Vertiv Accelerates AI Infrastructure Deployment with OCP-Compliant Power, Cooling, and Rack Ecosystem
Vertiv (NYSE: VRT) will showcase OCP-compliant rack, power and cooling technologies at the 2025 OCP Global Summit, Booth #C34, October 13–16, 2025. Highlights include the Vertiv SmartIT OCP rack supporting up to 142 kW loads, PowerIT PDUs delivering up to 57.6 kW, the overhead PowerBar Track busbar system, and CoolChip fluid manifolds integrated with CoolChip CDUs.
The booth also features Harting connectivity and demonstrations of prefabricated configurations for faster deployment, monitored/switched PDU cybersecurity features, and modular designs aimed at high-density AI and HPC deployments. Greg Ratcliff will present on converting OCP concepts into functional reference designs.
Vertiv (NYSE: VRT) presenterà rack, energia e soluzioni di raffreddamento conformi OCP al 2025 OCP Global Summit, Stand #C34, dal 13 al 16 ottobre 2025. Tra le novità: il rack Vertiv SmartIT OCP in grado di supportare carichi fino a 142 kW, i PDU PowerIT in grado di erogare fino a 57,6 kW, il sistema a busbar sospeso PowerBar Track e i manifold fluidi CoolChip integrati con i CDU CoolChip.
Lo stand presenta anche connettività Harting e dimostrazioni di configurazioni prefabbricate per deployment più rapido, funzionalità di cybersecurity monitorate/switch PDU e design modulari pensati per implementazioni ad alta densità di AI e HPC. Greg Ratcliff illustrerà come trasformare i concetti OCP in disegni di riferimento funzionali.
Vertiv (NYSE: VRT) mostrará racks, energía y tecnologías de enfriamiento compatibles con OCP en la Cumbre Global de OCP 2025, Stand #C34, del 13 al 16 de octubre de 2025. Los aspectos destacados incluyen el rack Vertiv SmartIT OCP que admite cargas de hasta 142 kW, los PDU PowerIT que entregan hasta 57,6 kW, el sistema de riel superior PowerBar Track y los manifolds de fluidos CoolChip integrados con los CDU CoolChip.
El stand también ofrece conectividad Harting y demostraciones de configuraciones prefabricadas para una implementación más rápida, características de ciberseguridad de PDU monitorizadas/interruptibles, y diseños modulares orientados a implementaciones de IA y HPC de alta densidad. Greg Ratcliff presentará sobre la conversión de conceptos OCP en diseños de referencia funcionales.
Vertiv (NYSE: VRT)은 2025 OCP Global Summit에서 OCP 호환 랙, 전력 및 냉각 기술을 선보이며 부스 〈C34〉, 2025년 10월 13–16일에 참가합니다. 하이라이트로는 최대 142 kW의 부하를 지원하는 Vertiv SmartIT OCP 랙, 최대 57.6 kW를 제공하는 PowerIT PDU, 천장형 PowerBar Track 버스바 시스템, CoolChip CDU와 통합된 CoolChip 유체 매니폴드가 있습니다.
부스에는 Harting 연결성과 더 빠른 배치를 위한 프리패브 구성 시연, 모니터링/스위치형 PDU 사이버보안 기능, 고밀도 AI 및 HPC 배치를 위한 모듈식 설계도 포함됩니다. Greg Ratcliff가 OCP 개념을 기능적 참조 설계로 전환하는 방법에 대해 발표합니다.
Vertiv (NYSE: VRT) présentera des technologies de racks, d'alimentation et de refroidissement conformes OCP au 2025 OCP Global Summit, stand n° C34, du 13 au 16 octobre 2025. Les points forts incluent le rack Vertiv SmartIT OCP capable de supporter des charges allant jusqu'à 142 kW, les PDU PowerIT délivrant jusqu'à 57,6 kW, le système de busbar suspendu PowerBar Track et les manomètres fluides CoolChip intégrés aux CDU CoolChip.
