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Synaptics details onsemi deal, 53% margin target

Synaptics details its planned merger with onsemi and shares onsemi’s strategy for AI, automotive and industrial growth, including ambitious 2030 margin and free cash flow targets.

(High)
(Neutral)
Form Type
425

Rhea-AI Filing Summary

Synaptics Incorporated (SYNA) distributed a shareholder communication describing its proposed business combination with ON Semiconductor Corporation (onsemi) and outlining onsemi’s long-term strategy, financial track record and targets. The combination is positioned as adding Synaptics’ connected-compute capabilities to onsemi’s power, sensing and control portfolio to complete four “Physical AI” pillars.

onsemi highlights a focus on AI data centers, automotive and industrial markets, a $213 billion total addressable market and $8.7 billion of investments from 2021–2026 that it says expand TAM by $81 billion. Non‑GAAP gross margin improved from the mid‑30% range historically to 38.4% in 2025, with a target of 53% by 2030 and operating margin of 38%. Free cash flow was $1.42 billion in 2025 (23.7% margin), and onsemi targets 30–35% free cash flow margin and 12–14% revenue CAGR through 2030, supported by higher‑value AI data center, automotive and industrial content and a “Fab Right” manufacturing footprint.

The document includes extensive forward‑looking statements and risk disclosures regarding closing conditions, regulatory and shareholder approvals, integration challenges, market adoption, and other factors that could cause actual results for Synaptics, onsemi or the combined company to differ from these expectations.

Positive

  • Non-GAAP gross margin improved to 38.4% in 2025, with onsemi targeting 53% by 2030, indicating a structurally higher-margin model driven by mix, Fab Right and differentiated products.
  • onsemi reports strong free cash flow, reaching $1.42 billion and a 23.7% margin in 2025, with a target of 30–35% FCF margin and free cash flow more than doubling to about $3.5 billion by 2030.
  • The company invested $8.7 billion from 2021–2026 (R&D, M&A and capacity) and ties this to an $81 billion expansion of its addressable market, especially in AI data center and automotive.
  • AI data center revenue is projected to grow from over $500 million in 2026 to more than $2.5 billion in 2030, implying roughly 5× growth supported by higher rack power content and high‑voltage solutions.
  • Capital return plans are sizable, with $4.2 billion of share repurchases in 2023–2026E (about 92% of free cash flow) reducing shares outstanding by 12%, and an intent to return 100% of free cash flow via buybacks going forward.

Negative

  • None.

Filing Explained

This Form 425 is an informational business-combination communication, not an offer; the transaction remains proposed, and the proxy statement/prospectus materials are not yet final and will be amended. It therefore does not establish closing or the consideration and ownership mechanics for Synaptics holders.

2025 Non-GAAP Gross Margin 38.4% Fiscal year 2025 non-GAAP gross margin for onsemi
2030 Target Gross Margin 53% Non-GAAP gross margin target for 2030
2025 Free Cash Flow $1.42 billion Free cash flow in fiscal 2025 with a 23.7% margin
Total Investments 2021–2026 $8.7 billion R&D, M&A and capacity expansion over 2021–2026
TAM Expansion from Investments $81 billion Increase in addressable market linked to 2021–2026 investments
AI Data Center Revenue Growth >$0.5 billion to >$2.5 billion Projected AI data center revenue from 2026 to 2030
Share Repurchases 2023–2026E $4.2 billion Planned repurchases equal to ~92% of free cash flow, cutting shares by 12%
Total Addressable Market $213 billion Power, compute, sense, connectivity and other markets combined
Embedded Power Platform technical
"Embedded Power Platform (EPP) uses the silicon wafer itself as the package"
Physical AI technical
"…completing the Four Pillars of Physical AI Machines that sense, decide, act and adapt"
Physical AI combines artificial intelligence with physical devices or environments, enabling machines to interact with and adapt to the real world in a human-like way. It matters to investors because it can lead to smarter robots, autonomous vehicles, or advanced sensors that improve efficiency and open new markets, potentially creating significant business opportunities and competitive advantages.
Software Defined Vehicle technical
"New Growth Driver: Software Defined Vehicle/Zonal Expand Content and Intelligence at the Nodes"
A software defined vehicle is a car or truck whose features, performance and user experience are controlled largely by software rather than fixed hardware, so upgrades and new capabilities can be delivered by downloads much like a smartphone receives apps and updates. For investors, this changes how value is created and captured — shifting revenue toward recurring software services, enabling faster product improvements, and concentrating risk around software reliability, cybersecurity and regulatory approval.
free cash flow margin financial
"Free Cash Flow Margin 19.8% 19.6% 4.9% 17.1% 23.7%"
Free cash flow margin is a measure of how much cash a company generates relative to its sales, showing the percentage of revenue that remains after covering operating expenses and investments in growth. It indicates how efficiently a company turns its sales into available cash that can be used for things like paying dividends, reducing debt, or expanding the business. A higher margin suggests better financial health and more flexibility to invest or return value to shareholders.
Fab Right technical
"Fab Right: Building a More Efficient, Scalable Manufacturing Network"
non-GAAP gross margin financial
"Non-GAAP Gross Margin 40.4% 49.2% 47.1% 45.5% 38.4%"
Non-GAAP gross margin is a measure of a company's profitability that shows how much money it makes from sales after subtracting the direct costs of producing its products or services, but without applying certain accounting adjustments required by standard rules. It helps investors understand the company's core earning ability by excluding items like one-time expenses or accounting changes. This metric provides a clearer picture of ongoing business performance beyond official financial reports.

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

What transaction involving Synaptics (SYNA) is described in this communication?

The document describes a proposed business combination between Synaptics and onsemi. It explains that the deal is being registered on Form S‑4, will be submitted to Synaptics stockholders for approval, and remains subject to regulatory, shareholder and other customary closing conditions.

How does onsemi say acquiring Synaptics will change its portfolio?

onsemi states that Synaptics extends its Connected Compute offerings, adding edge intelligence, AI‑first compute and connectivity and increasing total addressable market by about $30 billion. This is positioned as completing four pillars of “Physical AI”: power, sense, control and connected compute.

What long-term financial targets does onsemi outline through 2030?

onsemi targets 12–14% revenue CAGR from 2026E to 2030, 53% non‑GAAP gross margin, 38% non‑GAAP operating margin, and 30–35% free cash flow margin, with a non‑GAAP tax rate of 15%. It expects gross profit to grow 1.6× faster than revenue and operating income more than 2×.

How have onsemi’s margins and free cash flow trended recently?

For 2025, onsemi reports non‑GAAP gross margin of 38.4%, non‑GAAP operating margin of 18.6% and free cash flow of $1.42 billion, a 23.7% margin. Management contrasts this with lower average margins in 2015–2020, presenting it as a structural step‑change after its transformation.

What investment program does onsemi describe for 2021–2026?

onsemi cites total investments of $8.7 billion, including $3.6 billion of R&D, about $0.8 billion of M&A for capabilities like SiC, GaN and SWIR, and $4.3 billion of capacity expansion in areas such as East Fishkill and SiC/vGaN. It associates these with an $81 billion TAM increase.

What are onsemi’s plans for share repurchases and capital allocation?

The company reports $4.2 billion of buybacks planned for 2023–2026E, equal to about 92% of free cash flow and a 12% share count reduction, and notes $5.3 billion remaining under authorization. It states an intent to return 100% of free cash flow via repurchases while funding R&D and selective M&A.

What key risks to the Synaptics–onsemi transaction are highlighted?

The communication cites risks that regulatory approvals or Synaptics stockholder approval may not be obtained, potential litigation, transaction‑related disruption, integration challenges, retention of key personnel, competitive responses, unexpected costs, and uncertainty about the long‑term value of onsemi’s stock.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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Filed pursuant to Rule 425 under the
Securities Act of 1933, as amended, and
deemed filed under Rule 14a-12 under the
Securities Exchange Act of 1934, as amended

Filer: ON Semiconductor Corporation
Commission File No.: 000-49602
Registration Statement File No.: 333-298477

Subject Company: Synaptics Incorporated


 Powering a Smarter World  September 16, 2026 
 

 Cautionary Note Regarding Forward-Looking Statements  This communication relates to a proposed business combination transaction between Synaptics Incorporated (“Synaptics”) and ON Semiconductor Corporation (“onsemi”). This communication includes forward-looking statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. All statements, other than statements of historical facts, included or incorporated in this communication could be deemed forward-looking statements, particularly statements about future financial performance and forward-looking financial guidance. These forward-looking statements are based on Synaptics’ and onsemi’s current expectations, estimates and projections about the expected date of closing of the proposed transaction and the potential benefits thereof, their respective businesses and industries, management’s beliefs and certain assumptions made by Synaptics and onsemi, all of which are subject to change. Some of these forward-looking statements can be identified by the use of forward-looking words such as “believes,” “expects,” “may,” “will,” “should,” “seeks,” “approximately,” “intends,” “plans,” “estimates,” “projects,” “strategy,” “anticipates,” or “Target,” or the negative of those words; other comparable terminology that convey uncertainty of future events or outcomes; or by discussions of strategy, plans, projections or intentions.  These forward-looking statements involve known and unknown risks and uncertainties, which may cause Synaptics’ or onsemi’s actual results and performance to be materially different from those expressed or implied in the forward-looking statements. Factors and risks that may impact future results and performance include, but are not limited to, the following factors: (1) the risk that the conditions to the closing of the transaction are not satisfied, including the risk that required approvals from regulators or the stockholders of Synaptics for the transaction are not obtained; (2) litigation relating to the transaction; (3) uncertainties as to the timing of the consummation of the transaction and the ability of each party to consummate the transaction; (4) risks that the proposed transaction disrupts the current plans and operations of Synaptics or onsemi, including restrictions during the pendency of the transaction that may impact the ability to pursue certain business opportunities or strategic transactions; (5) the ability of Synaptics and onsemi to retain and hire key personnel; (6) competitive responses to the proposed transaction; (7) unexpected costs, charges or expenses resulting from the transaction; (8) potential adverse reactions or changes to business relationships resulting from the announcement or completion of the transaction; (9) the combined companies’ ability to achieve the growth prospects and synergies expected from the transaction, as well as delays, challenges and expenses associated with integrating the combined companies’ existing businesses; (10) uncertainty as to the long-term value of onsemi’s common stock; (11) legislative, regulatory and economic developments; and (12) unpredictability and severity of catastrophic events, including, but not limited to, acts of terrorism or outbreak of war or hostilities, as well as Synaptics’ and onsemi’s response to any of the aforementioned factors. These risks, as well as other risks associated with the proposed transaction, are more fully discussed in the proxy statement/prospectus that is included in the Registration Statement on Form S-4 that has been filed with the Securities and Exchange Commission (“SEC”) in connection with the proposed transaction. While the list of factors presented here is considered representative, no such list should be considered to be a complete statement of all potential risks and uncertainties. Unlisted factors may present significant additional obstacles to the realization of forward-looking statements.  In addition, actual results are subject to other risks and uncertainties that relate more broadly to Synaptics’ overall business, including those more fully described in Synaptics’ filings with the SEC including its annual report on Form 10-K for the fiscal year ended June 27, 2026, and its quarterly reports filed on Form 10-Q for the current fiscal year, and onsemi’s overall business and financial condition, including those more fully described in onsemi’s filings with the SEC including its annual report on Form 10-K for the fiscal year ended December 31, 2025, and its quarterly reports filed on Form 10-Q for its current fiscal year.   Investing in onsemi’s or Synaptics’ securities involves a high degree of risk and uncertainty, and readers should carefully consider the trends, risks, and uncertainties described in this communication and other SEC filings of onsemi and Synaptics (including those referenced above) before making any investment decision. If any of these trends, risks, or uncertainties actually occurs or continues, the business, financial condition, or operating results of either or both companies could be materially adversely affected, the trading prices of each company’s securities could decline, and investors could lose all or part of their investment. Forward-looking statements are not guarantees of performance, and speak only as of the date made, and neither onsemi, nor Synaptics nor the management of either entity undertakes any obligation to update or revise any forward-looking statements, except as may be required by law. All forward-looking statements attributable to onsemi, Synaptics, or persons acting on behalf of either company are expressly qualified in their entirety by this cautionary statement.  This is not an offer or solicitation.  For additional information, please reference slides 137 – 138. 
 

