Teradyne Stock Price, News & Analysis

Teradyne (NASDAQ:TER) declared a quarterly cash dividend of $0.12 per share, payable on December 17, 2025.

The dividend will be paid to shareholders of record at the close of business on November 24, 2025.

Teradyne (NASDAQ: TER) announced a finance leadership transition: Michelle Turner will become Chief Financial Officer effective November 3, 2025, replacing Sanjay Mehta, who has served as CFO since 2019.

Mr. Mehta will remain as an executive advisor to support capacity expansion tied to demand in Semiconductor Test and plans to retire in 2026. Ms. Turner brings 30 years of financial and strategic leadership across technology and manufacturing and most recently served as CFO of L3Harris Technologies.

The company said the move aligns leadership to address accelerating demand from AI, semiconductors, and industrial automation.

Teradyne (NASDAQ: TER) reported Q3 2025 revenue of $769 million, up 4% year‑over‑year, with Semiconductor Test contributing $606 million, Product Test $88 million and Robotics $75 million. GAAP EPS was $0.75 and non‑GAAP EPS was $0.85. Management said results landed at the high end of Q3 guidance driven by SOC solutions for AI and memory.

Teradyne guided Q4'25 revenue of $920M–$1,000M, implying ~25% sequential and 27% YoY growth, with GAAP EPS of $1.12–$1.39 and non‑GAAP EPS of $1.20–$1.46. A webcast is scheduled 8:30 a.m. ET Oct 29, 2025.

Teradyne (NASDAQ: TER) will release third quarter 2025 financial results on Tuesday, October 28, 2025 after 5:00 p.m. ET. A conference call to discuss results and management's business outlook will follow on Wednesday, October 29, 2025 at 8:30 a.m. ET.

Investors can join the live webcast at investors.teradyne.com/events-presentations (recommended at least five minutes early). Presentation materials will be posted at 7:30 a.m. ET on October 29, and a replay will be available on the Teradyne investor website.

Pragmatic Semiconductor (TER) appointed Peter Herweck as Chair of the Board effective Oct 7, 2025, succeeding Erik Langaker who will remain a director through Oct 31, 2025.

Herweck brings 40+ years of global technology and industrial automation leadership, including roles as CEO of Schneider Electric and AVEVA and senior positions at Siemens. The company highlighted recent milestones under Langaker, including a $231m Series D round and expansion of global manufacturing to commercialize its FlexIC flexible integrated circuit technology.

Teradyne (NASDAQ: TER) announced the ETS-800 D20, a dual‑sector automated test system for power semiconductors aimed at AI/cloud infrastructure and automotive markets.

The ETS-800 D20 supports low‑density configurations with up to two instruments and high‑density testing with up to eight sites in parallel. The platform emphasizes channel density, faster test times, extensibility across ETS‑800 systems, and compatibility with existing instruments, docking and software.

Teradyne will show the ETS‑800 portfolio at SEMICON West, Oct 7–9, booth 5645.

Teradyne (NASDAQ:TER) has launched Titan HP, a new system level test (SLT) platform specifically designed for artificial intelligence and cloud infrastructure markets. The platform supports up to 2 kilowatts of power, with plans to expand to 4 kilowatts, addressing the increasing demands of advanced technologies.

The Titan HP features advanced thermal control capabilities including multi-branch cold plate architecture, asynchronous cooling control with PID-tuned thermal management, and DUT heater options. The system is already in production with several major customers, positioning Teradyne as a leader in mission mode testing for next-generation AI and cloud infrastructure devices.

Teradyne (NASDAQ: TER) has announced the launch of UltraPHY 224G for UltraFLEXplus, a significant advancement in high-speed PHY performance testing technology. This new solution complements their existing UltraPHY 112G instrument and delivers bench-quality signal generation and measurement for production testing.

The UltraPHY 224G, developed in collaboration with Multilane, features 8 full-duplex differential lanes plus 8 Rx-only differential lanes per instrument, supporting data rates up to 112 Gb/s NRZ and 224 Gb/s PAM4. The system is designed to address emerging data rates in data center and silicon photonics markets, while maintaining compatibility with existing UltraFLEXplus platforms.

Teradyne (NASDAQ: TER) has been named the 2025 TSMC Open Innovation Platform® (OIP) Partner of the Year for TSMC 3DFabric® Testing, highlighting their successful collaboration in developing multi-die test methodologies for chiplets and advanced packaging technology.

Through the TSMC OIP 3DFabric Alliance, Teradyne's innovations in UCIe, GPIO, and streaming scan test solutions have improved silicon bring-up efficiency and test quality for complex 3D ICs used in AI and cloud datacenter applications. The company's solutions enable high-speed scan testing over UCIe die-to-die interfaces at wafer sort or chip probing, reducing defect escapes and improving time-to-market.