Veeco Announces Over $35 Million in Advanced Packaging Lithography System Orders From IDM & OSAT Customers
Veeco Instruments (NASDAQ: VECO) has secured over $35 million in orders for its AP300™ Lithography systems from various IDM and OSAT customers. The orders, scheduled for delivery in 2025, support capacity expansions driven by AI and high-performance computing demands. The AP300™ systems offer industry-leading performance for Advanced Packaging applications, featuring lower total cost of ownership, high uptime, and process flexibility.
The systems are designed to handle next-generation advanced packaging processes, including copper pillar for 2.5/3D packaging, flip chip bumping, fan-out WLP, and high-density fan-out packaging. Veeco's Advanced Packaging Lithography business is projected to achieve strong year-over-year growth in 2025, driven by global megatrends in AI and high-performance computing.
Veeco Instruments (NASDAQ: VECO) ha ottenuto ordini per oltre 35 milioni di dollari per i suoi sistemi di litografia AP300™ da diversi clienti IDM e OSAT. Gli ordini, con consegna prevista per il 2025, supportano l'espansione della capacità guidata dalla domanda di AI e calcolo ad alte prestazioni. I sistemi AP300™ offrono prestazioni leader nel settore per applicazioni di Advanced Packaging, con un costo totale di proprietà ridotto, elevata operatività e flessibilità di processo.
I sistemi sono progettati per gestire i processi di packaging avanzato di nuova generazione, inclusi copper pillar per packaging 2.5/3D, flip chip bumping, fan-out WLP e packaging fan-out ad alta densità. Il business di Advanced Packaging Lithography di Veeco prevede una forte crescita anno su anno nel 2025, trainata dalle megatrend globali di AI e calcolo ad alte prestazioni.
Veeco Instruments (NASDAQ: VECO) ha asegurado pedidos por más de 35 millones de dólares para sus sistemas de litografía AP300™ de varios clientes IDM y OSAT. Los pedidos, programados para entrega en 2025, respaldan la expansión de capacidad impulsada por la demanda de IA y computación de alto rendimiento. Los sistemas AP300™ ofrecen un rendimiento líder en la industria para aplicaciones de Advanced Packaging, con un menor costo total de propiedad, alta disponibilidad y flexibilidad en el proceso.
Los sistemas están diseñados para manejar procesos avanzados de empaquetado de próxima generación, incluyendo copper pillar para empaquetado 2.5/3D, bumping flip chip, fan-out WLP y empaquetado fan-out de alta densidad. Se proyecta que el negocio de Advanced Packaging Lithography de Veeco logre un fuerte crecimiento interanual en 2025, impulsado por las megatendencias globales en IA y computación de alto rendimiento.
Veeco Instruments (NASDAQ: VECO)는 다양한 IDM 및 OSAT 고객으로부터 AP300™ 리소그래피 시스템에 대해 3,500만 달러 이상의 주문을 확보했습니다. 이 주문들은 2025년에 배송될 예정이며, AI 및 고성능 컴퓨팅 수요에 따른 생산 능력 확장을 지원합니다. AP300™ 시스템은 첨단 패키징 애플리케이션에 대해 업계 최고 수준의 성능을 제공하며, 총 소유 비용 절감, 높은 가동 시간, 공정 유연성을 특징으로 합니다.
이 시스템들은 2.5/3D 패키징용 구리 필라, 플립 칩 범핑, 팬아웃 WLP, 고밀도 팬아웃 패키징 등 차세대 첨단 패키징 공정을 처리하도록 설계되었습니다. Veeco의 첨단 패키징 리소그래피 사업은 AI 및 고성능 컴퓨팅의 글로벌 메가트렌드에 힘입어 2025년에 강력한 연간 성장세를 기록할 것으로 예상됩니다.
Veeco Instruments (NASDAQ : VECO) a obtenu plus de 35 millions de dollars de commandes pour ses systèmes de lithographie AP300™ auprès de divers clients IDM et OSAT. Les commandes, dont la livraison est prévue en 2025, soutiennent les expansions de capacité motivées par la demande en IA et en calcul haute performance. Les systèmes AP300™ offrent des performances de pointe dans l'industrie pour les applications d'emballage avancé, avec un coût total de possession réduit, une haute disponibilité et une grande flexibilité de processus.
Ces systèmes sont conçus pour gérer les processus d'emballage avancé de nouvelle génération, notamment le pilier en cuivre pour l'emballage 2.5/3D, le bumping flip chip, le fan-out WLP et l'emballage fan-out haute densité. L'activité Lithographie pour l'emballage avancé de Veeco devrait connaître une forte croissance annuelle en 2025, portée par les mégatendances mondiales en IA et calcul haute performance.