 Use of Non-GAAP Financial Measures  This presentation contains historical non-GAAP financial measures including, among others, free cash flow (FCF) and FCF margin, non-GAAP gross margin and non-GAAP operating margin. This presentation also contains forward looking non-GAAP financial measures, some of which are adjusted for certain special items. These special items are out of our control and could change significantly from period to period. As a result, we are not able to reasonably estimate and separately present the individual impact of these special items, and we are similarly unable to provide a reconciliation of the non-GAAP measures. The reconciliation that is unavailable would include a forward-looking income statement, balance sheet, and statement of cash flows prepared in accordance with GAAP. We believe these non-GAAP measures provide important supplemental information to investors. We use these measures, together with GAAP measures, for internal managerial purposes and as a means to evaluate period-to-period comparisons. However, we do not, and you should not, rely on non-GAAP financial measures alone as measures of our performance. In addition, because non-GAAP financial measures are not standardized, it may not be possible to compare these financial measures with other companies’ non-GAAP financial measures, even if they have similar names.  For a reconciliation of historical non-GAAP financial measures to GAAP, please see the Appendix on slide 127. 
 

 Powering a Smarter World  TOPIC​​  PRESENTER​​  Charting a Path to Power the Next Decade of Innovation  Hassane El-KhouryPresident & CEO​​  Powering the AI Revolution  Achyut Shah  Group President, Power Solutions Group  Expanding the Core: Automotive and Industrial   Sudhir Gopalswamy​​  Group President, Analog & Mixed-Signal and Intelligent Sensing Groups  Turning Technology Leadership into Durable Financial Performance  Thad Trent​​  Executive Vice President & CFO  Q&A​​  All​​ 
 

 Powering a Smarter World  September 16, 2026 
 

 

 Charting a Path to Powerthe Next Decade of Innovation  Hassane El-KhouryPresident and CEO 
 

 Every foundational technology eventually encounters a physical limit  We’ve reached it.  © onsemi 2026 | Public Information 
 

 A Foundational Technology Is Not an Invention…  Three Signatures  of a Foundational Technology  1  WIDESPREAD IMPACT  CONTINUOUS IMPROVEMENT  FOUNDATIONAL DEPENDENCY  2  3  A force multiplier…  …for human progress.  IT'S A LAYER  EXPANDS POSSIBILITY  ELEVATES QUALITY OF LIFE  ENABLES SUSTAINABILITY  UNLOCKS THE NEXT FRONTIER  It’s not the product  It’s the foundation  FOUNDATIONAL TECHNOLOGY LAYER  Automotive  Industrial  AI  Consumer  Foundational Technology Layer: Disruptor across all markets  © onsemi 2026 | Public Information 
 

 The Future is Arriving Faster Than Ever  SLOWER  THEN  FASTER  NOW  STEAM ENGINE  ~60  YEARS  ~90  YEARS  ~37  YEARS  ~26  YEARS  ~13  YEARS  ~9  YEARS  ELECTRICITY  AUTOMOBILE  COMPUTING  INTERNET  AI  TIME FROM IDEA TO BINDING CONSTRAINT  Every Foundational Technology Was Gated By A Physical Constraint  Precision metalworking  Grid & factory reorganization  Petroleum refining, fuel distribution & road network  Switching element – the transistor  Bandwidth & local access infrastructure  COMPUTE, MEMORY & POWER  © onsemi 2026 | Public Information 
 

 Every Foundational Technology Was Gated By A Physical Constraint  Precision metalworking  Grid & factory reorganization  Petroleum refining, fuel distribution & road network  Switching element – the transistor  Bandwidth & local access infrastructure  COMPUTE, MEMORY & POWER  STEAM ENGINE  ELECTRICITY  AUTOMOBILE  COMPUTING  INTERNET  AI  ~60  YEARS  ~90  YEARS  ~37  YEARS  ~26  YEARS  ~13  YEARS  ~9  YEARS  © onsemi 2026 | Public Information  The Future is Arriving Faster Than Ever 
 

 Physical Constraint Ladder  Each constraint sits deeper in the system. Each is harder to move.  Until power density breaks through, the AI revolution is limited  COMPUTE   THE CONSTRAINT ON BREADTH  Compute determines how broadly a foundational technology can be deployed  ADVANCEDNODES  FAB CAPACITYEXPANDING  MODELSEXPANSION  AI ADOPTION  IMPROVEMENT  ADDRESSED   Technology & Capacity  MORE PHYSICAL  MEMORY   THE CONSTRAINT ON POTENTIAL  Memory determines how much of the model can be utilized efficiently  HBMBANDWIDTH  CAPACITY  GROWTH  ACCESSIMPROVEMENT  CLOSER TO   COMPUTE  ADDRESSED   Technology & Capacity  PHYSICAL  CONSTRAINT  REMAINS  POWER   THE CONSTRAINT ON EXISTENCE  Power determines if the foundational technology can scale at all  POWER  DELIVERY  ENERGY  EFFICIENCY  INFRASTRUCTURE  READINESS  POWER  DENSITY  © onsemi 2026 | Public Information 
 

 More Power Isn’t Enough.   The World Needs Better Power.  YESTERDAY:   POWER SUPPORTED WORK  Factories  Predictable operations  Appliances  Intermittent usage  Buildings  Managed consumption  Conventional  Vehicles  Mechanical systems  Power was relatively predictable and tolerant of inefficiency  TOMORROW:   POWER ENABLES INTELLIGENCE  Power is always on, always connected, always at peak, and critical to performance  Autonomous Vehicles  AI Data Centers  Smart Factories  Smart Infrastructure  Robotics & Humanoids  Edge AI Systems  INTELLIGENCE  THE CHALLENGE HAS CHANGED  POWER MUST BE  MoreEfficient  MoreDense  MoreReliable  MorePrecise  MoreAutonomous  MoreScalable  © onsemi 2026 | Public Information 
 

 WE SOLVED POWER  NOW WE SOLVE POWER DENSITY  © onsemi 2026 | Public Information  POWER OF TODAY  WE SOLVED THE POWER OF YESTERDAY  ELECTRICAL (COMPONENTS)   MULTI-PHYSICS SYSTEMS  More watts  Bigger  Centralized  More watts  Smaller  Distributed  Electrical  Convert, control and distribute power efficiently  Thermal  Move heat before it limits performance  Mechanical  Withstand stress and enable reliability  Physical  Design within the limits of physics  MORE POWER. LESS SPACE. HIGHER EFFICIENCY. UNMATCHED RELIABILITY. 
 

 AI Data Center  And the problems only get harder across end markets and applications  800V and higher  6V or less  Industrial: Solid-State Transformer  13.8kV  34.5kV  Automotive: xEV  400V  900V+  © onsemi 2026 | Public Information  no  overlap  Thermal  Mechanical  Electrical  Physical  What the customer asks for  Input voltage  Output voltage  Power  Physical space  Cost  Electrical + Thermal + Mechanical + Physical  Nothing on the market closes all at once  Always challenged  Constrained  Increasing  Decreasing  Increasing  System Requirements are   Moving in Opposite Directions 
 

 Power density is not   solved by one device  It requires a   different company  SOLVING POWER DENSITY  TO  Electrical • Thermal • Mechanical • Physical  onsemi is a fundamentally different company  for a fundamentally different problem: Power Density  SOLVING POWER  FROM  Efficiency • Conversion • Components • Scale  © onsemi 2026 | Public Information  The Constraint has Changed.  So did we. 
 

 2021  GTAT  Acquisition  SWIR  VISION  Acquisition  SiC JFETAcquisition  SiC  VCOREAcquisition  Treo Platform  Technology Development  Treo  LATERALGaNTechnology Development  GaN  VERTICALGaNTechnology Development  GaN  RISC-VAcquisition  300mm East Fishkill  NY FabAcquisition  EFK  SiC   MOSFET Technology Development  Embedded Power Platform  Technology Development  EPP  And Beyond  Silver Atena  Power Systems Acquisition  SiA  SynapticsAcquisition  SYNA  2022  2023  2024  2025  2026  Advanced Material Deposition  Technology Development  STRATEGIC ACTIONS  © onsemi 2026 | Public Information  STRONG TECHNOLOGY BASE 
 

 2021  GTAT  Acquisition  SWIR  VISION  Acquisition  SiC JFETAcquisition  SiC  VCOREAcquisition  Treo Platform  Technology Development  Treo  LATERALGaNTechnology Development  GaN  VERTICALGaNTechnology Development  GaN  RISC-VAcquisition  300mm East Fishkill  NY FabAcquisition  EFK  SiC   MOSFET Technology Development  Embedded Power Platform  Technology Development  EPP  And Beyond  Silver Atena  Power Systems Acquisition  SiA  SynapticsAcquisition  SYNA  2022  2023  2024  2025  2026  Advanced Material Deposition  Technology Development  STRONG TECHNOLOGY BASE  © onsemi 2026 | Public Information  STRATEGIC ACTIONS 
 

 POWER  Efficient power conversion  Silicon to wide-bandgap  Power management  Power protection  SENSE  Perception of the physical world  Image sensors  Ultrasonic & Inductive position sensors  HMI & Tactile sensing  CONTROL  Precise actuation & control  Analog & mixed-signal ICs  Drivers  Controllers  © onsemi 2026 | Public Information  + Synaptics  CONNECTED COMPUTE  Edge intelligence & connectivity  Single pair ethernet  AI-First Compute  Connectivity: Wi-Fi / BLE / Thread  + Synaptics  onsemi Portfolio…  Synaptics Extends the  
 

 CONNECTED COMPUTE  Edge intelligence & connectivity  Single pair ethernet  AI-First Compute  Connectivity: Wi-Fi / BLE / Thread  + Synaptics  …completing the Four Pillars of Physical AI  Machines that sense, decide, act and adapt  © onsemi 2026 | Public Information  Synaptics Extends the   POWER  Efficient power conversion  Silicon to wide-bandgap  Power management  Power protection  SENSE  Perception of the physical world  Image sensors  Ultrasonic & Inductive position sensors  HMI & Tactile sensing  CONTROL  Precise actuation & control  Analog & mixed-signal ICs  Drivers  Controllers  + Synaptics  onsemi Portfolio… 
 

 CONNECTED COMPUTE  Edge intelligence & connectivity  Single pair ethernet  AI-First Compute  Connectivity: Wi-Fi / BLE / Thread  + Synaptics  …completing the Four Pillars of Physical AI  Machines that sense, decide, act and adapt  © onsemi 2026 | Public Information  Synaptics Extends the onsemi Portfolio…  POWER  Efficient power conversion  Silicon to wide-bandgap  Power management  Power protection  SENSE  Perception of the physical world  Image sensors  Ultrasonic & Inductive position sensors  HMI & Tactile sensing  CONTROL  Precise actuation & control  Analog & mixed-signal ICs  Drivers  Controllers  + Synaptics 
 

