Teradyne, Inc. designs, develops, and manufactures automated test equipment and advanced robotics systems. Its news commonly covers Semiconductor Test, Product Test, and Robotics results; automated test platforms for semiconductors, electronics products, silicon photonics, co-packaged optics, AI accelerators, data-center networking, and ADAS semiconductors; and advanced robotics brands Universal Robots and Mobile Industrial Robots for manufacturing and warehouse automation.
Company updates also include quarterly financial results, cash dividends, product introductions such as Photon 100, industry-event demonstrations, manufacturing partnerships, and intellectual-property actions involving robotics software and automation technology.
Teradyne (TER) launched the Iris 100, a production-ready optical test platform for microLED devices that brings semiconductor-grade optical testing to high-volume manufacturing.
The system measures every individual emitter in large microLED arrays and integrates with the Teradyne UltraFLEXplus platform to combine optical and electrical test. Designed for AR microdisplays and optical interconnects in AI data centers, Iris 100 uses a spectrometer and high-resolution camera to capture spectral response, per-pixel luminance, and uniformity at high throughput. It leverages IG-XL software to detect defects such as dead or stuck pixels and supports NIST-traceable calibration to correlate results across lots, wafers, and sites. Iris 100 supports both wafer and final test and has a roadmap to add photodetector test capabilities.
Teradyne (TER) has opened a new office in Bengaluru, India, focused on supporting semiconductor manufacturing and electronics production in the country.
The office at Vesta Building, Bagmane Cosmos Tech Park will act as a hub for customer engagement, applications support, training, and strategic partnerships. This step aligns with India’s accelerating semiconductor ambitions under the India Semiconductor Mission.
Universal Robots (TER) launched its seventh-generation Gen 7 robotics platform at the IMTS tradeshow in Chicago, introducing an out-of-the-box AI-ready system for industrial automation and physical AI deployment.
Gen 7 is a unified upgrade built around the PolyScope X robot operating system, featuring a reengineered CB7 Core controller, TP7 Core teach pendant, SP7 Smart Panel tool-flange interface and new g-Series robot arms (UR10g-1750, UR17g-1300, UR18g-950). The g-Series flange delivers power, data and safety directly to tools, simplifying connection of cameras and high-bandwidth sensors, and integrates force-torque sensing and impedance control for dexterous, force-sensitive tasks.
The CB7 controller provides 40% more compute in a 30% smaller footprint than prior generations and supports multi-network industrial communication. Gen 7 also emphasizes safety and cybersecurity, with PLd, Category 3 architecture, TÜV certification to ISO10218-1 and UL1740, and development practices certified to IEC 62443-4-1 ML3.
Teradyne (TER) will participate in a fireside chat at the Goldman Sachs Communacopia + Technology Conference on Wednesday, September 9, 2026, at 4:45 PM ET. A live webcast and a replay of the presentation will be available on Teradyne’s Investor Relations website for 180 days.
Teradyne (NASDAQ: TER) has introduced three advanced instruments for its UltraFLEXplus automated test platform, targeting increasingly complex AI and data center semiconductor devices. The new UltraPin5000-EM digital instrument, UltraPort-PCIe6 PCIe Gen6 protocol solution, and UltraVS64-HP high-current power supply are designed to enhance scalability, speed, and precision from wafer probe through final rack validation. Together, they support higher vector memory, faster pattern loads, PCIe Gen6 at 64 Gbps across 32 lanes, and test cell power capacity above 15,000 amps, aiming to help semiconductor manufacturers improve test efficiency, coverage, and device insight for next-generation AI compute architectures.
Teradyne (NASDAQ:TER) declared a quarterly cash dividend of $0.13 per share. The dividend will be payable on September 25, 2026, to shareholders of record at the close of business on September 4, 2026, according to Teradyne.
LitePoint (TER) announced that its IQgig-UWB+™ test system has successfully validated the physical layer (PHY) performance of STMicroelectronics’ ST64UWB chip family against the emerging IEEE 802.15.4ab draft standard. The testing confirmed that ST’s silicon meets the draft specification’s rigorous requirements.
According to LitePoint, the collaboration focuses on ranging accuracy, signal integrity, and radio performance for automotive, consumer, and industrial ultra-wideband (UWB) applications. The IEEE 802.15.4ab amendment targets extended range, higher precision via multi-millisecond ranging and narrowband assistance, and enhanced radar-based sensing use cases such as child presence detection.
Teradyne (NASDAQ: TER) reported record second-quarter 2026 revenue of $1.33 billion, up 104% from Q2 2025, exceeding the high end of guidance. Revenue comprised $1.12 billion from Semiconductor Test, $107 million from Product Test, and $100 million from Robotics, with record Memory revenue driven by strong DRAM and renewed NAND final test demand.
GAAP net income attributable to Teradyne was $374.5 million, or $2.38 per diluted share, versus $0.49 a year earlier, while non-GAAP net income was $389.0 million, or $2.47 per diluted share. For Q3 2026, Teradyne guides revenue of $1.20–$1.30 billion, GAAP EPS of $1.79–$2.09, and non-GAAP EPS of $1.85–$2.15, reflecting continued AI-related demand.
Teradyne (NASDAQ: TER) will release its second quarter 2026 financial results on Tuesday, July 28, 2026, at 4:30 p.m. ET or later. A conference call to review the results and management’s business outlook will be held on Wednesday, July 29, 2026, at 8:30 a.m. ET, with webcast access and replay available via the company’s investor relations website.
Teradyne Robotics (NASDAQ:TER) and Vention announced a strategic collaboration to create a digital twin platform optimized for Universal Robots (UR) cobot cells. Built on Vention's MachineBuilder, it lets manufacturers design, simulate, and operate modular UR work cells in one digital environment.
The UR-focused platform offers pre-loaded cobot specifications, a UR+ component marketplace, validated application templates, and rapid high-fidelity 3D simulations. Initial rollout targets North America and Europe, with live demonstrations at Automate 2026 in Chicago showcasing AI-driven bin picking and large-scale welding applications.