Veeco Announces Over $35 Million in Advanced Packaging Lithography System Orders From IDM & OSAT Customers

Rhea-AI Summary

Veeco Instruments (NASDAQ: VECO) has secured over $35 million in orders for its AP300™ Lithography systems from various IDM and OSAT customers. The orders, scheduled for delivery in 2025, support capacity expansions driven by AI and high-performance computing demands. The AP300™ systems offer industry-leading performance for Advanced Packaging applications, featuring lower total cost of ownership, high uptime, and process flexibility.

The systems are designed to handle next-generation advanced packaging processes, including copper pillar for 2.5/3D packaging, flip chip bumping, fan-out WLP, and high-density fan-out packaging. Veeco's Advanced Packaging Lithography business is projected to achieve strong year-over-year growth in 2025, driven by global megatrends in AI and high-performance computing.

Positive

• Secured over $35 million in new orders for AP300™ Lithography systems
• Expected strong year-over-year growth in Advanced Packaging Lithography business for 2025
• Orders driven by high-growth markets including AI and high-performance computing
• System offers competitive advantages including lower cost of ownership and industry-leading uptime

Negative

• None.

PLAINVIEW, N.Y., May 07, 2025 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (NASDAQ: VECO) today announced its received over $35 million of orders for its AP300™ Lithography systems in recent quarters from a wide-range of IDM and OSAT customers. The orders are expected to be delivered in 2025, and are supporting capacity expansions driven by several end markets, including AI and high-performance computing. Veeco’s Advanced Packaging Lithography business is expected to deliver strong year-over-year growth in 2025.

Veeco’s AP300™ Lithography systems offer industry-leading performance specifically designed for Advanced Packaging applications, lower total cost of ownership, industry-leading uptime, and process flexibility. Recent orders highlight accelerating market demand for Veeco’s lithography systems given the tools’ ability to handle next generation advanced packaging process needs, such as copper (Cu) pillar for 2.5/3D packaging, flip chip bumping, fan-out WLP (FOWLP) and high-density fan-out packaging.

“Global megatrends such as AI and high-performance computing are driving strong demand for enabling technologies in advanced packaging,” commented Adrian Devasahayam, Ph.D., Veeco’s Senior Vice President, Product Line Management. “Customers require a lithography platform that can handle a wide range of advanced packaging process needs with best-in-class process capabilities and low cost of ownership. Our AP300 platform is distinguished as a solution that sets the industry standard for challenging advanced packaging processes required for high-performance, next-generation devices.”

About Veeco
Veeco (NASDAQ: VECO) is an innovative manufacturer of semiconductor process equipment. Our laser annealing, ion beam, single wafer etch & clean, lithography, and metal organic chemical vapor deposition (MOCVD) technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. With equipment designed to optimize performance, yield and cost of ownership, Veeco holds leading technology positions in the markets we serve. To learn more about Veeco’s systems and service offerings, visit www.veeco.com.

To the extent that this news release discusses expectations or otherwise makes statements about the future, such statements are forward-looking and are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include the risks discussed in the Business Description and Management's Discussion and Analysis sections of Veeco's Annual Report on Form 10-K for the year ended December 31, 2024 and in our subsequent quarterly reports on Form 10-Q, current reports on Form 8-K and press releases. Veeco does not undertake any obligation to update any forward-looking statements to reflect future events or circumstances after the date of such statements.

Veeco Contacts:                                
Investors: Anthony Pappone | (516) 500-8798 | apappone@veeco.com
Media: Javier Banos | (516) 673-7328 | jbanos@veeco.com

FAQ

What is the value of recent orders received by Veeco (VECO) for AP300™ Lithography systems?

Veeco received over $35 million in orders for its AP300™ Lithography systems from IDM and OSAT customers, with deliveries expected in 2025.

What markets are driving demand for Veeco's AP300™ Lithography systems?

The demand is primarily driven by AI and high-performance computing markets, which require advanced packaging solutions.

What are the key features of Veeco's AP300™ Lithography systems?

The AP300™ systems offer industry-leading performance, lower total cost of ownership, high uptime, and process flexibility for advanced packaging applications.

What types of advanced packaging processes can Veeco's AP300™ handle?

The AP300™ can handle copper pillar for 2.5/3D packaging, flip chip bumping, fan-out WLP (FOWLP), and high-density fan-out packaging.

When will Veeco (VECO) deliver the new AP300™ system orders?

The orders are expected to be delivered throughout 2025.