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NXP Semiconductors agrees $250M EIB loan

NXP Semiconductors’ subsidiary secured a $250 million EIB loan facility to support a planned expansion of its semiconductor back-end manufacturing operations in Malaysia.

(High)
(Neutral)
Form Type
8-K

Rhea-AI Filing Summary

NXP Semiconductors N.V. (NXPI) reports that its wholly owned subsidiary NXP B.V. entered into a $250.0 million unsecured senior loan Facility Agreement with the European Investment Bank on September 1, 2026. The company expects to use borrowings to fund the design and implementation of an expansion of its existing semiconductor assembly and test (back-end manufacturing) facility in Kuala Lumpur, Malaysia.

The loans may be U.S. Dollar or Euro-denominated, bear fixed or floating interest (in each case subject to a zero floor), and have a maximum tenor of six years. NXP Semiconductors N.V., NXP Funding LLC and NXP USA, Inc. fully and unconditionally guarantee NXP B.V.’s obligations under the Facility Agreement, as well as a potential second facility agreement, pursuant to a Guaranty dated September 2, 2026. Covenants and events of default are described as generally consistent with those in the company’s Amended and Restated Revolving Credit Agreement.

Positive

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Filing Explained

The September 2 Form 8-K reports that NXP B.V. entered the $250.0 million facility on September 1, creating a disclosed direct financial obligation, but reports the facility—not cash received—so its current state is financing capacity rather than a stated borrowing.

Item 1.01 Entry into a Material Definitive Agreement Business
The company signed a significant contract such as a merger agreement, credit facility, or major partnership.
Item 2.03 Creation of a Direct Financial Obligation or an Obligation under an Off-Balance Sheet Arrangement Financial
The company incurred a new significant debt or off-balance-sheet obligation.
Item 9.01 Financial Statements and Exhibits Exhibits
Financial statements, pro forma financial information, or exhibit attachments filed with this report.
Facility size $250.0 million unsecured senior loan facility Principal amount provided under the Facility Agreement with European Investment Bank
Maximum tenor 6 years Maximum loan tenor for borrowings under the Facility Agreement
Facility Agreement date September 1, 2026 Date NXP B.V. entered into the Facility Agreement with European Investment Bank
Guaranty date September 2, 2026 Date NXP Semiconductors N.V., NXP Funding LLC and NXP USA, Inc. entered into the Guaranty
Facility location Kuala Lumpur, Malaysia Location of the semiconductor assembly and test facility to be expanded
Facility Agreement financial
"entered into a facility agreement (the “Facility Agreement”) with European Investment Bank"
Guaranty financial
"pursuant to a guaranty agreement, entered into on September 2, 2026 (the “Guaranty”)"
A guaranty is a legal promise by one party (the guarantor) to pay or perform if another party fails to meet its debt or contractual obligation — like a co-signer who steps in when the borrower can’t pay. For investors, a guaranty lowers the chance that a bond, loan or contract will go unpaid, can improve credit assessments and borrowing terms, and gives a clearer sense of how secure expected returns are if the primary obligor runs into trouble.
unsecured senior loan facility financial
"which provides for a $250.0 million unsecured senior loan facility"
back-end manufacturing technical
"expansion of an existing semiconductor assembly and test facility (also called back-end manufacturing)"
Back-end manufacturing covers the steps that turn a produced pharmaceutical or medical product into a finished, market-ready item — for example final formulation, sterilization, filling into vials or syringes, quality testing, labeling and packaging. Investors watch it because this stage determines how quickly and reliably a product can reach patients, affects unit costs and margins, and is often a bottleneck for scaling supply or meeting regulatory inspections. Think of it as the packaging and inspection line that must be flawless before goods leave the factory.
European Investment Bank financial
"entered into a facility agreement with European Investment Bank (“EIB”)"
forward-looking statements regulatory
"This on includes forward-looking statements which include statements regarding"
Forward-looking statements are predictions or plans that companies share about what they expect to happen in the future, like estimating sales or profits. They matter because they help investors understand a company's outlook, but since they are based on guesses and assumptions, they can sometimes be wrong.

