Teradyne Stock Price, News & Analysis

Mobile Industrial Robots (MiR) has launched the MiR VDA 5050 Adapter, a software solution enabling interoperability between MiR's autonomous mobile robots (AMRs) and VDA 5050-compatible third-party fleet management systems. The adapter facilitates standardized management of diverse robot fleets in warehouses, distribution centers, and manufacturing facilities.

Developed in partnership with industry leaders including MHP, SYNAOS, Siemens SIMOVE, and KINEXON, the adapter connects MiR's RESTFUL robot interface with MQTT protocols for VDA message exchange. This integration aims to improve traffic management and operational coordination across different automated vehicles, from AMRs to specialized forklifts and high-reach trucks.

The VDA 5050 standard, initiated by the German Automotive Industry Association and VDMA Material Handling and Intralogistics Association, enables communication between multiple AMR types through a common control system. The adapter is available globally through certified system integrators, with optional support agreements for updates and compatibility maintenance.

Teradyne (TER) has announced a definitive agreement to acquire Quantifi Photonics, a leader in photonic IC testing. The acquisition, expected to close in Q2 2025, aims to deliver scalable photonic integrated circuit (PIC) test solutions for the high-performance Compute market supporting AI workloads.

The strategic move combines Teradyne's semiconductor ATE leadership with Quantifi Photonics' expertise in photonic testing to develop cost-effective, high-throughput test solutions for wafer-level, die/multi-die and co-packaged optical module testing. The integration focuses on addressing the growing bandwidth and power requirements driven by Cloud AI applications through optical interconnect solutions.

Teradyne (NASDAQ: TER), a leading automated test solutions provider, has announced its upcoming Financial Analyst Day scheduled for March 11, 2025 at their North Reading, Massachusetts headquarters.

The event will feature leadership team presentations covering:

• Strategic imperatives
• Operating and growth strategy
• Business outlook
• Current business conditions
• Financial targets

Financial Analyst Day materials will be available on the Investor Relations website at 8:30am ET. The event begins at 1:00 p.m. EDT and will be accessible through a live webcast on investors.teradyne.com. In-person attendance is by invitation only due to capacity. An on-demand replay will be available shortly after the event.

Teradyne (NASDAQ: TER) has announced a leadership transition in its Semiconductor Test Division. Shannon Poulin will succeed Rick Burns as President in Q2 2025, when Burns plans to retire on June 1, 2025.

Poulin brings over 30 years of technology industry experience, most recently serving as COO at Altera and previously holding various GM roles during his 22-year tenure at Intel. Burns, who joined Teradyne in 2007, has served as President of the Semiconductor Test Division since 2020, following roles as Senior Director of Hardware Engineering and Vice President of Semiconductor Test Engineering.

CEO Greg Smith praised Burns' leadership over the past five years, highlighting his valuable customer perspective. Poulin expressed enthusiasm about joining Teradyne, emphasizing the increasing complexity in semiconductor testing driven by AI, chiplet architectures, and custom silicon.

Teradyne (NASDAQ: TER), a leading automated test solutions provider, has announced its upcoming Financial Analyst Day scheduled for March 11, 2025. The event will be hosted at the company's headquarters in North Reading, Massachusetts.

The presentation will feature the leadership team discussing strategic imperatives, operating and growth strategy, and business outlook. Starting at 1:00 p.m. EDT, the event will be available through a live webcast on Teradyne's Investor Relations website at investors.teradyne.com, with on-demand replay available afterward. In-person attendance is by invitation only due to capacity.

Teradyne (NASDAQ:TER) and Infineon Technologies have announced a strategic partnership to advance power semiconductor testing. The agreement includes Teradyne's acquisition of Infineon's automated test equipment team in Regensburg, Germany, comprising 80 employees.

Through this partnership, Teradyne will enhance its ETS product portfolio and accelerate its roadmap in the power semiconductor segment. The acquisition provides mutual benefits: Teradyne gains additional resources and expertise while collaborating with a key market leader, while Infineon secures continued manufacturing support and enhanced flexibility for specialized test equipment needs.

The partnership will focus on advancing test capabilities for new technologies like silicon carbide and gallium nitride, addressing dynamic test challenges at scale. Teradyne has committed to maintaining and building upon the capabilities of the Regensburg team as part of its Power Semiconductor business unit.

Teradyne (NASDAQ:TER) reported strong Q4 2024 results with revenue of $753 million, up 12% from Q4'23, driven by robust AI-related demand. The Semiconductor Test segment contributed $561 million, while Robotics added $98 million. GAAP EPS reached $0.90, and non-GAAP EPS was $0.95.

For full-year 2024, the company achieved revenue of $2.82 billion with GAAP EPS of $3.32. Q4 performance exceeded expectations in Mobile and Auto/Industrial sectors. Looking ahead to 2025, Teradyne expects revenue acceleration and plans to strategically realign its Robotics business. The company provided Q1 2025 guidance with revenue between $660-700 million and non-GAAP EPS of $0.58-0.68.

Teradyne (NASDAQ:TER) has announced a quarterly cash dividend of $0.12 per share. The dividend will be paid on March 14, 2025, to shareholders who are recorded as owners of TER stock at the close of business on February 14, 2025.

Teradyne Robotics, a division of Teradyne (NASDAQ:TER), has announced a strategic partnership with Analog Devices (ADI) to accelerate advanced robotics development. The collaboration combines Teradyne's Universal Robots (UR) and Mobile Industrial Robots (MiR) with ADI's system-level electronics expertise to address key semiconductor market challenges.

The partnership aims to enhance safety, efficiency, and optimize fabrication operations through automation, targeting issues like repetitive tasks, manufacturing downtime, workforce shortages, and space constraints. The collaboration will focus on integrating ADI's technologies into Teradyne Robotics' products and implementing edge-based AI and machine learning, particularly for semiconductor industry applications.