 Auto Other  $18 B  AD&S  $14 B  Medical  $4 B  Autonomous Mobile Robots  $3 B  Drones  $2 B  Humanoids  $1 B  EV Charging  <$1 B  Industrial Other  $20 B  HV Energy Storage Systems  $4 B  HV Solid State Transformer  $3 B  HV Solid State Circuit Breaker  $1 B  HV Uninterruptible Power Supply  $1 B  Vcore  $24 B  HV Intermediate Bus Converter  $11 B  HV Power Distribution Unit  $3 B  HV Battery/Capacitor Backup  $1 B  Other applications  $12 B  MARKET  APPLICATION  TECHNOLOGY  Auto  $93B  Power Distribution  $25 B  Traction  $24 B  ADAS  $19 B  Lighting  $4 B  Battery Disconnect  $2 B  Industrial  $69B  Factory Automation  $14 B  AI Halo - $9B of industrial built to support data centers  AI DC  $47B  Emerging  $3B  Space  $3 B  Power  $118B  Compute  $34B  Sense  $30B  Connectivity  $7B  Other  $23B  © onsemi 2026 | Public Information  Every Market Converges on Power 
 

 Auto Other  $18 B  AD&S  $14 B  Medical  $4 B  Autonomous Mobile Robots  $3 B  Drones  $2 B  Humanoids  $1 B  EV Charging  <$1 B  Industrial Other  $20 B  HV Energy Storage Systems  $4 B  HV Solid State Transformer  $3 B  HV Solid State Circuit Breaker  $1 B  HV Uninterruptible Power Supply  $1 B  Vcore  $24 B  HV Intermediate Bus Converter  $11 B  HV Power Distribution Unit  $3 B  HV Battery/Capacitor Backup  $1 B  Other applications  $12 B  MARKET  APPLICATION  TECHNOLOGY  Auto  $93B  Power Distribution  $25 B  Traction  $24 B  ADAS  $19 B  Lighting  $4 B  Battery Disconnect  $2 B  Industrial  $69B  Factory Automation  $14 B  AI Halo - $9B of industrial built to support data centers  AI DC  $47B  Emerging  $3B  Space  $3 B  Power  $118B  Compute  $34B  Sense  $30B  Connectivity  $7B  Other  $23B  © onsemi 2026 | Public Information  Every Market Converges on Power  $213B  TAM  Technology 
 

 Delivering The Value Stack  Technology  SiC  vGaN  LGaN  Si  Advanced Deposition  BCD65  EPP  © onsemi 2026 | Public Information  Products 
 

 Delivering The Value Stack  Products  Technology  SiC  vGaN  LGaN  10BASE-T1S  PWR Drivers  ULS  Small Signal  Si  Advanced Deposition  Circuit Protection  BCD65  EPP  Inductive Position  LV <200V  MV < 650V  650V<HV<5000+V  Si MOSFET  LGaN  LGaN  Si IGBT  SiC MOSFET, JFET, vGaN  TVS diode  LP BT  © onsemi 2026 | Public Information  Solutions 
 

 Delivering The Value Stack  Products  Technology  Solutions  SiC  vGaN  LGaN  10BASE-T1S  PWR Drivers  ULS  Small Signal  ESS Hybrid  Intelligent Power Modules  xPU SPS  Solid State  Transformer  Solid State Circuit Breaker  Si  Advanced Deposition  Circuit Protection  BCD65  EPP  Inductive Position  Solid State Battery Disconnect  xPU multi-phase controller  LV <200V  MV < 650V  650V<HV<5000+V  Si MOSFET  LGaN  LGaN  Si IGBT  SiC MOSFET, JFET, vGaN  TVS diode  LP BT  © onsemi 2026 | Public Information  Systems 
 

 ASP  Scale  Delivering The Value Stack  Products  Technology  Solutions  Systems  COMBINED, THESE CAPABILITIES CREATE A SUSTAINABLE COMPETITIVE ADVANTAGE  SiC  vGaN  LGaN  10BASE-T1S  PWR Drivers  ULS  Small Signal  ESS Hybrid  Intelligent Power Modules  xPU SPS  Solid State  Transformer  PowerBox  Solid State Circuit Breaker  800V  <6V  HV DC  Si  Advanced Deposition  Circuit Protection  BCD65  EPP  Inductive Position  Solid State Battery Disconnect  xPU multi-phase controller  OBC  800V Safe Rail  800V  12V  Battery Replacement  LV <200V  MV < 650V  650V<HV<5000+V  Si MOSFET  LGaN  LGaN  Si IGBT  SiC MOSFET, JFET, vGaN  TVS diode  LP BT  © onsemi 2026 | Public Information 
 

 no  overlap  Thermal  Mechanical  Electrical  Physical  © onsemi 2026 | Public Information  We Must Change the Power Systems Paradigm… 
 

 no  overlap  Thermal  Mechanical  Electrical  Physical  Supported by a complete portfolio of differentiated Power and Sensing technologies  EPP  THE INTEGRATION  HV  THE DEVICE  Treo  THE INTELLIGENCE  © onsemi 2026 | Public Information  …by Introducing Technologies to Address the Constraints… 
 

 Mechanical  Thermal  Electrical  Physical  © onsemi 2026 | Public Information  …And Creating the Disruption Necessary to Unlock the Power Density Problem  Supported by a complete portfolio of differentiated Power and Sensing technologies  EPP  THE INTEGRATION  HV  THE DEVICE  Treo  THE INTELLIGENCE  EPP  Treo  HV 
 

 Unconstrained  HV power   conversion  Efficiency  Density  IGBT  SiC  MOSFET · JFET  GaN  LGaN · vGaN   Cost ▼ IGBT → Hybrid → SiC → Hybrid → vGaN  onsemi's HV device portfolio has every option needed to optimize the customer solution  vGaN solution…And it's ready  66,000 sq ft   14-acre site  20,000 sq ft   clean room  $40M+  tools & machines  $120M+  investment  Treo  HV  Power and Sense Portfolio  Syracuse, NY - onsemi vGaN R&D and manufacturing fab, in production today  vGaN  © onsemi 2026 | Public Information  EPP  onsemi has Every HV Option to Close the Gap 
 

 The onsemi Treo Platform   is the most advanced in the industry, enabling winning analog and mixed-signal products, for next generation applications  BCD 65nm   Technology Process  Best performance & power  Advanced feature integration  Industry’s Widest Voltage Range: 1 - 90V  Highest integration  Auto 48V transition  Modular Architecture  Broad onsemi portfolio  Fast time-to-market  Treo  HV  EPP  Power and Sense Portfolio  Treo Platform  Application-Specific Interfaces  Communications Subsystem  Power Control  Power Subsystem  DC-DC  Driver  Power FET  Power Subsystem  High-PerformanceAFE  Low-Power AFE  Compute & System Resources Subsystem  Compute  Voltage/Clock  Standard I/O  Memory  Test  Peripherals  © onsemi 2026 | Public Information 
 

 Automotive  Industrial  AI / Client  Compute  Mass Market  Medical  2024  Products Sampling  Low-Power AFE ASIC  Medical  Ultrasonic Sensor ASIC  Automotive  Test Equipment Signal Processor ASIC  Industrial  10BASE-T1S MAC-PHY  Automotive, Industrial  Multi-Phase Controller  AI / Client  LDO Regulators  Mass Market  Voltage Level Translators  Mass Market  Bus Switches / Muxes  Mass Market  2025  Products Sampling  10BASE-T1S RCP  Automotive, Industrial  Smart LED Driver Chipset  Automotive  Ultrasonic Base Product  Automotive  2-Ch Low-Power AFE ASIC  Medical  LIN Transceiver  Automotive  Platform MCU  Automotive, Industrial, AI / Client, Mass Market  Precision Current-Sense / Comparators  Automotive, Industrial, Mass Market  Expanded LDO Portfolio  Automotive, Industrial  2026  Products Sampling  48V SmartFET High-Side Drivers  Automotive  Isolated SiC Gate Driver  Automotive / AI Data Center  High-Perf Ultrasonic Sensor  Automotive  Inductive Position Sensors  Auto (E-Pedal/Steer)  Rain / Light Sensor Interface  Automotive  Ideal Diode Controller  Automotive, Industrial, Compute  ReRAM Non-Volatile Memory  Automotive, Industrial, Compute  Expanded Current-Sense   Automotive, Mass Market  Additional Voltage Translators  Mass Market  Switched-Cap Converter + LDO  Automotive, Industrial  Treo  HV  EPP  Power and Sense Portfolio  © onsemi 2026 | Public Information 
 

 

 The silicon becomes  the system.  EPP is the breakthrough that creates a new category of power systems.  Embedded Power Platform (EPP) uses the silicon wafer itself as the package, embedding heterogeneous die to deliver electrical, mechanical and thermal performance simultaneously, solving the density problem.   Not a product. A platform.  3–5×  UNMATCHED POWER DENSITY  30%  HIGHEST SYSTEM VALUE  12 in.  STANDARD  MANUFACTURING  4 MOS  FASTEST TIME TO MARKET  ✓  SUPERIOR THERMAL PERFORMANCE  BEST-IN-CLASS INDUCTANCE  ✓  © onsemi 2026 | Public Information  Introducing onsemi’s Embedded Power Platform 
 

 Yesterday's solutions  Lead-frame & DBC substrate (B2S)  Available today  Available today  Sampling today  EVALUATION  CRITERIA  Power density (area vs. B2S)  1x  1.3x  3x to 5x  System cost (vs. B2S)  1.0  1.1  0.7 – 0.8  Stray inductance  Medium  Low  Lowest  Thermal path  Bottom-side · 4 W/mK  Bottom-side · 0.4 W/mK  Dual-side · 148 W/mK  Device performance  1.0  +5%  +30%  Manufacturing  Custom · high CapEx  Custom · high CapEx  12″ Si fab · low CapEx  Idea → production  12 months (6+6)  12 months (6+6)  4 months  Embedded Power Platform obsoletes the State-Of-The-Art  State-of-the-art  Panel / S-Cell PCB embedding  onsemi EPP  Embedded Power Platform  Treo  HV  EPP  Power and Sense Portfolio  © onsemi 2026 | Public Information  EPP Leapfrogs PCB Embedded Power  
 

 < 48 hours  Size · Voltages · efficiency   1  Customer input  Electrical, thermal and mechanical simulation · multi-technology  2  EPP Design Studio  < 5 days  System design and concept complete  4  Customer system modelling  Design · datasheet · validated models  3  Studio output  < 3 months  12″ silicon fab · standard process  6  Interposer manufacturing  No new CapEx or custom tooling to bring up  5  No custom back-end  Customer / project dependent  Validation at the customer, on the customer's schedule  7  System integration  Wafer-level test · standard flow  8  Production  AI DC Customer  Industrial Customer  Treo  HV  EPP  Power and Sense Portfolio  © onsemi 2026 | Public Information  Delivering Value to Customers Already 
 

 < 48 hours  Size · Voltages · efficiency   1  Customer input  Electrical, thermal and mechanical simulation · multi-technology  2  EPP Design Studio  < 5 days  System design and concept complete  4  Customer system modelling  Design · datasheet · validated models  3  Studio output  < 3 months  12″ silicon fab · standard process  6  Interposer manufacturing  No new CapEx or custom tooling to bring up  5  No custom back-end  Customer / project dependent  Validation at the customer, on the customer's schedule  7  System integration  Wafer-level test · standard flow  8  Production  AI DC Customer  Industrial Customer  Treo  HV  EPP  Power and Sense Portfolio  © onsemi 2026 | Public Information  Delivering Value to Customers Already 
 

