Vishay Intertechnology Introduces Thin Film Chip Fuses With Fast and Very Fast Acting Performance
Rhea-AI Summary
Vishay Intertechnology (NYSE: VSH) introduced two thin film chip fuse series, S2F (fast acting) and S3F (very fast acting), available in 0402, 0603, and 1206 sizes for rated currents from 0.315 A to 7 A. Both series are UL 248-14 compliant, Pb-free, halogen-free, RoHS-compliant, and exhibit body temperature rise below 75 °C at 100% rated current. The S2F opens in <1 minute at 200% overload; the S3F opens in <5 seconds at 200% overload. Samples and production quantities are available with 16-week lead times. Typical use cases include secondary circuit protection across automotive, industrial, computing, telecom, aerospace, medical, and consumer electronics.
Positive
- Wide current range 0.315 A–7 A
- UL 248-14 compliant thin film fuses
- Low body temperature rise below 75 °C at 100% rated current
- Two speed options (S2F & S3F) for design flexibility
- Available now for samples and production quantities
Negative
- Lead time of 16 weeks may delay deployments
Key Figures
Market Reality Check
Peers on Argus
VSH fell 1.78% while close peers DIOD, SYNA, POWI, SIMO, and SMTC also showed modest declines (e.g., SYNA -2.63%, POWI -1.31%), suggesting broader semiconductor softness but no defined momentum cluster.
Historical Context
| Date | Event | Sentiment | Move | Catalyst |
|---|---|---|---|---|
| Dec 11 | Product award | Positive | +0.3% | Space-grade planar transformer series received a 2025 AspenCore EE Asia award. |
| Dec 10 | New component launch | Positive | +2.9% | Introduced AEC-Q200 qualified 0402 glass-protected NTC thermistor for automotive uses. |
| Dec 09 | Sensor award | Positive | +0.5% | Ambient light sensor won 2025 AspenCore World Electronics Achievement Award. |
| Dec 03 | Power module launch | Positive | +6.4% | Introduced 1200 V SiC MOSFET power modules in MAACPAK PressFit package. |
| Dec 02 | Factory certification | Positive | +2.2% | New Mexico factory achieved multiple quality and environmental certifications. |
Recent technical/product and certification news has generally coincided with modest positive price reactions for VSH.
Over the past few weeks, VSH has reported a series of product introductions and recognition events. New components (SiC MOSFET modules, NTC thermistor) and factory certifications on Dec 2–3, 2025 were followed by positive moves up to 6.41%. Award-related news on Dec 9 and Dec 11 also saw small gains. Today’s fuse product launch continues this pattern of incremental portfolio expansion and engineering-focused milestones.
Market Pulse Summary
This announcement adds new thin film chip fuses spanning 0.315 A to 7 A with UL 248-14 compliance and very fast protection options, extending VSH’s passive component portfolio. Recent weeks have featured multiple launches and awards, indicating an active product roadmap. Investors may watch how these parts translate into revenue alongside existing milestones and review upcoming filings and capital allocation decisions to gauge the broader impact on the company’s positioning.
Key Terms
RoHS-compliant regulatory
AI-generated analysis. Not financial advice.
S2F and S3F Series Thin Film Chip Fuses in 0402, 0603, and 1206 Sizes Provide Protection From 0.315 A to 7 A, With UL 248-14 Compliance and Low Resistance
MALVERN, Pa., Dec. 17, 2025 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today introduced two new series of thin film chip fuses. The Vishay Sfernice S2F and S3F devices are designed to ensure circuit continuity with minimal resistance and reliable interruption under overload conditions, while providing designers with options for fast or very fast acting protection.
Offered in 0402, 0603, and 1206 case sizes, the fuses are UL 248-14 compliant and cover rated currents from 0.315 A to 7 A. Both series combine low resistance with body temperature rise below 75 °C at 100 % rated current, ensuring high reliability in compact footprints. The devices are lead (Pb)-free, halogen-free, and RoHS-compliant.
The key distinction between the two series is their fusing speed at 200 % overload. The S2F series, which is fast acting, is designed to open in less than one minute, while the S3F series, which is very fast acting, is designed to open in less than five seconds. This difference enables designers to tailor fuse performance to the specific protection needs of their applications. The S2F series provides protection where brief overloads are tolerable without immediate interruption, while the S3F series is optimized for sensitive circuits that require the quickest possible response.
By offering a wide current rating range, precise fusing times, and three footprint options, the new products simplify design flexibility while supporting high reliability and competitive pricing. Typical applications include secondary circuit protection across a broad range of electronic systems where stability and precision are critical.
Samples and production quantities of the S2F and S3F series are available now, with lead times of 16 weeks.
Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is The DNA of tech.® Vishay Intertechnology, Inc. is a Fortune 1000 Company listed on the NYSE (VSH). More on Vishay at www.Vishay.com.
The DNA of tech® is a registered trademark of Vishay Intertechnology, Inc.
Vishay on Facebook: http://www.facebook.com/VishayIntertechnology
Vishay Twitter feed: http://twitter.com/vishayindust
Link to product photo:
https://www.flickr.com/photos/vishay/albums/72177720330833446
Links to datasheets:
http://www.vishay.com/ppg?50087 (S2F)
http://www.vishay.com/ppg?50088 (S3F)
For more information please contact:
Vishay Intertechnology
Peter Henrici, +1 408 567-8400
peter.henrici@vishay.com
or
Redpines
Bob Decker, +1 415 409-0233
bob.decker@redpinesgroup.com