidths of 8.6 GB/s and host transfer rates of up to 13.2 GB/s via a PCIe Gen4 x8 slot.
Key features and benefits:
- High-speed data transmission ̶ Utilizes CLHS X-protocol with over
97% packet efficiency and 64/66-bit encoding. Supports long cable lengths exceeding 30 meters using 7-lane AOC cables - Real-time data forwarding ̶ Redistributes incoming data to up to 12 computers via standard AOC cables for distributed image processing
- Optimized performance ̶ PCIe Gen4 architecture delivers sustained throughput of 13.2 GB/s directly to host memory, reducing CPU load and accelerating image processing
- Broad compatibility ̶ Supports area and line scan, monochrome and color cameras, delivering exceptional performance for Camera Link HS (a future model will support CoaXPress®)
- Advanced image processing ̶ Enables multi-plane HDR processing for Teledyne’s Linea™ HS2 16K camera
- Software support ̶ Fully compatible with Teledyne’s Sapera™ LT Software SDKs and third-party software for seamless integration.
The Xtium3 series is designed to meet the demands of modern machine vision systems, offering robust performance, scalability, and flexibility for a wide range of industrial applications.
Fully supported by Teledyne’s Sapera LT Software SDKs, the Xtium3 series empowers developers and integrators to build robust, high-speed imaging systems with minimal overhead and maximum flexibility.
For more details, please visit the product page, and for sales enquiries, visit our contact page.
Teledyne Vision Solutions offers the world’s most comprehensive, vertically integrated portfolio of industrial and scientific imaging technology. Aligned under one umbrella, Teledyne DALSA, e2v CMOS image sensors, FLIR IIS, Lumenera, Photometrics, Princeton Instruments, Judson Technologies, Acton Optics, and Adimec form an unrivalled collective of expertise across the spectrum with decades of experience and best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest sensing and related technology portfolio in the world. Teledyne offers worldwide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.
Media Contact:
Jessica Broom
Jessica.broom@teledyne.com
A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/a834e18a-07c3-4500-a00e-14010390bd4f