 Solving Problems with a Complete and Unique Suite of Capabilities  Peer 1  Peer 2  Peer 3  Peer 4  TECHNOLOGY NEEDED  IGBT  Silicon MOSFET  SiC MOSFET  SiC JFET   Lateral GaN  Vertical GaN  Treo (BCD 65nm, 1V-90V)  UNIQUE AND DEFENSIBLE COMPETITIVE POSITION  Power  1500+ patents  Vertical GaN (GaN-on-GaN) Syracuse-built, 180+ patents, 700 V & 1200 V sampling.   EPP EFK-built, 60+ patents.  Sampling Auto and AI DC  Embedded Power Platform   Small Signal and Protection  © onsemi 2026 | Public Information  onsemi Differentiation 
 

 EPP  THE INTEGRATION  Silicon as the system  The requirements do not converge on their own  onsemi makes them converge. We solve Power Density at every level.  TREO  THE INTELLIGENCE  Analog and mixed-signal platform   HV  THE DEVICE  Technology for every power problem  © onsemi 2026 | Public Information  The constraint is a system constraint and must be answered   at the device, the intelligence and the integration layer  Treo Platform  Application-Specific Interfaces  Communications Subsystem  Power Control  Power Subsystem  DC-DC  Driver  Power FET  Power Subsystem  High-PerformanceAFE  Low-Power AFE  Compute & System Resources Subsystem  Compute  Voltage/Clock  Standard I/O  Memory  Test  Peripherals 
 

 

 onsemi: Powering the AI Revolution  Achyut ShahGroup President, Power Solutions Group 
 

 The bottleneck has shifted… from chips to power.  from chips to power.  © onsemi 2026 | Public Information 
 

 Jensen Huang  Founder, President & CEO  Electrical • Thermal • Mechanical • Physical  from chips to power.  The bottleneck has shifted… from chips to power.  © onsemi 2026 | Public Information 
 

 GPU kW vs Deployment Horizon Source: McKinsey & Company   Increased Power Demand Creates Architectural Challenges  2000  1600  0  1200  800  400  2026  2027  2028  2029  2030  Deployment Horizon  2030  142GW  2026  25GW  Rack Power (kW per Rack)  McKinsey & Company  © onsemi 2026 | Public Information 
 

 “Power, not GPUs, is the limiting factor for AI data centers… the power density challenge is creating a fundamental architectural crisis at the rack level. The companies that solve this first will shape the competitive landscape for years to come.”  – Roland Berger  “800 VDC architecture: a single AC-to-800VDC conversion, distributed and used directly by the compute rack.”  “1,000 homes of power in a filing cabinet.”  GPU kW vs Deployment Horizon Source: McKinsey & Company   Increased Power Demand Creates Architectural Challenges  300  60  GW  240  180  120  2026  2027  2028  2029  2030  Cumulative Data Center Power Consumption  Bank of America  © onsemi 2026 | Public Information 
 

 Less real estate  More tokens/$$  Less water used  Fewer Data Centers   More Compute   Higher Efficiency  © onsemi 2026 | Public Information  Power Density Redefines   Economics of Compute 
 

 2030  12VDC  0.8VDC  DC   Hot Swap  DC  DC  DC  DC   Vcore  PDU  UPS  AC  DC  AC  HV PSU  AC  DC  480VAC  20KVAC  54VDC  54VDC  xPU  Power Transformer  480VAC  230VAC  54VDC  Utility Grid  BBU  CBU   54VDC Bus Bar  IBC  AC & Low Voltage Distribution and Conversion  Lateral Vcore  1kW   xPU  Mechanical Transformer; Low Voltage Storage & Protection  xPU Power Increase Drives Move to High Voltage   6 VDC  0.8VDC  5kW+  xPU  DC   Hot Swap  DC  DC   Vcore  PDU  Utility Grid  SST  AC  DC  PDU  DC  35KVAC  800VDC  800VDC  800VDC  ESS  DC-DC  xPU  BESS  800VDC  HV BBU  HV CBU  DC  DC  HV DC    HVDC Bus Bar  High Voltage DC Distribution and Conversion  Vertical Vcore -VPD  Solid State Transformer; High Voltage Storage & Protection  © onsemi 2026 | Public Information 
 

 AC  High Voltage Reaches the Core – Content Multiplies  © onsemi 2026 | Public Information  Low Voltage  High Voltage 
 

 AC  High Voltage Reaches the Core – Content Multiplies  AC  800V DC  Low Voltage  © onsemi 2026 | Public Information  High Voltage 
 

 AC  High Voltage Reaches the Core – Content Multiplies  SST  800V DC  AC  800V DC  Low Voltage  © onsemi 2026 | Public Information  High Voltage  $15K  $115K  Today  2030  per rack  per rack 
 

 AI DC Segment  6 VDC  0.8VDC  DC   Hot Swap  DC  DC  HV DC  DC  DC   Vcore  PDU  Utility Grid  SST  AC  DC  HV BBU  PDU  DC  35KVAC  800VDC  800VDC  800VDC  ESS  DC-DC  xPU  HV CBU  BESS  Grid to Core High Voltage Plays to Our Strength  800VDC   HVDC Bus Bar  Industrial Segment “AI Halo”  © onsemi 2026 | Public Information  More Power, Limited Space  More High Voltage Content  More Energy Storage & Load Balancing  Mechanical to Semiconductor Content  More Control, Intelligence, Safety  CONTENT 
 

 AI DC Segment  6 VDC  0.8VDC  DC   Hot Swap  DC  DC  HV DC  DC  DC   Vcore  PDU  Utility Grid  SST  AC  DC  HV BBU  PDU  DC  35KVAC  800VDC  800VDC  800VDC  ESS  DC-DC  xPU  HV CBU  More Power, Limited Space  BESS  Grid to Core High Voltage Plays to Our Strength  800VDC  More High Voltage Content  More Energy Storage & Load Balancing  Mechanical to Semiconductor Content  More Control, Intelligence, Safety   HVDC Bus Bar  Industrial Segment “AI Halo”  Multi-technology capabilities required to solve the power density challenge  © onsemi 2026 | Public Information  CONTENT 
 

 Treo  HV  EPP  Power and Sense Portfolio  6 VDC  0.8VDC  AI Compute Tray  Multiple Blade Trays per Rack  DC   Hot Swap  DC  DC  HV DC  PDU  Utility Grid  SST  AC  DC  HV BBU  PDU  DC  35KVAC  800VDC  800VDC  800VDC  ESS  DC-DC  GPU  HV CBU  BESS  800VDC  DC  DC   Vcore  peer  peer  peer  peer  peer  peer  peer  peer  peer  peer  peer  peer  peer  peer  peer  © onsemi 2026 | Public Information  LV Power + Control  As Technology Breadth Grows, Competitor Field Shrinks 
 

 Treo  HV  EPP  Power and Sense Portfolio  6 VDC  0.8VDC  AI Compute Tray  Multiple Blade Trays per Rack  Utility Grid  SST  AC  DC  35KVAC  800VDC  ESS  DC-DC  GPU  BESS  DC  DC   Vcore  DC  DC  HV DC  PDU  PDU  DC  800VDC  800VDC  HV CBU  800VDC  DC   Hot Swap  HV BBU  peer  peer  peer  peer  peer  peer  © onsemi 2026 | Public Information  High Voltage: SiC + GaN  As Technology Breadth Grows, Competitor Field Shrinks  LV Power + Control  6 VDC  0.8VDC 
 

 6 VDC  0.8VDC  AI Compute Tray  Multiple Blade Trays per Rack  Utility Grid  GPU  35KVAC  DC  DC   Vcore  DC   Hot Swap  DC  DC  HV DC  PDU  HV BBU  PDU  DC  800VDC  800VDC  HV CBU  800VDC  800VDC  ESS  DC-DC  SST  AC  DC  BESS  peer  © onsemi 2026 | Public Information  High Voltage: SiC JFET  As Technology Breadth Grows, Competitor Field Shrinks  Treo  HV  EPP  Power and Sense Portfolio  High Voltage: SiC + GaN  LV Power + Control  6 VDC  0.8VDC 
 

 Treo  HV  EPP  Power and Sense Portfolio  6 VDC  0.8VDC  AI Compute Tray  Multiple Blade Trays per Rack  Utility Grid  GPU  35KVAC  DC  DC   Vcore  DC   Hot Swap  DC  DC  HV DC  PDU  HV BBU  PDU  DC  800VDC  800VDC  HV CBU  800VDC  SST  AC  DC  800VDC  ESS  DC-DC  BESS  Proven leadership across technology breadth  High Voltage: SiC JFET  High Voltage: SiC + GaN  LV Power + Control  Innovation Breakthrough  HV vGaN   EPP  © onsemi 2026 | Public Information  Win with Capability Breadth + Technology Differentiation 
 

 Treo  HV  EPP  Power and Sense Portfolio  Competitor 1  Competitor 2  Higher Power density = More compute in Rack = Lower Cost per token  vGaN + Unique magnetics  = 20% smaller size  © onsemi 2026 | Public Information  vGaN Enables Highest Density 800V  6V IBC 
 

 Mechanical Circuit Breaker  High Voltage Architecture needs multiple Fault Protection points   © onsemi 2026 | Public Information  Industry-Standard Solid State Circuit Breaker  Mechanical to Solid State Fault Protection 
 

 Treo  HV  EPP  Power and Sense Portfolio  EPP SSCB  Industry-Standard SSCB  © onsemi 2026 | Public Information  EPP + SiC JFET: Redefining the Density Benchmark  Over 50% Smaller  20% cooler thermals  Over 50% Smaller 
 

 Treo  HV  EPP  Power and Sense Portfolio  Over 50% Smaller  106C  20% cooler   Industry-Standard SSCB  EPP SSCB  135C  © onsemi 2026 | Public Information  EPP + SiC JFET: Redefining the Density Benchmark  Smaller size + Less cooling = Better TCO 
 

 Treo  HV  EPP  Power and Sense Portfolio  Digital multi-phase control  Lateral Power Delivery  2-Phase SPS + Inductor  2 A/mm²  Z = 5 mm   with inductor  >3 A/mm²  Vertical Power Delivery  onsemi enabled 4-Phase VPD  In partnership with module vendors  EPP enabled SPS  Unique inductor design  Z = 2 mm   With inductor  New Vcore Win 2026  © onsemi 2026 | Public Information  EPP Enables Highest Vcore Power Density  Available now  Available 2027  SPS in EPP  EPP 
 

 >2X in 2026  Long-term Growth  + 10 pts  above market  AI DC Revenue  2X in 2027   50%+  revenue CAGR  2026-2030  AI DC TAM CAGRGrowth estimates vary  2026 – 2030   100  0  UBS  44%  21%  BofA  Citi  77%  81%  Mizuho  ~40% CAGR baseline  ~5X AI DC Revenue Growth  >$500M (2026)  >$2.5B (2030)  Our technology innovations allow us to significantly outgrow the market  © onsemi 2026 | Public Information  Higher Power Density  Better Customer TCO  Revenue & Margin Growth 
 

 Solves the  toughestchallenges  AI turns power into one connected system.  The field shrinks  The prize grows  © onsemi 2026 | Public Information 
 

 

 Expanding the Core: Automotive and Industrial  Sudhir GopalswamyGroup President, Analog & Mixed-Signal and Intelligent Sensing Groups 
 

