[6-K] SEALSQ Corp Current Report (Foreign Issuer)

Rhea-AI Filing Summary

SEALSQ Corp announced a strategic partnership with Trusted Semiconductor Solutions (TSS) to co-develop “Made in US” secure semiconductor solutions featuring post-quantum cryptography for US defense and government agencies. The collaboration pairs TSS’s Category 1A Trusted accreditation and defense ecosystem relationships with SEALSQ’s post-quantum semiconductor technology, certifications, and personalization expertise.

The roadmap spans three phases: a short‑term PQC-enabled solution combining SEALSQ’s QS7001 secure element with TSS platforms; mid‑term co-development of US‑made PQC‑embedded ICs targeting FIPS 140-3, Common Criteria, and Agency certifications; and long‑term development of next‑generation secure architectures, including chiplet‑based hardware security modules integrated with advanced secure elements or enclaves using pre‑certified IP.

The report is incorporated by reference into the company’s Form F‑3 and Form S‑8 registration statements.

Insights

Semiconductor security analyst

Partnership targets US defense with PQC chips; certification is key.

SEALSQ and TSS align complementary strengths: TSS brings Category 1A Trusted status and defense relationships, while SEALSQ contributes post‑quantum cryptography (PQC) silicon, certifications, and personalization. The near‑term plan integrates SEALSQ’s QS7001 secure element with TSS platforms to establish a deployable baseline.

Mid‑term aims include US‑made PQC‑embedded ICs targeting FIPS 140-3, Common Criteria, and Agency certifications—regulatory milestones that often govern adoption in federal programs. Long‑term, chiplet‑based HSM architectures with secure elements or enclaves indicate a pathway to higher assurance products.

Commercial traction will depend on achieving the stated certifications and aligning with defense procurement needs. Subsequent filings may provide specifics on timelines, products, or any awarded programs.

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

WASHINGTON, DC 20549

FORM 6-K

Report of Foreign Private Issuer

Pursuant to Rule 13a-16 or 15d-16 under the

Securities Exchange Act of 1934

For the month of October 2025

Commission File Number: 001-41709

SEALSQ CORP

(Exact Name of Registrant as Specified in Charter)

N/A

(Translation of Registrant’s name into English)

British Virgin Islands	Avenue Louis-Casaï 58 1216 Cointrin, Switzerland	Not Applicable
(State or other jurisdiction of incorporation or organization)	(Address of principal executive office)	(I.R.S. Employer Identification No.)

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F:

☒ Form 20-F         ☐ Form 40-F

On October 9, 2025, SEALSQ Corp (the “Company” or “Seal”) announced a strategic partnership with Trusted Semiconductor Solutions (“TSS”), a Category 1A Trusted-accredited company, to co-develop “Made in US” post-quantum cryptography-enabled secure semiconductor solutions for US defense and government agencies. The partnership expects to leverage (i) TSS’s Category 1A Trusted accreditation and relationships within the defense ecosystem and ensure compliance with the Department of Defense and federal requirements and (ii) Seal’s post-quantum semiconductor technology, advanced hardware certifications and expertise in semiconductor personalization.

The partnership defines a three-phase roadmap:

Short-Term: PQC-enabled solution combining SEALSQ’s QS7001 secure element with TSS’s trusted semiconductor platforms.

Mid-Term: Co-development of “Made in US” PQC-embedded ICs targeting FIPS 140-3, Common Criteria, and Agency certifications.

Long-Term: Development of next-generation secure architectures, including Chiplet-based Hardware Security Modules (CHSMs) tightly coupled with advanced embedded secure elements or secure enclaves featuring pre-certified IP.

The information contained in this Report on Form 6-K is hereby incorporated by reference into the registration statement on Form F-3 of the Company (File No. 333-286098), as amended, and the registration statement on Form S-8 of the Company (File No. 333-287139), and into the base prospectus and any prospectus supplement outstanding under each of the foregoing registration statements, to the extent not superseded by documents or reports subsequently filed or furnished by the Company under the Securities Act of 1933, as amended, or the Securities Exchange Act of 1934.

SIGNATURES

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

Date: October 14, 2025	SEALSQ CORP
	By:	/s/ Carlos Moreira
		Name: Carlos Moreira
		Title:   Chief Executive Officer
	By:	/s/ John O’Hara
		Name: John O’Hara
		Title:   Chief Financial Officer

FAQ

What did SEALSQ (LAES) announce?

SEALSQ announced a strategic partnership with Trusted Semiconductor Solutions to co-develop “Made in US” post-quantum cryptography-enabled secure semiconductor solutions for US defense and government agencies.

Who is TSS and what is its role in the SEALSQ (LAES) partnership?

Trusted Semiconductor Solutions is a Category 1A Trusted-accredited company providing defense ecosystem relationships and compliance with Department of Defense and federal requirements.

What certifications are targeted by the SEALSQ–TSS collaboration?

The partnership targets FIPS 140-3, Common Criteria, and Agency certifications for PQC-embedded integrated circuits.

What products or components are referenced in the short-term phase?

The short-term phase combines SEALSQ’s QS7001 secure element with TSS’s trusted semiconductor platforms.

What long-term architectures are planned under the partnership?

The partners plan chiplet-based Hardware Security Modules coupled with advanced embedded secure elements or secure enclaves featuring pre-certified IP.

Is this 6-K incorporated into SEALSQ’s registration statements?

Yes. It is incorporated by reference into SEALSQ’s Form F-3 (File No. 333-286098) and Form S-8 (File No. 333-287139), including related base prospectuses and any supplements.