VIAVI to Showcase End-to-End Data Center Testing Portfolio Enabling Scale-Up, Scale-Out and Scale-Across to 1.6T and Beyond at ECOC 2026

VIAVI is presenting a broadened test portfolio for high-speed AI data center, CPO, quantum and Hollow Core Fiber networks at ECOC 2026.

Rhea-AI Summary

VIAVI (VIAV) will showcase its end-to-end data center test portfolio for 1.6T and future 3.2T infrastructure at ECOC 2026 in Malaga, Spain, from September 21-23.

Demonstrations span the full lifecycle from design validation to manufacturing test and deployment and monitoring. Highlights include the ONE LabPro ONE-1600 platform for pluggable 1.6T transceivers, TestCenter D2 for AI fabric and Ultra Ethernet Transport validation, and new MAP-300 modules for CPO, Silicon Photonics, and quantum/hybrid network evaluation. VIAVI will also introduce the MAP-2800 Ethernet test head up to 800G, DCX-700 for automated certification of high fiber-count networks, and expanded Hollow Core Fiber test capabilities.

Key Figures

Data-center technology scale: 1.6T Planned technology scale: 3.2T Lane architectures: 16x224G and 8x448G +1 more

Data-center technology scale

1.6T

Technologies being deployed across scale-up, scale-out and scale-across architectures

Planned technology scale

3.2T

Future data-center technology planning

Lane architectures

16x224G and 8x448G

Architectures supporting 1.6T technologies

Ethernet testing range

10M to 800G

MAP-2800 rack-mounted tester for Ethernet applications

Key Terms

silicon photonics, co-packaged optics, ultra ethernet transport, quantum key distribution, +1 more

5 terms

silicon photonics technical

"enabled through advanced Silicon Photonics (SiPh), Co-packaged Optics"

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

co-packaged optics technical

"advanced Silicon Photonics (SiPh), Co-packaged Optics (CPO)"

Co-packaged optics are optical components—lasers and fiber interfaces—physically packaged together with a network switch’s main processing chip so light-based data links sit much closer to the chip instead of traveling over long electrical traces. For investors, this matters because it can dramatically cut power use, boost data speed and density, and lower system costs in large data centers and telecom equipment, much like moving a power outlet next to a heavy appliance to avoid long, inefficient extension cords.

ultra ethernet transport technical

"first Ultra Ethernet Transport (UET) validation solution"

Ultra Ethernet Transport is a high-capacity method for moving large volumes of internet data across networks, combining Ethernet standards with enhanced transmission techniques to carry more traffic farther and faster. Investors should care because it acts like a wider, smoother highway for digital services—supporting higher revenues from bandwidth-hungry customers, lowering per-unit delivery costs, and improving network reliability and scalability, all of which can affect service demand and profit margins.

quantum key distribution technical

"supports quantum key distribution (QKD) and hybrid network evaluation"

Quantum key distribution is a way of creating and sharing secret encryption keys using the laws of quantum physics, typically by sending tiny particles of light so that any eavesdropping automatically changes them and can be detected. Investors care because it promises much stronger, tamper-evident protection for sensitive data and communications—like a lock that signals if it’s been picked—affecting the value of cybersecurity, telecom and defense technologies as quantum computing advances.

hollow core fiber technical

"portfolio for testing Hollow Core Fiber (HCF)"

Hollow core fiber is a type of light-guiding cable where the center is mostly air rather than solid glass, so light travels through a hollow tube much like a bullet through a barrel. It can carry signals faster, with less signal loss and lower heating than conventional solid-core fiber, which matters to investors because it can reduce operating costs, enable lower-latency and higher-capacity networks, and open new markets in telecom, data centers, and sensing.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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Demonstrations to include L0-3 and AI fabric validation, CPO and Silicon Photonics testing, quantum and hybrid network evaluation, and fiber inspection, cleaning and monitoring solutions

CHANDLER, Ariz., Sept. 9, 2026 /PRNewswire/ -- VIAVI Solutions Inc. (VIAVI) (NASDAQ: VIAV) will showcase its end-to-end data center portfolio for foundational silicon technologies, modules and systems testing at booth 1001 at ECOC 2026 from September 21-23 at the FYCMA exhibition center in Malaga, Spain.