 Expanding the Core  Automotive  Industrial  © onsemi 2026 | Public Information 
 

 2019  Today  9%  Growth   vs.  Flat SAAR  We Have Outgrown Automotive SAAR by 9%  By Building a Franchise to Seize Megatrends   ELECTRIFICATION  AUTONOMOUS  Intelligent Sensing: Image, Ultrasonic, Inductive  Intelligent Power: HV FET, MV FET, Power IC  © onsemi 2026 | Public Information  2030 
 

 AUTONOMOUS  L2  L3  L4  End-end Ethernet  Central “Brain”  Intelligent Nodes  2030  ELECTRIFICATION  EV penetration  Ultra-fast charging  Efficiency targets  Today  SDV/ZONAL  $47B TAM  $15B TAM  $9B TAM  © onsemi 2026 | Public Information  We Will Continue to Outperform SAAR by 9%   While Shifting to Higher Value 
 

 Intelligent Power Growth Plan  Extend SiC Technology Leadership  Expand System Value with Treo Power ICs  Change the Game with EPP  © onsemi 2026 | Public Information 
 

 SiC performance: +25% per generation  Next-gen  M1  M2  M3  Extend to 1400V SiC  400VBattery  800V  Battery  Today  1000V  Battery  750VSiC  1200VSiC  1400VSiC  Device   Structure  Enhancement  Today  Treo  HV  EPP  Power and Sense Portfolio  ELECTRIFICATION  $47B TAM  CustomerValue  Efficiency  Range or System Cost  Power Density  Horsepower or System Cost  Higher Voltage  Faster Charging  © onsemi 2026 | Public Information  SiC Leadership Provides Growth Foundation  We Will Continue to Raise the Bar 
 

 Treo  HV  EPP  Power and Sense Portfolio  Enabled by Treo  LED Drivers  Front/Rear Lighting  SPS, DC-DC Controllers  “Brain”  Power Protection  Power Tree  Current Controllers  Traction & OBC  © onsemi 2026 | Public Information  Expand System Value: Treo Power ICs  LDOs  Power Tree 
 

 Intelligent Treo SiC Current Controller  Treo  HV  EPP  Power and Sense Portfolio  Controller  SiC Gate Driver  DC Bus Discharge  Driver  Power Supply  SiC FET  Hall Effect Sensors  Motor Current Sensing  Industry Standard Inverter  © onsemi 2026 | Public Information  ELECTRIFICATION  $47B TAM  1-Gen   SiC   Boost  5%  BOM   Savings 
 

 Intelligent Treo SiC Current Controller  Treo  HV  EPP  Power and Sense Portfolio  Controller  Intelligent SiC Current Controller  Motor Current Sensing  SiC FET  Smart Control  Current Sense   onsemi Treo Optimized Inverter  1-Gen   SiC   Boost  5%  BOM   Savings  Hall Effect Sensors  Enabled by Treo  Available 2026  Customer Value  Efficiency  Range or System Cost  Power Density  Horsepower or System Cost  Integration  System Cost  © onsemi 2026 | Public Information  ELECTRIFICATION  $47B TAM 
 

 ELECTRIFICATION  $47B TAM  Customer Value  Power Density  Smaller, Lighter  Flexibility  Scalability  Lower R&D & Manufacturing Cost  Efficiency  Range or System Cost  Full System  Fast Time-to-Market  EPP Transforms Inverter Solutions  Treo  HV  EPP  Power and Sense Portfolio  4x   Power  Density  15%  Power Losses   1 Inverter   Platform  High end  Low end  © onsemi 2026 | Public Information  State-of-the-art   EPP  Available 2026 
 

 Intelligent Sensing Growth Plan  Capitalize on Sensor Proliferation  Extend Sensing Performance Leadership with Treo  Enhance Vision with New Image Sensing Modalities  © onsemi 2026 | Public Information 
 

 Broadest Range of Sensing Solutions  Image  Ultrasonic  Inductive  AUTONOMOUS  $15B TAM  © onsemi 2026 | Public Information 
 

 AUTONOMOUS  $15B TAM  Sensors Proliferate As Autonomy Scales  2026  2030  L2  L4  Image  Sensors  Ultrasonic   Sensors  More use cases  Inductive  Sensors  x-by-wire extends   1.5x  1.5x  3x  © onsemi 2026 | Public Information 
 

 AUTONOMOUS  $15B TAM  Customer Value  Accuracy  Safety & Reliability  Integration  System Cost  Raising the Bar on Intelligent Sensing  Image Sensing  Ultrasonic Sensing  Enabled by Treo  Inductive Sensing   20+ cm  Legacy  ›  6 cm  Today  <1 cm  Next-gen  ›  Current Gen  ~0.1°  Next Gen  <0.005°  >20x  20x   Performance  10%  BOM   Savings  Image Sensor  SER  Discrete  Serializer  ›  SER  Next-  Gen  Available 2027  Available 2027  Available 2027  © onsemi 2026 | Public Information 
 

 AUTONOMOUS  $15B TAM  PERCEPTION STACK  Vision  Adverse weather conditions  Spatial resolution  System cost  CHALLENGES  © onsemi 2026 | Public Information  Enhancing Vision for the Next Phase of Perception  Radar  Lidar  SWIR  See through fog and rain  Industrial avail today, Auto in Advanced R&D  iToF  High-res depth at <15M  Detect hazard at 100M  Industrial avail today, Auto in Proof-of-concept  Vision  Capture detail in any light  HDR avail today  Super-Human Vision  Customer Value  Enhanced Vision  Safety  iToF  System Cost 
 

 AUTONOMOUS  $15B TAM  SWIR  See through fog and rain  Industrial available today, Auto in Advanced R&D  iToF  High-res depth at <15M  Detect hazard at 100M  Industrial available today, Auto in Proof-of-concept  Superhuman Vision  Customer Value  Enhanced Vision  Safety  iToF  System Cost  Vision  Capture detail in any light  HDR available today  © onsemi 2026 | Public Information  Enhancing Vision for the Next Phase of Perception 
 

 New Growth Driver: Software Defined Vehicle/Zonal  Expand Content and Intelligence at the Nodes  © onsemi 2026 | Public Information 
 

 Domain-Based IVN (Today)  COMPLEX  ECU sprawl, SW in each node, mixed protocols  ADAS  ECU  ECU  ADAS  BODY  POWER-TRAIN  CHASSIS  GATE-WAY  Zonal w/ 10BT1S  Zonal w/ onsemi RCP  ZONAL  CONTROLLER  CENTRAL  COMPUTE  ZONAL  CONTROLLER  ZONAL  CONTROLLER  ZONAL  CONTROLLER  ZONAL  SWITCH  CENTRAL  COMPUTE  ZONAL  SWITCH  ZONAL  SWITCH  ZONAL  SWITCH  SIMPLIFIED  Ethernet to the edge, less cable complexity, costs  OPTIMIZED FOR SDV SW   Only in central compute and intelligent nodes  SDV/ZONAL  $9B TAM  10BT1S  10BT1S  RCP  GbE  GbE  10BT1S  10BT1S  RCP  © onsemi 2026 | Public Information  New Growth Driver: SDV/Zonal  onsemi VALUE 
 

 SDV/ZONAL  $9B TAM  Basic Ethernet Node  Ethernet Node with RCP  Treo Intelligent Node  MCU w/ SW  onsemi 10BT1S  onsemiUltrasonic  CENTRAL COMPUTE  ZONAL CONTROLLER  $$$   MCU w/ SW  onsemi 10BT1S  onsemiLED driver  Ultrasonic   Node  LED Node  onsemi 10BT1S RCP  w/ SW  onsemiUltrasonic  CENTRAL COMPUTE  ZONAL SWITCH $  onsemi 10BT1S RCP  w/ SW  onsemiLED driver  Ultrasonic   Node  LED Node  onsemi 10BT1S RCP w/ SW Ultrasonic  CENTRAL COMPUTE  ZONAL SWITCH $  onsemi 10BT1S RCP w/ SW  LED  Ultrasonic   Node  LED Node  onsemi VALUE  New Growth Driver: SDV/Zonal  © onsemi 2026 | Public Information 
 

 SDV/ZONAL  $9B TAM  Basic Ethernet Node  Ethernet Node with RCP  Treo Intelligent Node  ZONAL CONTROLLER  $$$   Ultrasonic   Node  LED Node  ZONAL SWITCH $  Ultrasonic   Node  LED Node  ZONAL SWITCH $  Ultrasonic   Node  LED Node  In Production  $ Today  Design-in 2027  2x $ Today   Next-gen in 2028  3x $ Today  Leading the SDV Evolution   © onsemi 2026 | Public Information  CENTRAL COMPUTE  CENTRAL COMPUTE  CENTRAL COMPUTE 
 

 Up to $2000 of onsemi content per vehicle  Existing Portfolio   Recently Added Products  © onsemi 2026 | Public Information  Building the Car: onsemi in Every Subsystem  ADAS and Autonomous Driving Solutions   8Mp, 3Mp image sensor   iToF   SWIR  Ultrasonic Sensing  Inductive Sensing  Rain & Light Sensing  Zonal Electronics  Auto LED Drivers  SmartFET/eFuse  10BASE-T1S Ethernet  CAN/LIN  Standard Products (LDOs, Amps)  Small Signal Protection  HEV / PHEV / BEV  EPP  EliteSiC FET  SiC Current Controller  48V Transition  HV Si FET  GaN/SiC Gate Drivers, LDO's  SmartFET/eFuse  Vehicle Electrification xEV 
 

 SiC   TRACTION   IMAGE SENSING  ADAS  10BASE-T1S   IVN  INDUCTIVE  X-BY-WIRE  INNOVATION  ENGINE  © onsemi 2026 | Public Information  Automotive Innovations…  ULTRASONIC   PARK ASSIST 
 

 IMAGE SENSING  MACHINE VISION  10BASE-T1S  ETHERNET NODES  INDUCTIVE  JOINT CONTROL  Automotive Innovations… Enable Growth in Industrial…  INNOVATION  ENGINE  SiC   ENERGY INFRASTRUCTURE   ULTRASONIC   FLOW METERING  © onsemi 2026 | Public Information 
 

 POWER  Efficient power conversion  SENSE  Perception of the physical world  CONTROL  Precise actuation and control  …and Lead to the Next Major Growth Opportunity  The Era of Physical AI  © onsemi 2026 | Public Information 
 

 POWER, PERFORMANCE  AUTONOMY  Robot Vacuums  Drones  Delivery Robots  Warehouse   AMRs  Cobots  Factory Arms  Autonomous   Tractors  Autonomous Cars  onsemi Content Opportunity  © onsemi 2026 | Public Information  The Era of Physical AI has Already Begun  Autonomous machines that sense, decide, act and adapt  Warehouse   AMRs  Autonomous Cars  Factory Arms  Legged   AMR  “Reasoning”Vehicles  Dexterous Hands  + Autonomy, Legs  + Gripper Hands, Force Sensing  + Multi-modal VLA, Reasoning  2x to  $6B by 2030 
 

 Warehouse   AMRs  Autonomous Cars  Factory Arms  Legged   AMR  “Reasoning”Vehicles  Dexterous Hands  + Autonomy, Legs  + Gripper Hands, Force Sensing  + Multi-modal VLA, Reasoning  Physical AI:  $6B TAM by 2030  © onsemi 2026 | Public Information  The Evolution to Humanoids Yields Content Expansion 
 