Veeco Instruments (NASDAQ: VECO) hat Aufträge im Wert von über 35 Millionen US-Dollar für seine AP300™ Lithographiesysteme von verschiedenen IDM- und OSAT-Kunden erhalten. Die Lieferungen sind für 2025 geplant und unterstützen Kapazitätserweiterungen, die durch die Nachfrage nach KI und Hochleistungsrechnern angetrieben werden. Die AP300™ Systeme bieten branchenführende Leistung für Advanced Packaging-Anwendungen mit niedrigen Gesamtbetriebskosten, hoher Betriebszeit und Prozessflexibilität.
Die Systeme sind darauf ausgelegt, nächste Generationen von Advanced Packaging-Prozessen zu bewältigen, darunter Kupfersäulen für 2.5D/3D Packaging, Flip-Chip-Bumping, Fan-Out WLP und hochdichtes Fan-Out Packaging. Das Advanced Packaging Lithography-Geschäft von Veeco wird für 2025 ein starkes Wachstum gegenüber dem Vorjahr prognostiziert, getrieben von globalen Megatrends in KI und Hochleistungsrechnern.
- Secured over $35 million in new orders for AP300™ Lithography systems
- Expected strong year-over-year growth in Advanced Packaging Lithography business for 2025
- Orders driven by high-growth markets including AI and high-performance computing
- System offers competitive advantages including lower cost of ownership and industry-leading uptime
- None.
Insights
Veeco secures $35M+ in advanced packaging system orders, strengthening its position in the AI chip manufacturing supply chain.
Veeco's announcement of
The timing is particularly noteworthy as advanced packaging technologies become increasingly essential in semiconductor manufacturing. With traditional Moore's Law scaling facing physical and economic limitations, advanced packaging techniques enable continued performance gains through better chip integration rather than just transistor shrinking. This positions Veeco advantageously in a strategic growth segment of the semiconductor equipment market.
Technically, these systems address sophisticated packaging applications including copper pillar formation for 2.5/3D packaging, flip chip bumping, and high-density fan-out wafer-level packaging - all critical enabling technologies for AI and high-performance computing chips. These packaging approaches allow multiple chiplets to work together efficiently while managing heat and power constraints.
For a company of Veeco's scale (typical quarterly revenues between
The diverse customer base for these orders indicates Veeco's technology has appeal across different segments of semiconductor manufacturing, reducing customer concentration risk. This positions Veeco as a beneficiary of the broader industry investment cycle in advanced packaging equipment driven by AI computing demands.
PLAINVIEW, N.Y., May 07, 2025 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (NASDAQ: VECO) today announced its received over
Veeco’s AP300™ Lithography systems offer industry-leading performance specifically designed for Advanced Packaging applications, lower total cost of ownership, industry-leading uptime, and process flexibility. Recent orders highlight accelerating market demand for Veeco’s lithography systems given the tools’ ability to handle next generation advanced packaging process needs, such as copper (Cu) pillar for 2.5/3D packaging, flip chip bumping, fan-out WLP (FOWLP) and high-density fan-out packaging.
“Global megatrends such as AI and high-performance computing are driving strong demand for enabling technologies in advanced packaging,” commented Adrian Devasahayam, Ph.D., Veeco’s Senior Vice President, Product Line Management. “Customers require a lithography platform that can handle a wide range of advanced packaging process needs with best-in-class process capabilities and low cost of ownership. Our AP300 platform is distinguished as a solution that sets the industry standard for challenging advanced packaging processes required for high-performance, next-generation devices.”
About Veeco
Veeco (NASDAQ: VECO) is an innovative manufacturer of semiconductor process equipment. Our laser annealing, ion beam, single wafer etch & clean, lithography, and metal organic chemical vapor deposition (MOCVD) technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. With equipment designed to optimize performance, yield and cost of ownership, Veeco holds leading technology positions in the markets we serve. To learn more about Veeco’s systems and service offerings, visit www.veeco.com.
To the extent that this news release discusses expectations or otherwise makes statements about the future, such statements are forward-looking and are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include the risks discussed in the Business Description and Management's Discussion and Analysis sections of Veeco's Annual Report on Form 10-K for the year ended December 31, 2024 and in our subsequent quarterly reports on Form 10-Q, current reports on Form 8-K and press releases. Veeco does not undertake any obligation to update any forward-looking statements to reflect future events or circumstances after the date of such statements.
Veeco Contacts:
Investors: Anthony Pappone | (516) 500-8798 | apappone@veeco.com
Media: Javier Banos | (516) 673-7328 | jbanos@veeco.com 
FAQ
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