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Tower Semiconductor Ltd SEC Filings

TSEM NASDAQ

Tower Semiconductor Ltd. filings document a foreign private issuer operating as a specialty semiconductor foundry. Its Form 6-K current reports record financial-results announcements, investor-conference communications, credit-rating updates, technology-platform releases and customer or partner developments involving analog, power-management, silicon photonics and SiGe processes.

The filings also provide public-company disclosure around material events, operating and financial results, capital structure, governance matters and risk factors. Company descriptions in the filings identify Tower's customizable process platforms, design enablement and process-transfer services, and its manufacturing footprint across Israel, the United States, Japan through TPSCo, and a shared 300mm facility in Agrate, Italy with STMicroelectronics.

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T. Rowe Price Associates, Inc. filed a Schedule 13G reporting beneficial ownership of 7,388,751 shares of Tower Semiconductor Ltd common stock, representing 6.6% of the class as of 03/31/2026. The filing shows sole voting power of 7,129,804 shares. The filer includes a statement denying beneficial ownership in the submission.

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Tower Semiconductor Ltd. reports multi-year growth commitments in its silicon photonics business. The company has signed Silicon Photonics (SiPho) contracts targeted to generate $1.3 billion of 2027 revenue with its largest customers and has already received $290 million in customer prepayments for capacity reservations.

The contracts are complemented by an even larger wafer commitment for 2028, with additional prepayments due by January 2027. Tower links these agreements and an ongoing global capacity ramp to its 2028 business model of $2.8 billion revenue and $750 million net profit, centered on high-performance optical connectivity and AI-related applications.

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Tower Semiconductor Ltd. reports multi-year growth commitments in its silicon photonics business. The company has signed Silicon Photonics (SiPho) contracts targeted to generate $1.3 billion of 2027 revenue with its largest customers and has already received $290 million in customer prepayments for capacity reservations.

The contracts are complemented by an even larger wafer commitment for 2028, with additional prepayments due by January 2027. Tower links these agreements and an ongoing global capacity ramp to its 2028 business model of $2.8 billion revenue and $750 million net profit, centered on high-performance optical connectivity and AI-related applications.

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Tower Semiconductor reported strong first quarter 2026 results with revenue of $413.6 million, up 15% from the first quarter of 2025. Gross profit rose to $111.0 million and operating profit nearly doubled to $64.6 million, reflecting improved profitability. Net profit attributable to the company increased to $65.0 million, or $0.58 basic earnings per share, compared with $40.1 million and $0.36 a year earlier.

The company generated $509.9 million in net cash from operating activities in the quarter, helped by significant silicon photonics customer prepayments and invested $156.4 million in property and equipment. For the second quarter of 2026, Tower guides revenue of $455 million, a company record, implying 22% year-over-year and 10% sequential growth, and targets continued margin expansion through 2026.

Management highlighted growing demand for its analog and silicon photonics technologies, including $1.3 billion of contracted silicon photonics revenue for 2027, and reiterated long-term financial goals of $2.8 billion in annual revenue and $750 million in net profit in 2028. The company’s local S&P affiliate reaffirmed its "ilAA" credit rating and raised the outlook to positive.

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Tower Semiconductor reported strong first quarter 2026 results with revenue of $413.6 million, up 15% from the first quarter of 2025. Gross profit rose to $111.0 million and operating profit nearly doubled to $64.6 million, reflecting improved profitability. Net profit attributable to the company increased to $65.0 million, or $0.58 basic earnings per share, compared with $40.1 million and $0.36 a year earlier.

The company generated $509.9 million in net cash from operating activities in the quarter, helped by significant silicon photonics customer prepayments and invested $156.4 million in property and equipment. For the second quarter of 2026, Tower guides revenue of $455 million, a company record, implying 22% year-over-year and 10% sequential growth, and targets continued margin expansion through 2026.

Management highlighted growing demand for its analog and silicon photonics technologies, including $1.3 billion of contracted silicon photonics revenue for 2027, and reiterated long-term financial goals of $2.8 billion in annual revenue and $750 million in net profit in 2028. The company’s local S&P affiliate reaffirmed its "ilAA" credit rating and raised the outlook to positive.