Hyperscalers and cloud providers continue to push the boundaries of network speed and capacity as they scale AI infrastructure. 1.6T technologies are being deployed within the rack (scale-up), across clusters (scale-out) and between data centers (scale-across), with planning for 3.2T underway. These technologies rely on 16x224G and 8x448G lane architectures enabled through advanced Silicon Photonics (SiPh), Co-packaged Optics (CPO) and robust optical connectivity. AI infrastructure is driving unprecedented growth in fiber density, accelerating the expansion of fiber interconnects and multifiber connectivity. In addition, quantum technologies are impacting security assumptions, driving significant increases in system-level test complexity.

VIAVI addresses these test challenges at every stage, from design and production to deployment and monitoring.

Design Validation: At ECOC 2026, VIAVI will showcase its latest advanced fabric validation technologies for L0 to L3 High-Speed Ethernet (HSE) testing, including:

• ONE LabPro® ONE-1600: the industry's first fully integrated test solution for pluggable 1.6T transceivers now supports a flexible new configuration, with both IHS and RHS interfaces in the same module. Also on display is the new ONE-1600 ERP 1.6T module for network equipment manufacturers and production use cases, sized for these environments with a core feature set at a reduced price point.
• TestCenter D2: enabling comprehensive AI workload testing of 1.6T Layers 2 and 3, the platform identifies interconnect bottlenecks, latency hotspots and fault-tolerance gaps that limit GPU utilization and hinder AI cluster scalability. It is the industry's first Ultra Ethernet Transport (UET) validation solution for AI fabric validation across the Ultra Ethernet ecosystem. 

Manufacturing Test: VIAVI's MAP-300 platform will feature several new products for CPO and SiPh testing. Engineered for the high-density demands driven by connectivity, silicon test insertions and sub-system manufacturing, the MAP-300 now includes a Remote Head Polarity Mapper, a High-Density Variable Optical Attenuator (HD VOA), a High-Density Optical Power Meter (HD OPM) and a High-Density In-Line Optical Power Meter (HD IL-OPM). The platform also supports quantum key distribution (QKD) and hybrid network evaluation.

For the first time, VIAVI will present its optical connector end-face geometry test solutions from the acquisition of the Direct Optical Research Company (DORC) product line. The fiber surface topology measurement products round out VIAVI's interferometry, inspection and cleaning portfolio for connectivity manufacturers.

Deployment and Monitoring: VIAVI will introduce the MAP-2800 test head for standalone operation and centralized testing with the Fusion test system. It is the industry's first rack-mounted tester for Ethernet applications for centralized and field testing from 10M to 800G. It integrates seamlessly with other VIAVI handheld testers, test heads, virtual agents or smart Small Form-factor Pluggables (SFPs) for lower bandwidth sites, automating processes and minimizing truck rolls.

VIAVI will demonstrate the DCX-700 test set for automated tier-1 certification and validation for high fiber-count networks, helping data center operators deploy large-scale MPO/MMC-based connectivity faster and with greater confidence. VIAVI will also showcase its expanding portfolio for testing Hollow Core Fiber (HCF) with T-BERD/MTS-4000 and OneAdvisor800, which support the industry's drive toward lower latency and higher performance optical infrastructure through advanced characterization, qualification and monitoring solutions.

About VIAVI
VIAVI (NASDAQ: VIAV) is a global leader in test and measurement and optical technologies. Our test and measurement, and resilient Position, Navigation and Timing (PNT) solutions enable and secure critical infrastructure ranging from data center ecosystems and communication networks to military, aerospace, railway and first responder communications. In addition, we develop and advance technologies used in high-volume optical applications across anti-counterfeiting, consumer electronics, aerospace, industrial and automotive end markets.

Learn more about VIAVI at www.viavisolutions.com. Follow us on VIAVI Perspectives, LinkedIn and YouTube.

Media Inquiries:
Grand Bridges
Emma Jenkins
emma@grandbridges.com
+1 415 800 4529

 

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SOURCE VIAVI Solutions