Valens Semiconductor Introduces the VS6310 Chipset, Bringing Power-Efficient USB3 Extension Directly into Video Conferencing Devices
The chipset is designed to let manufacturers embed USB3 extension in peripherals rather than use separate extender boxes.
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Rhea-AI Summary
Valens Semiconductor (NYSE: VLN) introduced the VS6310 chipset for integrating USB3 extension directly into cameras and other conference room peripherals. The company says its lower power consumption reduces the need for external extender boxes in embedded designs.
Typical power consumption is less than 1 watt. The chipset extends USB3 at up to 2.5 Gbps, alongside USB2 at 480 Mbps and control signals, over standard Category cable for up to 40 meters. It is interoperable with the VS6320. Samples will be available in mid-November 2026, with mass production scheduled for January 2027.
Key Figures
- Typical power consumption
- less than 1 watt
- VS6310 chipset
- USB3 extension rate
- up to 2.5 Gbps
- VS6310 chipset
- USB2 data rate
- 480 Mbps
- VS6310 chipset
- Extension distance
- up to 40 meters
- Over standard Category cable
- Samples available
- mid-November 2026
- VS6310
- Mass production scheduled
- January 2027
- VS6310
Key Terms
hdbaset-usb3 technical
mipi a-phy technical
adas technical
AI-generated analysis. How Rhea-AI works. Not financial advice.
Low-power chipset enables manufacturers to integrate USB3 extension into a variety of conference room peripherals, reducing the need for external extender boxes
HOD HASHARON,
Video conferencing systems increasingly rely on high-quality cameras and other USB peripherals distributed throughout the room. Integrating USB3 extension directly into these devices reduces the need for separate extender boxes, resulting in simpler setups with fewer components to install and connect. With typical power consumption of less than 1 watt, the VS6310 addresses the power constraints of embedded designs, opening new opportunities across professional AV and video conferencing applications.
"The VS6310 opens new opportunities for our customers to integrate USB3 extension directly into their products," said Gili Friedman, Head of Audio-Video Business at Valens Semiconductor. "Its lower power consumption makes it suited for embedded designs, helping manufacturers reduce the need for external extender boxes and deliver simpler, cleaner video conferencing setups."
Compliant with the HDBaseT-USB3 standard, the VS6310 extends USB3 at up to 2.5 Gbps, alongside USB2 at 480 Mbps and control signals, over standard Category cable for distances of up to 40 meters. The chipset supports all USB transfer types and is interoperable with the VS6320, enabling manufacturers to select the appropriate combination of bandwidth, reach and power consumption for each peripheral.
VS6310 samples will be available in mid-November 2026, with mass production scheduled for January 2027.
About Valens Semiconductor
Valens Semiconductor (NYSE: VLN) is a leading provider of high-performance connectivity chipsets, enabling reliable, high-bandwidth, long-reach video transmission across the world's most demanding applications. Valens' chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, Advanced Driver Assistance Systems (ADAS) and autonomous driving. Valens is a pioneer in connectivity technologies and a key contributor to leading industry standards, including HDBaseT® and MIPI A-PHY. For more information, visit www.valens.com
Forward-Looking Statements
This press release includes "forward-looking statements" within the meaning of the "safe harbor" provisions of the United States Private Securities Litigation Reform Act of 1995. Forward-looking statements may be identified by the use of words such as "estimate," "plan," "project," "forecast," "intend," "will," "expect," "anticipate," "believe," "seek," "target" or other similar expressions that predict or indicate future events or trends or that are not statements of historical matters. These forward-looking statements are subject to a number of risks and uncertainties, including the cyclicality of the semiconductor industry; the effect of inflation and a rising interest rate environment on our customers and industry; the ability of our customers to absorb inventory; competition in the semiconductor industry, and the failure to introduce new technologies and products in a timely manner to compete successfully against competitors; if Valens fails to adjust its supply chain volume due to changing market conditions or fails to estimate its customers' demand; disruptions in relationships with any one of Valens' key customers or suppliers; any difficulty selling Valens' products if customers do not design its products into their product offerings; our ability to effectively manage, invest in, grow, and retain our sales force, research and development capabilities, marketing team and other key personnel; our ability to timely adjust product prices to customers following price increase by the supply chain; our ability to adjust our inventory level due to reduction in demand due to inventory buffers accrued by customers; our expectations regarding the outcome of any future litigation in which we are named as a party; our ability to adequately protect and defend our intellectual property and other proprietary rights; risks related to our use of AI technologies; our ability to successfully integrate or otherwise achieve anticipated benefits from acquired businesses; the market price and trading volume of the Valens ordinary shares may be volatile and could decline significantly; further deterioration of macroeconomic conditions due to ongoing global political and economic uncertainty; political, economic, governmental and tax consequences, as well as geopolitical tensions, associated with our incorporation and location in Israel; and those factors discussed in Valens' Form 20-F filed with the SEC on February 25, 2026 under the heading "Risk Factors," and other documents of Valens filed, or to be filed, with the SEC. Except as required by law, we undertake no obligations to make any revisions to the forward-looking statements contained in this press release or to update them to reflect events or circumstances occurring after the date of this press release, whether as a result of new information, future developments or otherwise.
Press Contacts
Yoni Dayan
Head of Communications
Valens Semiconductor Ltd.
Yoni.dayan@valens.com
Investor Contacts
Michal Ben Ari
Investor Relations Manager
Valens Semiconductor Ltd.
michal.benari@valens.com
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SOURCE Valens Semiconductor
FAQ
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When will Valens Semiconductor's VS6310 chipset be available?
VS6310 samples will be available in mid-November 2026, with mass production scheduled for January 2027.