 Up to $900 of onsemi content per humanoid  HEAD/PERCEPTION  NECK  SHOULDERS   UPPER ARMS  ELBOWS  HANDS  LEGS  ANKLES/FEET  TORSO/COMPUTE  POWER SYSTEM  CORE SENSORS  WAIST/HIPS  BATTERY  KNEES  COMMUNICATION  30+ Limb Actuators   6x GaN FET  3x GaN Driver  Inductive sensors  10BASE-T1S  Intelligent Control  Current sensors  UVP/OVP  15+ Hand Actuators  MOSFET/GaN  Gate Drivers  Intelligent Control  10BASE-T1S  Sensors  Ultrasonic sensors   Pressure/force  Audio DSP  Sensor Hub MCU  Temp monitor  Power Tree  eFuse  SiC/MOSFET  DC-DC/LDOs   Connectivity  10BASE-T1S  CAN/LIN  BLE  Vision Systems  Image sensors   iToF sensors  SWIR  DC-DC/LDOs   Existing Portfolio   Recently Added Products  © onsemi 2026 | Public Information  Building the Humanoid: onsemi in Every Subsystem 
 

 Today  2030  EPP Disruption:  Intelligent Sensing:  SDV/Zonal:   System Play  Content Expansion  New Growth Engine  9%  CAGR  Industrial  Leverage Auto:  Physical AI:  AI Halo:  SAM Expansion  New Growth Engine  New Growth Engine  10%  CAGR  © onsemi 2026 | Public Information  Expanding the Core: Automotive and Industrial  Automotive   Value Drivers  Delivering Margin Expansion 
 

 

 Turning Technology Leadership intoDurable Financial Performance  Thad TrentExecutive Vice President and CFO 
 

 Market Inflection. Differentiated Capabilities. Shareholder Value Creation.   HIGH-VALUE, SECULAR MARKETS​  AI Data Center, Automotive, Industrial  DIFFERENTIATED CAPABILITIES  Differentiated technology expands margins​  © onsemi 2026 | Public Information 
 

 Non-GAAP  2015–2020  2021–2026  Avg. Gross Margin  Avg. Operating Margin  26%  43%  36%  13%  *BANDS REPRESENT HIGH AND LOW OF EACH METRIC DURING THAT PERIOD  Revenue  Sustainable and predictable results  Proven downside resilience  Improved cost structure, OpEx efficiency (Rev/employee increased ~2X)  Higher Operating leverage  Differentiated products, Fab Right, portfolio rationalization – completed exits of ~$900M annualized  Structural step function margin improvement  Transform from Manufacturing Co. to a Product Co.  Brownfield capacity expansion  Strong Free Cash Flow Generation  AVG FREE CASH FLOW %  © onsemi 2026 | Public Information  The Power of onsemi’s Transformation 
 

 2015–2020  2021–2026  Avg. Gross Margin   Avg. Free Cash Flow Margin   Revenue  18%  8%  Sustainable and predictable results  Proven downside resilience  Improved cost structure, OpEx efficiency (Rev/employee increased ~2X)  Higher Operating leverage  Differentiated products, Fab Right, portfolio rationalization – completed exits of ~$900M annualized  Structural step function margin improvement  Transform from Manufacturing Co. to a Product Co.  Brownfield capacity expansion  Strong Free Cash Flow Generation  43%  36%  © onsemi 2026 | Public Information  Non-GAAP  The Power of onsemi’s Transformation 
 

 R&D  $3.6B  Organic Investments  EPP  Sensing, 8MP, Ultrasonic  Core Portfolio Expansion  Treo Platform  Low/Medium/High Voltage  Strategic Investments Drive Significant TAM Expansion  Auto  Industrial  AI Data Center​  Other  © onsemi 2026 | Public Information  2021-2026   Total Investment: $8.7B 
 

 GTAT  Vcore  SiC JFET  SWIR Vision  Vertical GaN  M&A  Capability Expansion  $0.8B  Strategic Investments Drive Significant TAM Expansion  Auto  Industrial  AI Data Center​  Other  © onsemi 2026 | Public Information  2021-2026   Total Investment: $8.7B 
 

 CapEx  Capacity Expansion  $4.3B  EFK Expansion  SiC / vGaN Capacity  Maintenance  Strategic Investments Drive Significant TAM Expansion  Auto  © onsemi 2026 | Public Information  2021-2026   Total Investment: $8.7B  Auto  Opportunistic expansion leveraging strategic investments  Power Distribution & Traction  ADAS & Sensing  Zonal architecture  Energy & AI Infrastructure  Medical & AD&S  Low voltage power to xPU  800V to 6V step down (IBC)  Power @ high voltage (ex. rack)  Factory Automation & Robotics  Industrial  AI Data Center​  Other 
 

 Total Investment: $8.7B  $8.7B investment delivers $81B TAM Expansion  R&D  $3.6B  Organic Investments  GTAT  Vcore  SiC JFET  SWIR Vision  Vertical GaN  M&A  Capability Expansion  $0.8B  CapEx  Capacity Expansion  $4.3B  EFK Expansion  SiC / vGaN Capacity  Maintenance  EPP  Sensing, 8MP, Ultrasonic  Core Portfolio Expansion  Treo Platform  Low/Medium/High Voltage  © onsemi 2026 | Public Information  Strategic Investments Drive Significant TAM Expansion  2021-2026   Auto  Power Distribution & Traction  ADAS & Sensing  Zonal architecture  +$20B  TAM  AI Data Center​  Low voltage power to xPU  800V to 6V step down (IBC)  Power @ high voltage (ex. rack)  +$45B  TAM  Other  Opportunistic expansion leveraging strategic investments  Industrial  Energy & AI Infrastructure  Medical & AD&S  Factory Automation & Robotics  +$16B  TAM 
 

 Deep strategic engagements addressing customers’ most complex engineering challenges  Broad global distribution network to serve the mass market  Top 20 customers represent ~35% of revenue, no 10% customer  © onsemi 2026 | Public Information  Highly diversified customer footprint spanning 9,000+ customers globally  Enabling Innovation Across a Global Customer Base  AUTOMOTIVE  AI DATA CENTER  INDUSTRIAL 
 

 Innovation and Portfolio Breadth Accelerates Growth  Other  Communications, Computing, Consumer  AUTO  INDUSTRIAL  AI DATA CENTER  OTHER  Non-GAAP CAGR  2026E - 2030 Target  9%  10%  50%+  1%  12-14%  2026E  2030 Target  Auto  Drivers: electrification, Software-Defined Vehicles/Zonal, ADAS  ~$2,000 content per vehicle  Outgrowing SAAR by high single digits   Industrial  Drivers: AI Halo, energy infrastructure, automation, medical, AD&S  Physical AI: $6B TAM by 2030; ~$900 content per humanoid  © onsemi 2026 | Public Information  AI Data Center​  Drivers: 800VDC, HV revenue acceleration, Vcore penetration  ~$15K à ~$115K content per rack  Revenue >5x in 2030 to >$2.5B 
 

 East Fishkill  External  2019 Footprint:  Mount-ain Top  Mec-helen  Bucheon  Poca-tello  Oud-ena-arde  Niig-ata  Czech Repu-blic  Aizu  Gresham  Serem-ban  Aizu  Gresham  Bucheon  Czech Republic  Seremban  External  Fab-Liter  Current Footprint:  Fab Right  Syracuse  © onsemi 2026 | Public Information  Fab Right: Building a More Efficient, Scalable Manufacturing Network 
 

 East Fishkill  External  2019 Footprint:  Mount-ain Top  Mec-helen  Bucheon  Poca-tello  Oud-ena-arde  Niig-ata  Czech Repu-blic  Aizu  Gresham  Serem-ban  Aizu  Gresham  Bucheon  Czech Republic  Seremban  External  Fab-Liter  Current Footprint:  Fab Right  Syracuse  © onsemi 2026 | Public Information  Fab Right: Building a More Efficient, Scalable Manufacturing Network 
 

 External  Scalable, Efficient, Lower Cost  Right sized, ready to scale on demand  Minimal CapEx needed to scale (5% of revenue)  More efficient capacity drives gross margin expansion  Exited five subscale fabs while expanding 300mm (EFK) capacity   Current footprint ~17% lower cost (at full utilization)  Additional Fab Right activities to drive further gross margins expansion  2019 Footprint:  Mount-ain Top  Mec-helen  Bucheon  Poca-tello  Oud-ena-arde  Niig-ata  Czech Repu-blic  Aizu  Gresham  Serem-ban  East Fishkill  Aizu  Gresham  Bucheon  Czech Republic  Seremban  External  Fab-Liter  Current Footprint:  Fab Right  Syracuse  © onsemi 2026 | Public Information  Fab Right: Building a More Efficient, Scalable Manufacturing Network 
 

 Utilization  Volume driven ramp to full utilization  Absorption of fixed costs  Fab Right  Additional efficiency and cost optimization  Capacity allocated to high value products  Two site divestitures recently announced  New Products/ Mix  Ramping differentiated products at accretive margins (Treo, EPP, vGaN)  Portfolio mix shift in silicon power products  Ramping high growth AI Data Center revenue  40.3%  2026E  Utilization  Fab Right  50bps announced  New Products / Mix  53%  2030  Target   400 bps  225 bps  650 bps  © onsemi 2026 | Public Information  Non-GAAP  Growth and Innovation Drive Gross Margin Expansion 
 

 Non-GAAP CAGR, 2026E – 2030 Target  Operating Income $  Gross Profit $  Revenue  20%  30%  10%  0%  +12-14%  +22%  +30%  Gross profit grows 1.6x faster than revenue;  operating income more than 2x faster.  © onsemi 2026 | Public Information  Top-line Growth  Outsized Earnings Growth  Structural changes, innovation and execution deliver significant operating leverage  
 

 Operating Income $  Gross Profit $  Revenue  +12-14%  +22%  +30%  20%  30%  10%  0%  Gross profit grows 1.6x faster than revenue;  operating income more than 2x faster.  Non-GAAP CAGR, 2026E – 2030 Target  © onsemi 2026 | Public Information  Top-line Growth  Outsized Earnings Growth  Structural changes, innovation and execution deliver significant operating leverage  
 

 Investment Era  2020  2022  2024  2025  2026E  2021  2023  2030 Target  $1.6B (25%)  ~$3.5B  (30-35%)  Buyback $4.2B / 92% FCF 2023-2026E = 12% reduction in shares outstanding  >2X  © onsemi 2026 | Public Information  Free cash flow more than doubling by 2030  Monetizing Investments through scale and efficiency 
 

 2020  2022  2024  2025  2026E  2021  2023  2030 Target  $1.6B (25%)  ~$3.5B  (30-35%)  >2X  Investment Era   2023-2026E: Share repurchase of $4.2B, 92% of FCF → 12% reduction in shares  Free cash flow more than doubling by 2030  Monetizing Investments through scale and efficiency  © onsemi 2026 | Public Information 
 

 REINVEST  Fund the highest-return growth  Differentiated products,   R&D and capacity investments that strengthen competitive advantage.  © onsemi 2026 | Public Information  Disciplined Capital Allocation Compounds Shareholder Value 
 

 STRATEGIC M&A  Expand the portfolio selectively  Add capabilities to expand TAM and accelerate time to market. Clear strategic and financial merit enhancing the financial model.  REINVEST  Fund the highest-return growth  Differentiated products,   R&D and capacity investments that strengthen competitive advantage.  © onsemi 2026 | Public Information  Disciplined Capital Allocation Compounds Shareholder Value 
 

