TSS, Inc. Unveils 2026 Trends in High Performance Computing and Data Center Technology
TSS (NASDAQ:TSSI) released a leadership white paper dated November 20, 2025 outlining strategic guidance for procurement and integration leaders in AI, high-performance computing (HPC), and data center technology.
The paper identifies four key trends: AI workload security and flexibility, Modular Data Centers (MDC 2.0) and edge evolution, AI deployment bottlenecks and infrastructure shifts, and sustainability with circular thinking. It also offers seven actionable recommendations covering secure supply chains, modular deployments, sustainability, and compliance to help organizations future-proof infrastructure investments.
The resource targets IT leaders, procurement professionals, and OEM partners and is available for download at the company website.
TSS (NASDAQ:TSSI) ha pubblicato un white paper di leadership datato 20 novembre 2025 che presenta indicazioni strategiche per i responsabili dell'approvvigionamento e dell'integrazione nel campo dell'IA, dell'alta elaborazione (HPC) e della tecnologia dei data center.
Il documento identifica quattro tendenze chiave: sicurezza e flessibilità dei carichi di lavoro AI, Modular Data Centers (MDC 2.0) e evoluzione edge, collo di bottiglia per il dispiegamento di AI e cambiamenti infrastrutturali, e sostenibilità con un approccio circolare. Offre inoltre sette raccomandazioni pratiche che riguardano catene di approvvigionamento sicure, deployment modulari, sostenibilità e conformità per aiutare le organizzazioni a rendere future-proof gli investimenti in infrastrutture.
La risorsa è rivolta ai responsabili IT, ai professionisti degli approvvigionamenti e ai partner OEM ed è disponibile per il download sul sito dell'azienda.
TSS (NASDAQ:TSSI) publicó un libro blanco de liderazgo con fecha 20 de noviembre de 2025 que presenta directrices estratégicas para líderes de adquisiciones e integración en IA, cómputo de alto rendimiento (HPC) y tecnología de centros de datos.
El documento identifica cuatro tendencias clave: seguridad y flexibilidad de las cargas de IA, Centros de Datos Modulares (MDC 2.0) y evolución en el edge, cuellos de botella en el despliegue de IA y cambios en la infraestructura, y sostenibilidad con pensamiento circular. También ofrece siete recomendaciones accionables que cubren cadenas de suministro seguras, despliegues modulares, sostenibilidad y cumplimiento para ayudar a las organizaciones a proteger sus inversiones en infraestructura a futuro.
El recurso está dirigido a líderes de IT, profesionales de compras y socios OEM y está disponible para su descarga en el sitio web de la empresa.
TSS (NASDAQ:TSSI)는 2025년 11월 20일자로 된 리더십 백서를 발표했으며 AI, 고성능 컴퓨팅(HPC), 데이터 센터 기술에 대한 조달 및 통합 리더를 위한 전략적 가이드를 제시합니다.
백서는 네 가지 핵심 트렌드를 식별합니다: AI 워크로드 보안과 유연성, 모듈러 데이터 센터(MDC 2.0) 및 엣지 진화, AI 배포의 병목 현상 및 인프라 변화, 그리고 순환 사고를 통한 지속 가능성. 또한 보안된 공급망, 모듈러 배치, 지속 가능성 및 준수에 초점을 맞춘 일곱 가지 실행 가능한 권고안을 제공하여 조직이 인프라 투자 미래 대응력을 강화하도록 돕습니다.
해당 자료는 IT 리더, 조달 전문가 및 OEM 파트너를 대상으로 하며 회사 웹사이트에서 다운로드할 수 있습니다.
TSS (NASDAQ:TSSI) a publié un livre blanc de leadership daté du 20 novembre 2025 décrivant des orientations stratégiques pour les responsables des achats et de l'intégration dans l'IA, le calcul haute performance (HPC) et la technologie des centres de données.
Le document identifie quatre tendances clés : sécurité et flexibilité des charges de travail IA, Centres de Données Modulaires (MDC 2.0) et évolution de l'edge, goulots d'étranglement du déploiement de l'IA et évolutions de l'infrastructure, et durabilité avec une pensée circulaire. Il propose également sept recommandations concrètes couvrant les chaînes d'approvisionnement sécurisées, les déploiements modulaires, la durabilité et la conformité pour aider les organisations à préparer leurs investissements d'infrastructure pour l'avenir.
