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Teradyne Introduces Omnyx Edge, Inline Board Test for Physical and Edge AI

Teradyne (NASDAQ: TER) introduced Omnyx Edge, an inline board test platform for physical and edge artificial intelligence devices.

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The Omnyx family extends from the data center to the edge, bringing inline test to the compute, sensing, and motion boards of automotive, robotic, and edge devices.

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today introduced Omnyx Edge, an inline board test platform for physical and edge AI. Omnyx Edge extends the Omnyx family from the data center to the edge, testing the boards that let physical and edge AI devices perceive, decide, and act.

Teradyne Omnyx Edge brings inline board test to the compute, sensing, and motion boards behind physical and edge AI.

Teradyne Omnyx Edge brings inline board test to the compute, sensing, and motion boards behind physical and edge AI.

AI is expanding beyond the data center into the physical world. Robots carry onboard AI compute alongside dense sensing and dozens of joint and actuator drives. Factories and logistics sites are deploying AI at the point of use, and vehicles are consolidating control units into central compute and zonal controllers. Each of these boards is denser, more valuable, more power-hungry, and often more safety-critical than the board it replaces, which raises the value of catching defects inline, before the board is built into a vehicle or robot.

Omnyx Edge tests all three board-level layers of a physical AI system:

  • Intelligence: AI compute modules, and robot and domain controllers
  • Sensing: camera, radar, lidar, and sensor-fusion boards
  • Motion: power conversion, motor control, joint drives, and actuation

“The next wave of AI runs on edge devices that must perceive, decide, and act in real time, and every board inside them carries more compute, more power, and more responsibility than ever before,” said Regan Mills, president of the Product Test group at Teradyne. “Omnyx established our AI board test capability in the data center. Omnyx Edge brings that capability to the edge, so manufacturers catch defects before the board is built into the product as robotics and industrial edge AI programs scale.”

Key Features and Benefits

  • Boundary scan coverage. Boundary scan and device programming, including third-party integration, through an updated system controller extend coverage to dense compute boards with limited physical access.
  • PowerSense touchless sensing. Touchless pulse-width modulation (PWM) sensing validates the DC-DC converters and power stages that feed AI processors and motion boards.
  • LEDSense. Extends optical test coverage to onboard LEDs on edge AI boards.
  • Built for the automated factory. A modern programmable logic controller (PLC) and human-machine interface (HMI) architecture, together with handler control, improve factory integration and throughput.
  • AI-based preventive maintenance. Protects uptime and overall equipment effectiveness (OEE) on high-value, high-volume lines.

With Omnyx and Omnyx Edge, Teradyne now tests the boards behind AI wherever it runs, from the data center to the edge devices bringing AI into the physical world. Omnyx Edge will be on display at electronica 2026, Hall A4, Booth 431, November 10-13, 2026, in Munich, Germany, with live demonstrations of PowerSense, boundary scan integration, and line automation. Learn more at https://www.teradyne.com/products/omnyx-edge/.

About Teradyne
Teradyne (NASDAQ: TER) designs, develops, and manufactures automated test equipment and advanced robotics systems. Its semiconductor and electronics test solutions span the full AI device supply chain, from wafer to data center, enabling customers to meet the quality and reliability standards the AI era demands. Its advanced robotics business deploys intelligent automation across manufacturing, logistics, and data center operations for customers worldwide. For more information, visit teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc., in the U.S. and other countries.

For more information:
Amy McAndrews
Investor Relations
Tel 978.370.3945
Investor.relations@teradyne.com

Source: Teradyne, Inc.

Key Terms

pwm technical
Private wealth management is a personalized financial service for high-net-worth individuals that combines investment advice, tax planning, estate guidance and other money-management tasks under one roof. Think of it as a tailored financial playbook and coach that helps preserve and grow a person’s assets while addressing risks and goals; investors monitor changes in a firm’s wealth-management business because it can signal revenue stability, fee income and client trust.
plc technical
A plc is a legal company form in the United Kingdom, Ireland and a few other common-law jurisdictions meaning "public limited company." It signifies a corporation whose owners have limited liability and whose shares may be offered to the public; the letters usually appear after the company name. Being a plc denotes a statutory corporate structure with specific governance and reporting rules distinct from private limited companies, but it does not by itself mean the company is listed on a stock exchange.
overall equipment effectiveness technical
Overall Equipment Effectiveness (OEE) is a single percentage that shows how well a factory’s machines are being used by combining uptime, speed, and the share of good products produced into one number. Investors use it like a health check for manufacturing: a higher OEE means fewer breakdowns, less waste and more output from the same assets, which can boost margins and reduce the need for extra capital. Think of it as a fuel-efficiency rating for a production line.
boundary scan technical
A boundary scan is a hardware test and debug method defined by the IEEE 1149.1 (JTAG) standard that adds small test registers to the inputs and outputs of digital integrated circuits so circuits on a printed circuit board can be inspected and exercised through a serial test interface rather than by physical probes. It lets technicians check connections between chips, load test patterns, read back pin states, program devices, and diagnose faults when boards are inaccessible or too dense for bed-of-nails probing. Boundary-scan cannot directly test purely analog circuits or signals not routed through the added scan cells, and it requires the chips to be designed or configured to include the scan capability.

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