 BALANCESHEET  Preserve resilience and flexibility  Maintain strong liquidity and leverage profile.  STRATEGIC M&A  Expand the portfolio selectively  Add capabilities to expand TAM and accelerate time to market. Clear strategic and financial merit enhancing the financial model.  REINVEST  Fund the highest-return growth  Differentiated products,   R&D and capacity investments that strengthen competitive advantage.  © onsemi 2026 | Public Information  Disciplined Capital Allocation Compounds Shareholder Value 
 

 RETURN  CASH  Repurchase shares consistently  Return 100% of free cash flow through share repurchases.  $5.3B remaining under the existing authorization.  BALANCESHEET  Preserve resilience and flexibility  Maintain strong liquidity and leverage profile.  STRATEGIC M&A  Expand the portfolio selectively  Add capabilities to expand TAM and accelerate time to market. Clear strategic and financial merit enhancing the financial model.  REINVEST  Fund the highest-return growth  Differentiated products,   R&D and capacity investments that strengthen competitive advantage.  © onsemi 2026 | Public Information  Disciplined Capital Allocation Compounds Shareholder Value 
 

 RETURN  CASH  Repurchase shares consistently  Return 100% of free cash flow through share repurchases.  $5.3B remaining under the existing authorization.  BALANCESHEET  Preserve resilience and flexibility  Maintain strong liquidity and leverage profile.  STRATEGIC M&A  Expand the portfolio selectively  Add capabilities to expand TAM and accelerate time to market. Clear strategic and financial merit enhancing the financial model.  REINVEST  Fund the highest-return growth  Differentiated products,   R&D and capacity investments that strengthen competitive advantage.  © onsemi 2026 | Public Information  Disciplined Capital Allocation Compounds Shareholder Value 
 

 Non-GAAP  2025A  2030 TARGET  Revenue  Gross Margin  $6.0B  38.4%  +12-14%  CAGR  53%  Growth driven by highly differentiated products in fast growing markets  Utilization, high-value new products, and Fab Right  Operating Expenses  Operating Margin  19.8%  18.6%  15%  38%  Targeted R&D investment to expand capabilities and TAM  Operating income grows >2x revenue growth  CapEx  Free Cash Flow  5.7%  23.7%  ~5%  30-35%  CapEx-light model for optimal capital allocation  Monetizing investments through scale and efficiency  2026E  $6.5B  40.3%  18.5%  21.9%  2.7%  24.8%  Non-GAAP tax rate remains at 15% through 2030  © onsemi 2026 | Public Information  Technology Leadership POWERS Shareholder Value  Synaptics  standalone  Post-Synergies  Accelerates Financial model 
 

 Non-GAAP  Synaptics Accelerates Financial Model  Revenue  Gross Margin  $6.0B  38.4%  +12-14%  CAGR  53%  Growth driven by highly differentiated products in fast growing markets  Utilization, High-Value New Products, and Fab-Right  Operating Margin  18.7%  38%  Operating income grows >2x revenue growth  $6.5B  40.3%  21.9%  Revenue  Gross Margin  Leverage onsemi sales channel to broaden customer base, increase content per platform, cross selling. Increases TAM by $30B  Connected-compute capabilities at accretive gross margins  Operating Margin  Accretive to EPS within ~18 months with $200M of synergies  >15%  Synaptics  Standalone  Post-Synergies  >55%  >30%  © onsemi 2026 | Public Information  Non-GAAP 
 

 Operating Expenses  Operating Margin  19.8%  18.6%  15%  38%  Targeted R&D investment to expand capabilities and TAM  Operating income grows >2x revenue growth  CapEx  Free Cash Flow  5.7%  23.7%  ~5%  30-35%  CapEx-light model for optimal capital allocation  Monetizing investments through scale and efficiency  18.5%  21.9%  2.7%  24.8%  Revenue  Gross Margin  $6.0B  38.4%  +12-14%  CAGR  53%  Growth driven by highly differentiated products in fast growing markets  Utilization, high-value new products, and Fab Right  $6.5B  40.3%  Non-GAAP  2025A  2030 TARGET  2026E  Non-GAAP tax rate remains at 15% through 2030  © onsemi 2026 | Public Information  Technology Leadership Powers Shareholder Value  Synaptics  standalone  Post-Synergies  Accelerates Financial model 
 

 2015–2020  2021–2026  8%  36%  AVG GROSS MARGIN  43%  REVENUE  AVG FREE CASH FLOW MARGIN   18%  2030 Target  13%  AVG OPERATING MARGIN  26%  53% GM  38% OM  Accelerated growth, differentiated portfolio investments and Fab Right for gross margin expansion  Leveraging past investments and capacity expansion support strong cash conversion  Streamlined manufacturing structure and OpEx efficiency drive significant operating leverage  Target operating margin is greater than legacy gross margins  30-35% FCF  © onsemi 2026 | Public Information  Non-GAAP  The Power of onsemi’s Transformation 
 

 AI data center, automotive, industrial  Higher compute power driving a shift to high-voltage architectures and greater onsemi content.  Electrification, autonomy and SDV/zonal architectures sustain content growth above SAAR.  AI Halo driving power semi demand; physical AI emerging as a new onsemi growth vector.  +12–14%  Revenue CAGR  53%  38%  30–35%  Unmatched breadth  A full LV and HV portfolio across silicon, SiC, GaN and vGaN.  Advanced platforms, exclusive to onsemi  Treo and EPP create differentiated power systems with best-in-class performance.  Scaled investment  $8.7B invested over five years expands the addressable market by $81B.  Expanding markets + differentiated capabilities + disciplined execution = durable, profitable growth  © onsemi 2026 | Public Information  Market Inflection. Differentiated Capabilities. Shareholder Value Creation.   HIGH-VALUE, SECULAR MARKETS​  AI Data Center  Automotive  Industrial  Differentiated technology expands margins​  DIFFERENTIATED CAPABILITIES  Non-GAAP · 2026E → 2030 Target  COMPOUNDING FINANCIALS  Gross margin expansion  Operating margin expansion increases >2× revenue  Free cash flow margin   expansion to ~$3.5B 
 

 

 Market Inflection. Differentiated Capabilities. Shareholder Value Creation.   © onsemi 2026 | Public Information 
 

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 APPENDIX 
 

 Reconciliation of GAAP to Non-GAAP Gross Margin  Fiscal Year  FY 2021  FY 2022  FY 2023  FY 2024  FY 2025  GAAP Gross Margin  40.3%  49.0%  47.1%  45.4%  33.1%  a) Impact of business wind down  0.0%  0.2%  0.0%  0.0%  0.0%  b) Amortization of acquisition-related intangible assets  0.0%  0.1%  0.1%  0.1%  0.1%  c) Non-recurring facility costs  0.1%  0.0%  0.0%  0.0%  0.0%  d) Restructuring-related inventory and other charges  0.0%  0.0%  0.0%  0.0%  5.2%  Non-GAAP Gross Margin  40.4%  49.2%  47.1%  45.5%  38.4%  Appendix – GAAP to Non-GAAP Reconciliation  Reconciliation of GAAP to Non-GAAP Gross Margin  Fiscal Year  FY 2015  FY 2016  FY 2017  FY 2018  FY 2019  FY 2020  GAAP Gross Margin  34.1%  33.2%  36.7%  38.1%  35.8%  32.7%  a) Amortization of fair market value step-up of inventory  0.0%  1.7%  0.2%  0.0%  0.4%  0.0%  b) Actuarial (gains)/losses on pension plans  0.0%  0.1%  0.0%  0.0%  0.0%  0.0%  c) Sell-through / sell-in adjustment  0.0%  0.0%  0.1%  0.0%  0.0%  0.0%  Non-GAAP Gross Margin  34.1%  35.0%  37.0%  38.1%  36.1%  32.7%  Certain amounts in the above tables may not total due to rounding of individual amounts. 
 

 Appendix – GAAP to Non-GAAP Reconciliation  Reconciliation of GAAP to Non-GAAP Operating Margin  Fiscal Year  FY 2021  FY 2022  FY 2023  FY 2024  FY 2025  GAAP Operating Margin  19.1%  28.3%  30.8%  25.0%  1.4%  a) Amortization of acquisition-related intangible assets  1.5%  1.0%  0.7%  0.8%  0.8%  b) Restructuring, asset impairments and other, net  1.1%  0.2%  0.9%  1.9%  11.1%  c) Goodwill and intangible asset impairment  0.0%  4.6%  0.0%  0.0%  0.0%  d) Third party acquisition and divestiture-related costs  0.2%  0.2%  0.0%  0.2%  0.1%  e) Non-recurring facility costs  0.1%  0.0%  0.0%  0.0%  0.0%  f) Impact of business wind down  0.0%  0.2%  0.0%  0.0%  0.0%  g) Restructuring-related inventory and other charges  0.0%  0.0%  0.0%  0.0%  5.2%  Non-GAAP Operating Margin  21.9%  34.5%  32.3%  27.9%  18.6%  Reconciliation of GAAP to Non-GAAP Operating Margin  Fiscal Year  FY 2015  FY 2016  FY 2017  FY 2018  FY 2019  FY 2020  GAAP Operating Margin  7.5%  6.0%  12.3%  14.4%  7.8%  6.6%  a) Amortization of acquisition-related intangible assets  3.9%  2.7%  2.2%  1.9%  2.1%  2.3%  b) Restructuring, asset impairments and other, net  0.3%  0.8%  0.4%  0.1%  0.5%  1.2%  c) Goodwill and intangible asset impairment  0.1%  0.1%  0.2%  0.1%  0.0%  0.0%  d) Third party acquisition and divestiture-related costs  0.1%  0.7%  0.1%  0.1%  0.2%  0.0%  e) Amortization of fair market value step-up of inventory  0.0%  1.7%  0.2%  0.0%  0.4%  0.0%  f) Litigation settlement  0.0%  0.0%  0.0%  0.0%  3.1%  0.0%  g) Actuarial (gains)/losses on pension plans  -0.1%  0.3%  0.0%  0.0%  0.0%  0.0%  h) Sell-through / sell-in adjustment  0.0%  0.0%  -0.7%  0.0%  0.0%  0.0%  i) R&D costs related to licensing income  0.0%  0.0%  0.2%  0.1%  0.0%  0.0%  Non-GAAP Operating Margin  11.7%  12.3%  15.0%  16.7%  14.1%  10.2%  Certain amounts in the above tables may not total due to rounding of individual amounts. 
 

