Welcome to our dedicated page for Teradyne news (Ticker: TER), a resource for investors and traders seeking the latest updates and insights on Teradyne stock.
Teradyne, Inc. designs, develops, and manufactures automated test equipment and advanced robotics systems. Its news commonly covers Semiconductor Test, Product Test, and Robotics results; automated test platforms for semiconductors, electronics products, silicon photonics, co-packaged optics, AI accelerators, data-center networking, and ADAS semiconductors; and advanced robotics brands Universal Robots and Mobile Industrial Robots for manufacturing and warehouse automation.
Company updates also include quarterly financial results, cash dividends, product introductions such as Photon 100, industry-event demonstrations, manufacturing partnerships, and intellectual-property actions involving robotics software and automation technology.
LitePoint (TER) and MediaTek announced a collaboration on January 13, 2026 to develop test solutions for Wi‑Fi 8 (IEEE 802.11bn), targeting the standard's new "Ultra‑High Reliability" features. The partnership focuses on validating low‑latency, robust connectivity and supporting AI use cases. LitePoint said its IQxel‑MX test platform—now supporting Wi‑Fi 8 features such as dRU and long‑length LDPC—enabled system‑level tests where MediaTek's implementation reached theoretical peak PHY throughput. Test capabilities are available immediately via IQxel‑MX and IQfact+ software.
Teradyne Robotics (TER) partners Universal Robots and Robotiq to showcase a next‑generation palletizing solution at CES 2026 in Las Vegas on January 6–9, 2026.
The demonstrator pairs Robotiq’s PAL Ready palletizing cell and a UR20 robot arm with Siemens automation hardware and the newly launched Digital Twin Composer, showing a photo-realistic digital twin synced in real time to live hardware and Siemens Industrial Edge analytics.
The system palletizes boxes of chips and beverages, streams operational data to Siemens Insights Hub Copilot, and highlights real‑time gripper/suction optimization and industrial AI integration.
LitePoint (TER) announced it achieved PHY-level validation of Qualcomm Technologies' Wi‑Fi 8 platforms using the LitePoint IQxel-MX wireless test platform on January 6, 2026.
The validation covers PHY innovations such as stronger LDPC error correction, adaptive MIMO modulation, finer MCS rate adaptation, extended low-power range (ELR), and improved spectrum efficiency (DRU). LitePoint says IQxel-MX supports full lifecycle physical-layer testing from R&D to high-volume manufacturing, enabling Qualcomm to prepare Wi‑Fi 8 for commercial deployment and AI-driven, ultra-low-latency applications.
Teradyne (NYSE:TER) announced it will open a new U.S. Operations Hub in Wixom, Metro Detroit, Michigan in 2026 to manufacture Universal Robots (UR) cobots and potentially MiR autonomous mobile robots (AMRs).
The facility will serve as a regional training center, service hub, and visitor experience, support reshoring and advanced manufacturing across the U.S., and is expected to create over 200 jobs in Michigan over the coming years.
The hub complements Teradyne Robotics’ existing North American presence and aims to place manufacturing and customer support closer to major U.S. industrial customers.
Viam (TER) announced a partnership with Universal Robots to make UR Series collaborative robots a flagship hardware partner as Viam scales industrial automation.
Viam said it has built an AI-powered robotic block sanding system for marine fiberglass sanding and broader manufacturing tasks (gelcoat, paint, wood sanding, polishing). The solution debuted at IBEX 2025 and will appear at Metstrade 2025 (Nov 18–20) in Amsterdam. Viam highlighted hardware-agnostic software, labs in New York and Italy, and applications intended to address labor shortages and improve consistency.
Teradyne (NASDAQ:TER) declared a quarterly cash dividend of $0.12 per share, payable on December 17, 2025.
The dividend will be paid to shareholders of record at the close of business on November 24, 2025.
Teradyne (NASDAQ: TER) announced a finance leadership transition: Michelle Turner will become Chief Financial Officer effective November 3, 2025, replacing Sanjay Mehta, who has served as CFO since 2019.
Mr. Mehta will remain as an executive advisor to support capacity expansion tied to demand in Semiconductor Test and plans to retire in 2026. Ms. Turner brings 30 years of financial and strategic leadership across technology and manufacturing and most recently served as CFO of L3Harris Technologies.
The company said the move aligns leadership to address accelerating demand from AI, semiconductors, and industrial automation.
Teradyne (NASDAQ: TER) reported Q3 2025 revenue of $769 million, up 4% year‑over‑year, with Semiconductor Test contributing $606 million, Product Test $88 million and Robotics $75 million. GAAP EPS was $0.75 and non‑GAAP EPS was $0.85. Management said results landed at the high end of Q3 guidance driven by SOC solutions for AI and memory.
Teradyne guided Q4'25 revenue of $920M–$1,000M, implying ~25% sequential and 27% YoY growth, with GAAP EPS of $1.12–$1.39 and non‑GAAP EPS of $1.20–$1.46. A webcast is scheduled 8:30 a.m. ET Oct 29, 2025.
Teradyne (NASDAQ: TER) will release third quarter 2025 financial results on Tuesday, October 28, 2025 after 5:00 p.m. ET. A conference call to discuss results and management's business outlook will follow on Wednesday, October 29, 2025 at 8:30 a.m. ET.
Investors can join the live webcast at investors.teradyne.com/events-presentations (recommended at least five minutes early). Presentation materials will be posted at 7:30 a.m. ET on October 29, and a replay will be available on the Teradyne investor website.
Pragmatic Semiconductor (TER) appointed Peter Herweck as Chair of the Board effective Oct 7, 2025, succeeding Erik Langaker who will remain a director through Oct 31, 2025.
Herweck brings 40+ years of global technology and industrial automation leadership, including roles as CEO of Schneider Electric and AVEVA and senior positions at Siemens. The company highlighted recent milestones under Langaker, including a $231m Series D round and expansion of global manufacturing to commercialize its FlexIC flexible integrated circuit technology.