Le stand présente également une connectivité Harting et des démonstrations de configurations préfabriquées pour un déploiement plus rapide, des fonctionnalités de cybersécurité des PDU surveillées/commandées, et des conceptions modulaires destinées à des déploiements AI et HPC à haute densité. Greg Ratcliff présentera sur la conversion des concepts OCP en designs de référence fonctionnels.
Vertiv (NYSE: VRT) wird OCP-konforme Rack-, Energie- und Kühltechnologien auf dem 2025 OCP Global Summit vorstellen, Stand Nr. C34, vom 13. bis 16. Oktober 2025. Highlights sind das Vertiv SmartIT OCP-Rack, das Lasten bis zu 142 kW unterstützt, PowerIT-PDUs mit bis zu 57,6 kW, das overhead PowerBar Track-Busbarsystem und CoolChip-Fluidmanifolds, integriert in CoolChip-CDUs.
Der Stand zeigt außerdem Harting-Konnektivität und Vorführungen von vorkonfigurierten Lösungen für eine schnellere Bereitstellung, überwachte/schaltbare PDU-Cybersicherheitsfunktionen und modulare Designs für hochdichte KI- und HPC-Einsätze. Greg Ratcliff wird einen Vortrag darüber halten, wie OCP-Konzepte in funktionsfähige Referenzdesigns überführt werden.
Vertiv (NYSE: VRT) ستعرض تقنيات رفوف وتغذية وتبريد مطابقة لـ OCP في قمة OCP Global Summit 2025 العالمية، الجناح رقم C34، من 13 إلى 16 أكتوبر 2025. تشمل أبرز النقاط رف Vertiv SmartIT OCP الذي يدعم حتى 142 كيلواط، وحدات PDU PowerIT التي توصل حتى 57.6 كيلواط، ونظام busbar العلوي PowerBar Track، ومناسف CoolChip Fluid المتكاملة مع CDU CoolChip.
كما يتضمن الجناح اتصالات Harting وعروضًا لتكوينات مُسبقة للنشر بسرعة، وميزات أمان PDU مدارة/مفاتيح، وتصاميم معيارية موجهة لنشر AI وHPC عالي الكثافة. سيقدّم Greg Ratcliff عرضًا حول تحويل مفاهيم OCP إلى تصاميم مرجعية وظيفية.
Vertiv (NYSE: VRT) 将在 2025 OCP Global Summit 展示符合 OCP 规范的机架、动力和冷却技术，展位号 C34，2025 年 10 月 13–16 日。亮点包括支持高达 142 kW 负载的 Vertiv SmartIT OCP 机架、可提供高达 57.6 kW 的 PowerIT PDU、悬顶式 PowerBar Track 母线系统，以及与 CoolChip CDU 集成的 CoolChip 流体歧管。
展位还展示 Harting 连接性与更快部署的预组装配置演示、监控/切换的 PDU 网络安全功能，以及面向高密度 AI 与 HPC 部署的模块化设计。Greg Ratcliff 将就将 OCP 概念转化为功能性参考设计进行演讲。
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Insights
Vertiv unveils OCP-aligned power, cooling and rack systems aimed at speeding AI-capable data center deployments.
Vertiv presents an integrated ecosystem of OCP-compliant hardware including the SmartIT OCP rack (supports loads up to 142 kW), PowerIT PDUs (up to 57.6 kW), the overhead PowerBar Track busbar, and CoolChip fluid manifolds. These elements are packaged as prefabricated, validated combinations to simplify systems integration and accelerate on-site deployment; the portfolio also highlights partner connectivity with Harting for busway-to-rack power distribution. The announcement is timed to a public product showcase at the
The business mechanism is straightforward: offer modular, validated building blocks that reduce integration risk and installation time for high-density AI and HPC environments. Key dependencies and risks mentioned in the release are adherence to OCP design guidelines for interoperability and the need for field adoption of prefabricated configurations; the text does not disclose commercial orders, pricing, certification timelines, or customer commitments. Trackable, disclosed metrics to watch include the stated rack power capacity of 142 kW and PDU capacity of 57.6 kW, and the product demonstrations at the
Integrated, modular solutions to address power and density challenges for AI environments will be unveiled at the 2025 OCP Global Summit
Vertiv's featured technologies demonstrate a broad range of OCP-aligned designs and concepts across multiple product categories. The Vertiv™ SmartIT OCP rack solution is a configurable, high-capacity rack system developed to simplify integration for system builders and support a variety of server and equipment types. The concept supports loads up to 142 kW and offers prefabricated configurations that combine validated power and cooling options for faster deployment and improved reliability.