 Appendix – GAAP to Non-GAAP Reconciliation  Reconciliation of GAAP to Non-GAAP Operating Expenses   FY 2015  FY 2016  FY 2017  FY 2018  FY 2019  FY 2020  GAAP Operating Expenses   $ 932.1    $ 1,060.8    $ 1,352.9    $ 1,391.5    $ 1,540.9    $ 1,367.1   a) Amortization of acquisition-related intangible assets   (135.7)   (104.8)   (123.8)    (111.7)     (115.2)   (120.3)  b) Restructuring, asset impairments and other, net   (9.3)   (33.2)   (20.8)   (4.3)   (28.7)   (65.2)  c) Goodwill & intangible asset impairment   (3.8)   (2.2)   (13.1)   (6.8)   (1.6)   (1.3)  d) Third-party acquisition/divestiture costs   (3.5)   (25.8)   (3.2)   (4.4)   (11.3)   (1.0)  e) Actuarial gains/(losses) pension   4.2   (6.8)   0.7    -    -   -   f) R&D costs related to licensing income  -   -   (10.0)  -   -   -   g) Litigation settlement   -   -   -    -    (169.5)   -   j) R&D costs related to licensing income   -    -    -    (7.0)   -    -   Non-GAAP Operating Expenses   $ 784.0    $ 888.0    $ 1,182.7    $ 1,257.3    $ 1,214.6    $ 1,179.3   Non-GAAP Operating Expense Margin  22.4%  22.7%  22.0%  21.4%  22.0%  22.4%  Reconciliation of GAAP to Non-GAAP Operating Income  FY 2015  FY 2016  FY 2017  FY 2018  FY 2019  FY 2020  GAAP Operating Income  $ 261.1    $ 236.1    $ 680.9    $ 847.2    $ 432.7    $ 348.7   a) Amortization of acquisition-related intangible assets   135.7   104.8   123.8   111.7   115.2    120.3   b) Restructuring, asset impairments and other, net  9.3    33.2    20.8    4.3    28.7    65.2   c) Goodwill & intangible asset impairment    3.8    2.2     13.1    6.8      1.6    1.3   d) Third-party acquisition/divestiture costs   3.5    25.8    3.2      4.4    11.3    1.0   g) Amortization of fair value inventory step-up   -    67.5    13.6    1.0    19.6      -   h) Actuarial gains/(losses) pension   (5.0)    10.0    1.9    -    -    -   i) Litigation settlement    -    -      -    -   169.5    -   l) sell-through to sell in adjustment    -    -  (59.0)    -    -    -   m) R&D costs related to licensing income   -    -     10.0    7.0    -    -   Non-GAAP Operating Income   $ 408.4    $ 479.6    $ 808.3    $ 982.4    $ 778.6    $ 536.5   (in millions, except percentages)   Certain amounts in the above tables may not total due to rounding of individual amounts. 
 

 Appendix – GAAP to Non-GAAP Reconciliation  (in millions, except percentages)  Reconciliation of GAAP to Non-GAAP Operating Expenses   FY 2021  FY 2022  FY 2023  FY 2024  FY 2025  GAAP Operating Expenses   $ 1,426.7    $ 1,717.2    $ 1,344.8    $ 1,448.4    $ 1,899.7   a) Amortization of acquisition-related intangible assets   (99.0)   (81.2)   (51.1)   (52.0)   (44.4)  b) Restructuring, asset impairments and other, net   (71.4)   (17.9)   (74.9)   (133.9)   (666.9)  c) Goodwill & intangible asset impairment   (2.9)   (386.8)   -    -    -   d) Third-party acquisition/divestiture costs     (11.9)   (12.9)  1.3    (14.0)   (4.3)  e) Impact of business wind down    -       6.8    -   -     -   f) Adjustments to contingent consideration   -      -    -     -    1.3   Non-GAAP Operating Expenses   $ 1,241.5    $ 1,225.2    $ 1,220.1    $ 1,248.5    $ 1,185.4   Non-GAAP Operating Expense Margin  18.4%  14.7%  14.8%  17.6%  19.8%  Reconciliation of GAAP to Non-GAAP Operating Income  FY 2021  FY 2022  FY 2023  FY 2024  FY 2025  GAAP Operating Income   $ 1,287.6    $ 2,360.0    $ 2,538.7    $ 1,767.7    $ 84.2   a) Amortization of acquisition-related intangible assets   99.0    82.8    56.8    58.3    49.4   b) Restructuring, asset impairments and other, net   71.4    17.9    74.9    133.9    666.9   c) Goodwill & intangible asset impairment   2.9    386.8    -     -     -    d) Third-party acquisition/divestiture costs   11.9    12.9    (1.3)   14.0    4.3   e) Non-recurring facility costs   5.5    -     -     -     -    f) Impact of business wind down   -       12.7    (3.9)   -     -    g) Amortization of fair value inventory step-up   -     -     -     -     2.4   h) Restructuring-related inventory charges   -     -     -     -     313.6   o) Adjustments to contingent consideration   -     -     -     -     (1.3)  Non-GAAP Operating Income   $ 1,478.3    $ 2,873.1    $ 2,665.2    $ 1,973.9    $ 1,119.5    Certain amounts in the above tables may not total due to rounding of individual amounts. 
 

 Reconciliation of net cash provided by operating activities to free cash flow  FY 2021  FY 2022  FY 2023  FY 2024  FY 2025  Net cash provided by operating activities   $ 1,782.0    $ 2,633.1    $ 1,977.5    $ 1,906.4    $ 1,759.8   Purchase of property, plant & equipment   $ (444.6)   $ (1,005.0)   $ (1,575.6)   $ (694.0)   $ (341.2)  Free Cash Flow   $ 1,337.4    $ 1,628.1    $ 401.9    $ 1,212.4    $ 1,418.6   Free Cash Flow Margin  19.8%  19.6%  4.9%  17.1%  23.7%  Reconciliation of net cash provided by operating activities to free cash flow  Fiscal Year  FY 2015  FY 2016  FY 2017  FY 2018  FY 2019  FY 2020  Net cash provided by operating activities  $ 470.6    $ 581.2    $ 1,094.2    $ 1,274.2    $ 694.7    $ 884.3   Purchase of property, plant & equipment  $ (272.2)   $ (108.9)   $ (395.7)   $ (514.8)   $ (534.6)   $ (383.6)  Free Cash Flow   $ 198.4    $ 472.3    $ 698.5    $ 759.4    $ 160.1   $ 500.7   Free Cash Flow Margin  5.7%  12.1%  13.0%  13.0%  2.9%  9.5%  Appendix – GAAP to Non-GAAP Reconciliation  (in millions, except percentages)  Certain amounts in the above tables may not total due to rounding of individual amounts. 
 

 Notes and Sources  Charting a Path to Power the Next Decade of Innovation  Hassane El-Khoury, President and CEO  $5.3B remaining under the existing authorization.  As reported through Q2’2026  2026 estimates are based on consensus 
 

 GPU Rack Power (kW per Rack) vs Deployment Horizon Graph  McKinsey & Company – The shift to 800-volt DC at data centers: Implications for providers, published July 2026  Cumulative New Data Center Power Consumption Graph  Bank of America-Watts to Token, May 2026   AI DC TAM CAGRs  UB, Bank of America, Citi Bank, Mizuho and onsemi internal estimates  2026 estimates are based on consensus  Notes and Sources  onsemi: Powering the AI Revolution  Achyut Shah, Group President, Power Solutions Group 
 

 Notes and Sources  Expanding the Core: Automotive and Industrial  Sudhir Gopalswamy, Group President, Analog & Mixed-Signal and Intelligent Sensing Groups  ~0% SAAR 2019-26, 2026-2030  Bloomberg Auto SAAR Factset 26E (0.39%)  Physical AI: $6B TAM in 2030  onsemi estimates, Yole, Omdia projections for: Autonomous Mobile Robots, Drones, Humanoid  2026 estimates are based on consensus 
 

 What you are used to seeing (images)  Maximize Market Research Pvt. Ltd  Deloitte and Mordor Intelligence  KBV Research  Yole  Sustainable Ecosystem ‘22-’27 TAM CAGRs  onsemi estimates  LMC Automotive: Global Hybrid & Electric Vehicle Forecast - Quarter 4, 2022  Omdia: Power IC Market Tracker, Sep’22  Sustainable Ecosystem Accelerating onsemi Content  Based on total onsemi BOM opportunity  Markets that Matter  onsemi estimates based on current market projections  Semiconductor TAM excludes Memory   Winning Formula…and Execute  >$17B: onsemi Form 10-Q filing for period ended March 31 2023   2026 estimates are based on consensus  Notes and Sources  Turning Technology Leadership into Durable Financial Performance  Thad Trent, Executive Vice President and CFO 
 

 Cautionary Information  No Offer or Solicitation  This communication is for informational purposes only and does not constitute, or form a part of, an offer to buy or sell or the solicitation of an offer to buy or sell any securities, or a solicitation of any vote or approval, nor shall there be any sale of securities in any jurisdiction in which such offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such jurisdiction. No offer of securities shall be made except by means of a prospectus meeting the requirements of Section 10 of the Securities Act of 1933, as amended.   Important Additional Information about the Transaction and Where To Find It   The proposed transaction will be submitted to the stockholders of Synaptics for their consideration. In connection with the proposed transaction, on August 21, 2026, onsemi filed with the SEC a Registration Statement on Form S-4 that included a proxy statement of Synaptics and that also constituted a prospectus of onsemi. Each of Synaptics and onsemi will provide the proxy statement/prospectus to Synaptics stockholders. These materials are not yet finaland will be amended. Synaptics and onsemi also plan to file other documents with the SEC regarding the proposed transaction. This document is not a substitute for any prospectus, proxy statement or any other document which Synaptics or onsemi may file with the SEC in connection with the proposed transaction. INVESTORS AND SECURITY HOLDERS ARE URGED TO READ THE PROXY STATEMENT/PROSPECTUS AND ANY OTHER RELEVANT DOCUMENTS THAT WILL BE FILED WITH THE SEC CAREFULLY AND IN THEIR ENTIRETY WHEN THEY BECOME AVAILABLE BECAUSE THEY WILL CONTAIN IMPORTANT INFORMATION ABOUT THE PROPOSED TRANSACTION. You may obtain copies of all documents filed with the SEC regarding this transaction, free of charge, at the SEC’s website (www.sec.gov). In addition, investors and stockholders will be able to obtain free copies of the proxy statement/prospectus and other documents filed with the SEC by the parties on Synaptics Investor Relations at https://investor.synaptics.com/ (for documents filed with the SEC by Synaptics) or onsemi Investor Relations at https://investor.onsemi.com/ (for documents filed with the SEC by onsemi). 
 

 Cautionary Information  Participants in the Solicitation  Synaptics, onsemi, and certain of their respective directors, executive officers and other members of management and employees, under SEC  rules may be deemed to be participants in the solicitation of proxies from Synaptics stockholders in connection with the proposed transaction.  Information regarding the persons who may, under the rules of the SEC, be deemed participants in the solicitation of Synaptics stockholders in  connection with the proposed transaction, and a description of their direct and indirect interests, by security holdings or otherwise, will be set forth  in the proxy statement/prospectus that will be provided to Synaptics stockholders. You can find more detailed information about Synaptics’ executive officers and directors under the headings “Proposal 1 – Election of Directors,” “Director Compensation,” “Compensation Discussion and Analysis,” “Named Executive Officer Compensation Tables,” “CEO Pay Ratio Disclosure,” “Pay Versus Performance Disclosure” and “Beneficial Ownership of  Certain Stockholders” in its definitive proxy statement filed with the SEC on September 16, 2025. To the extent holdings of Synaptics common  stock by the directors and executive officers of Synaptics have changed from the amounts of Synaptics common stock held by such persons as  reflected therein, such changes have been or will be reflected on Statements of Change in Ownership on Form 4 filed with the SEC, which are  available at https://www.sec.gov/edgar/browse/?CIK=817720&owner=exclude under the tab “Ownership Disclosures”. You can find more  detailed information about onsemi’s executive officers and directors under the headings “The Board of Directors and Corporate Governance,”  “Compensation of Executive Officers” and “Stock Ownership” in its definitive proxy statement filed with the SEC on April 2, 2026. To the extent  holdings of onsemi common stock by the directors and executive officers of onsemi have changed from the amounts of onsemi common stock  held by such persons as reflected therein, such changes have been or will be reflected on Statements of Change in Ownership on Form 4 filed  with the SEC, which are available at https://www.sec.gov/edgar/browse/?CIK=1097864&owner=exclude under the tab “Ownership  Disclosures”. Additional information about Synaptics’ executive officers and directors and onsemi’s executive officers and directors can be found  in the above-referenced Registration Statement on Form S-4. 
 

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