FAQ

What new financing did NXP Semiconductors N.V. (NXPI) announce in this 8-K?

NXP B.V., a subsidiary of NXP Semiconductors N.V., entered into a $250.0 million unsecured senior loan Facility Agreement with the European Investment Bank on September 1, 2026, providing a multi-year funding source for specific manufacturing expansion projects.

How will NXP Semiconductors (NXPI) use the $250 million EIB facility proceeds?

The company expects to use borrowings under the $250.0 million Facility Agreement to fund the design and implementation of an expansion of its existing semiconductor assembly and test (back-end manufacturing) facility located in Kuala Lumpur, Malaysia.

What are the key terms of the new loan facility for NXPI?

Borrowings may be in U.S. Dollars or Euros, at either fixed or floating interest rates subject to a zero floor, and loans under the Facility Agreement have a maximum tenor of six years, according to the company’s disclosure.

Who guarantees NXP Semiconductors’ new EIB loan facility?

Obligations of NXP B.V. under the Facility Agreement, and a potential second facility agreement, are fully and unconditionally guaranteed by NXP Semiconductors N.V., NXP Funding LLC and NXP USA, Inc. under a Guaranty dated September 2, 2026.

How do the covenants on NXP Semiconductors’ new facility compare to its revolving credit agreement?

The Facility Agreement includes affirmative and negative covenants and events of default that are described as generally consistent with those in NXP Semiconductors’ Amended and Restated Revolving Credit Agreement dated February 6, 2026.

Does the NXPI disclosure mention a possible second facility with the EIB?

Yes. NXP Semiconductors states that NXP B.V.’s obligations under the Facility Agreement, as well as a potential second facility agreement to be entered into in due course, will be fully and unconditionally guaranteed under the same Guaranty.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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Learn about SEC filing dates
0001413447false00014134472026-09-022026-09-02

UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
FORM 8-K
 
CURRENT REPORT
PURSUANT TO SECTION 13 OR 15(d)
OF THE SECURITIES EXCHANGE ACT OF 1934
Date of report (Date of earliest event reported): September 1, 2026
 
 
NXP Semiconductors N.V.
(Exact name of Registrant as specified in charter)
Netherlands
001-34841
98-1144352
(State or other jurisdiction
of incorporation)
(Commission
file number)
(IRS employer
identification number)
60 High Tech Campus
Eindhoven
Netherlands5656 AG
(Address of principal executive offices)
(Zip code)
+31
40
2729999
(Registrant’s telephone number, including area code)
 
NA
(Former name or former address, if changed since last report)
 

Check the appropriate box below if the Form 8-K filing is intended to simultaneously satisfy the filing obligation of the registrant under any of the following provisions:

Written communications pursuant to Rule 425 under the Securities Act (17 CFR 230.425)

Soliciting material pursuant to Rule 14a-12 under the Exchange Act (17 CFR 240.14a-12)

Pre-commencement communications pursuant to Rule 14d-2(b) under the Exchange Act (17 CFR 240.14d-2(b))

Pre-commencement communications pursuant to Rule 13e-4(c) under the Exchange Act (17 CFR 240.13e-4c))







Securities registered pursuant to Section 12(b) of the Act:
Title of each class
Trading symbol(s)
Number of each exchange on which registered
Common shares, EUR 0.20 par value
NXPI
The Nasdaq Global Select Market
Indicate by check mark whether the registrant is an emerging growth company as defined in Rule 405 of the Securities Act of 1933
(§230.405) or Rule 12b-2 of the Securities Exchange Act of 1934 (§240.12b-2).
                                            Emerging growth company         

If an emerging growth company, indicate by check mark if the registrant has elected not to use the extended transition period for complying with any new or revised financial accounting standards provided pursuant to Section 13(a) of the Exchange Act           