La ressource s'adresse aux dirigeants IT, aux professionnels des achats et aux partenaires OEM et est disponible au téléchargement sur le site de l'entreprise.
TSS (NASDAQ:TSSI) hat ein Leadership-Whitepaper mit dem Datum 20. November 2025 veröffentlicht, das strategische Leitlinien für Beschaffungs- und Integrationsführer in KI, Hochleistungsrechnen (HPC) und Rechenzentrentechnologie darstellt.
Das Dokument identifiziert vier Schwerpunktthemen: Sicherheit und Flexibilität von KI-Arbeitslasten, Modulare Rechenzentren (MDC 2.0) und Edge-Entwicklung, Hindernisse bei der KI-Bereitstellung und Infrastrukturverschiebungen, und Nachhaltigkeit mit zirkulärem Denken. Außerdem bietet es sieben umsetzbare Empfehlungen, die sichere Lieferketten, modulare Bereitstellungen, Nachhaltigkeit und Compliance abdecken, um Organisationen dabei zu helfen, Infrastrukturinvestitionen zukunftssicher zu machen.
Die Ressource richtet sich an IT-Führungskräfte, Beschaffungsprofis und OEM-Partner und ist zum Download auf der Unternehmenswebsite verfügbar.
TSS (NASDAQ:TSSI) أصدرت ورقة بيضاء للقيادة بتاريخ 20 نوفمبر 2025 توضح توجيهات استراتيجية لقادة الشراء والاندماج في الذكاء الاصطناعي والحوسبة عالية الأداء (HPC) وتكنولوجيا مراكز البيانات.
تحدد الورقة أربعة اتجاهات رئيسية: أمن ومرونة أحمال عمل الذكاء الاصطناعي، مراكز بيانات معيارية ( MDC 2.0 ) وتطور الحافة، اختناقات نشر الذكاء الاصطناعي وتحولات البنية التحتية، و الاستدامة بتفكير دائري. كما تقدم سبع توصيات قابلة لتنفيذ تغطي سلاسل الإمداد الآمنة والتوزيعات المعيارية والاستدامة والامتثال لمساعدة المنظمات على تجهيز استثماراتها في البنية التحتية للمستقبل.
يستهدف المورد قادة تكنولوجيا المعلومات ومحترفي الشراء وشركاء OEM وهو متاح للتنزيل من موقع الشركة.
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AUSTIN, TEXAS / ACCESS Newswire / November 20, 2025 / TSS, Inc. (NASDAQ:TSSI), a data center services company that provides AI and high-performance computing (HPC) infrastructure and software integration services, today announced the release of its latest leadership paper: 2026 Trends in High-Performance Computing and Data Center Technology: A Strategic Guide for Procurement and Integration Leaders and Partners.
As artificial intelligence (AI) becomes ubiquitous, HPC and data center technology infrastructure decisions have never been more consequential. Organizations of all sizes are rethinking how they deploy, secure, and scale their digital infrastructure. This comprehensive paper identifies four key trends shaping the future of enterprise IT and HPC:
AI Workload security and flexibility as a parallel to uptime.
Modular Data Centers (MDC 2.0) & Edge Evolution.
AI Deployment Bottlenecks & Infrastructure Shifts
Sustainability: Circular thinking for linear growth.
The paper also delivers seven actionable recommendations for IT leaders, procurement professionals, and OEM partners to future-proof infrastructure investments. From secure supply chains and modular deployments to sustainability and compliance, this resource is designed for decision-makers at companies driving innovation in HPC, AI, and edge computing.
Download the full white paper here: https://tssiusa.com/trends-2026
About TSS, Inc.
TSS specializes in simplifying the complex. The TSS mission is to streamline the integration and deployment of high-performance computing infrastructure and software, ensuring that end users quickly receive and efficiently utilize the necessary technology. Known for flexibility, the company builds, integrates, and deploys custom, high-volume solutions that empower data centers and catalyze the digital transformation of generative AI and other leading-edge technologies essential for modern computing, data, and business needs. TSS's reputation is built on passion and experience, quality, and fast time to value. As trusted partners of the world's leading data center technology providers, the company manages and deploys billions of dollars in technology each year. For more information, visit www.tssiusa.com.
Contact:
Tad Druart, Pierpont Communications
tdruart@piercom.com
512-448-4950
SOURCE: TSS, Inc.
View the original press release on ACCESS Newswire
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