Vertiv™ PowerIT rack power distribution units (PDUs), high-capacity systems recently released in
Vertiv™ PowerBar Track is a scalable, overhead power distribution system engineered for high-density AI and HPC environments. Its modular, open-track busbar architecture optimizes space, simplifies installation, and provides continuous power delivery. The system supports business continuity through reliable, upgradable components designed for future expansion.
Vertiv™ CoolChip Fluid Network manifolds from Vertiv's liquid cooling portfolio will also be on display in the booth rack, illustrating flexible and efficient approaches to managing thermal loads in high-density environments. These manifolds integrate with the Vertiv™ CoolChip CDU family and reflect ongoing development of modular, adaptive cooling technologies for AI and next-generation compute architectures.
The booth will also feature Harting connectivity and cabling solutions, developed in collaboration with Vertiv, demonstrating how compact, high-performance connections can simplify integration and save space in high-density environments. These solutions efficiently distribute power from the OCP Busway through the Power Distribution Box (PDB) and into the rack, reducing installation complexity and maximizing usable rack space for IT equipment. Vertiv's collaboration with Harting underscores its commitment to advancing reliable connectivity and open standards that benefit the broader OCP community.
"Meeting OCP standards is more than a compliance exercise; it's about delivering infrastructure that performs at scale," said Ramesh Menon, vice president of the IT systems business unit at Vertiv. "By integrating rack, busway, cabling, and distribution into one ecosystem, Vertiv is offering customers a faster, more reliable path to deploy AI-ready capacity across their facilities."
Together, these technologies reinforce Vertiv's broad portfolio across power, thermal management, IT management, integrated infrastructure, and global services. Vertiv's presence at OCP Global Summit reflects its focus on open, efficient, and vendor-neutral systems that support the next generation of data center design.
As part of the summit agenda, Vertiv will also share its vision for future innovation. Greg Ratcliff, chief innovation officer at Vertiv, will present "From Concept to Capability: Innovating the Future of OCP Reference Designs." The session will provide a behind-the-scenes look at how Vertiv transforms early concepts into functional prototypes and how this approach accelerates the evolution of open infrastructure. Ratcliff will highlight the role of modular, scalable designs, AI-assisted planning tools, and collaboration with OCP stakeholders in creating data centers that are more adaptive, energy-efficient, and ready for emerging workloads such as AI.
For more information about Vertiv's OCP-compliant solutions and full portfolio of infrastructure offerings, visit Vertiv.com. To schedule a meeting with a Vertiv expert at the OCP Summit, visit Vertiv's scheduling page.
About Vertiv
Vertiv (NYSE: VRT) brings together hardware, software, analytics and ongoing services to enable its customers' vital applications to run continuously, perform optimally and grow with their business needs. Vertiv solves the most important challenges facing today's data centers, communication networks and commercial and industrial facilities with a portfolio of power, cooling and IT infrastructure solutions and services that extends from the cloud to the edge of the network. Headquartered in
Forward-looking statements
This release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995, Section 27 of the Securities Act, and Section 21E of the Securities Exchange Act. These statements are only a prediction. Actual events or results may differ materially from those in the forward-looking statements set forth herein. Readers are referred to Vertiv's filings with the Securities and Exchange Commission, including its most recent Annual Report on Form 10-K and any subsequent Quarterly Reports on Form 10-Q for a discussion of these and other important risk factors concerning Vertiv and its operations. Vertiv is under no obligation to, and expressly disclaims any obligation to, update or alter its forward-looking statements, whether as a result of new information, future events or otherwise.
CONTACT
Ruder Finn
vertiv@RuderFinn.com
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SOURCE Vertiv Holdings Co
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