Item 1.01     Entry into a Material Definitive Agreement

Facility Agreement

On September 1, 2026, NXP B.V., a wholly owned, direct subsidiary of NXP Semiconductors N.V. (the “Company”), entered into a facility agreement (the “Facility Agreement”) with European Investment Bank (“EIB”), which provides for a $250.0 million unsecured senior loan facility. The proceeds from borrowings under the Facility Agreement are expected to be used, to fund the design and implementation of an expansion of an existing semiconductor assembly and test facility (also called back-end manufacturing) located in Kuala Lumpur, Malaysia. NXP B.V.’s obligations under the Facility Agreement, as well as a potential second facility agreement to be entered into in due course, will be fully and unconditionally guaranteed by the Company, as well as NXP Funding LLC (“NXP Funding”) and NXP USA, Inc. (“NXP USA”), each of which is a wholly owned, indirect subsidiary of the Company, pursuant to a guaranty agreement, entered into on September 2, 2026 (the “Guaranty”).

Borrowings under the Facility Agreement may be U.S. Dollar or Euro-denominated and bear a fixed or floating interest rate. Fixed rate loans will bear interest at a rate (subject to a floor of zero) to be agreed between NXP B.V. and EIB and shall include a margin determined based on the Company’s credit rating (the “Margin”). Floating rate loans will bear interest at a rate (subject to a floor of zero) equal to the sum of the applicable benchmark rate (EURIBOR or USD reference rate, as applicable) and an applicable fixed spread determined by EIB and agreed by NXP B.V. (which includes the Margin). Loans under the Facility Agreement will have a maximum tenor of six years.

The Facility Agreement contains affirmative and negative covenants and events of default that are generally consistent with those set forth in the Company’s Amended and Restated Revolving Credit Agreement, dated as of February 6, 2026.

The description of the Facility Agreement and the Guaranty contained in this Item 1.01 is qualified in its entirety by reference to the complete text of each of the Facility Agreement and the Guaranty, copies of which are filed herewith as Exhibits 10.1 and 10.2, respectively, to this Current Report on Form 8-K.

Item 2.03    Creation of a Direct Financial Obligation or an Obligation under an off-Balance Sheet Arrangement of a Registrant

The information related to the Facility Agreement and the Guaranty set forth under Item 1.01 of this Current Report on Form 8-K is incorporated by reference into this Item 2.03.

Forward-Looking Statements

This Current Report on Form 8-K includes forward-looking statements which include statements regarding the Company’s intended use of proceeds for borrowings under the Facility Agreement, a potential second facility agreement, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, the Company does not have any intention or obligation to publicly update or revise any forward-looking statements after filing this Current Report on Form 8-K, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors and other cautionary statements included in the Company’s Securities and Exchange Commission (“SEC”) filings. Copies of the Company’s SEC filings are available on its Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.




Item 9.01
Financial Statements and Exhibits.
(d) Exhibits
10.1*+
$250.0 million Facility A Agreement, dated as of September 1, 2026, between NXP B.V. and European Investment Bank.
10.2
Guaranty, dated as of September 2, 2026, among NXP Semiconductors N.V., NXP Funding LLC and NXP USA, Inc., as guarantors, and European Investment Bank.
104
Cover Page Interactive Data File (formatted as Inline XBRL).

* Certain schedules and exhibits have been omitted pursuant to Item 601(a)(5) of Regulation S-K. The Company agrees to furnish a copy of such schedules and exhibits, or any sections thereof, to the SEC upon request.

+ Certain identified information has been omitted from this exhibit because it is both not material and is the type that the registrant treats as private or confidential, in compliance with Item 601(b)(10) of Regulation S-K.



SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned hereunto duly authorized.

NXP Semiconductors N.V.
By: /s/ Timothy Shelhamer
Name: Timothy Shelhamer
Title: SVP and Chief Corporate Counsel
Date: September 2, 2026


Filing Exhibits & Attachments

5 documents