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Tower Semiconductor Ltd. reported that Standard & Poor’s Maalot completed its annual review and reaffirmed the company’s corporate credit rating at “ilAA”. The rating outlook was raised from Stable Outlook to Positive Outlook, indicating the agency now sees stronger prospects for the company’s future credit profile. The official Hebrew rating report was filed with the Israel Securities Authority and the Tel Aviv Stock Exchange, and an unofficial English translation is available on Tower Semiconductor’s investor relations webpage.

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Tower Semiconductor Ltd. filed a Form 6-K noting that company representatives will participate in several investor conferences during May and June. These events will offer opportunities for one-on-one meetings between investors and Tower’s representatives, arranged through conference organizers or the company’s investor relations contacts.

The company describes itself as a leading foundry of high-value analog semiconductor solutions, serving markets including consumer, industrial, automotive, mobile, infrastructure, medical, and aerospace and defense. It operates fabrication facilities in Israel, the U.S., Japan through TPSCo, and shares a 300mm facility in Agrate, Italy with STMicroelectronics.

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Tower Semiconductor Ltd. files its annual report detailing operations, strategy and key risks for the year ended December 31, 2025. The company operates specialty semiconductor fabs in Israel, the U.S., Japan and Italy, focused on SiPho, SiGe, power, RF and image-sensor technologies.

Tower plans an aggregate $920 million in capital expenditures, mainly to expand silicon photonics and silicon germanium capacity and other next‑generation capabilities, while acknowledging uncertainty around tool installation timing and future demand. A strategic restructuring in Japan will transfer full ownership of 300mm Fab 7 to Tower and 200mm Fab 5 to Nuvoton’s Japanese unit, with mutual long‑term supply agreements and a targeted closing of April 1, 2027, subject to customary conditions and approvals.

The report highlights exposure to regional conflicts affecting Israeli operations, customer concentration, cyclical demand—especially for AI‑related wafers—equipment and materials supply risks, and approximately $161 million of consolidated debt as of December 31, 2025. Tower states it does not expect to pay dividends in the foreseeable future, prioritizing growth investments and potential capacity expansion over cash distributions.

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Tower Semiconductor and Axiro Semiconductor have introduced high-power, high-efficiency Silicon Germanium (SiGe) radar beamforming integrated circuits that are fabricated in Tower’s U.S. facilities. The chips target secure, domestically sourced U.S. defense radar and satcom systems and are described as ramping to volume production.

The new Ku- and X-band BFICs are designed to improve key metrics such as gain, linearity, output power, efficiency and fast switching, supporting demanding modern radar requirements for U.S. defense primes and radar manufacturers. Tower highlights its established aerospace and defense presence and its SiGe technology as a foundation for scalable, mission-critical defense solutions.

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Tower Semiconductor Ltd. filed a Form 6-K to announce the timing of its first quarter 2026 financial results and related conference call. The company plans to issue its Q1 2026 earnings release on Wednesday, May 13, 2026, followed by a conference call at 10:00 a.m. Eastern Time, which will include second quarter 2026 guidance.

The call will be webcast via the Investor Relations section of Tower Semiconductor’s website, with advance online registration required to receive dial-in details and a unique PIN. A replay of the teleconference will be available for 90 days, allowing broad access to the discussion of results and outlook.

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Tower Semiconductor plans a major expansion of its 300mm manufacturing capacity in Japan as part of a strategic restructuring of its TPSCo joint venture with Nuvoton. Tower will take full ownership of the 300mm Fab 7 through a wholly owned Japanese subsidiary, while Nuvoton’s subsidiary will own the 200mm Fab 5.

The companies will sign mutual long-term supply agreements so existing Tower customers at Fab 5 and Nuvoton customers at Fab 7 continue to receive uninterrupted supply. Subject to customary conditions and regulatory approvals, the transaction is targeted to close on April 1, 2027.

Tower targets combined capacity at its existing 300mm facility in Uozu and an intended adjacent expansion to reach four times current 300mm capacity. The expansion, supported by an option to buy the Fab 7 building and land and contingent METI-backed subsidy for adjacent land, is intended to scale its optical and photonics platforms while keeping the fab cash-from-operations positive during the build-out.

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Tower Semiconductor plans a major expansion of its 300mm manufacturing capacity in Japan as part of a strategic restructuring of its TPSCo joint venture with Nuvoton. Tower will take full ownership of the 300mm Fab 7 through a wholly owned Japanese subsidiary, while Nuvoton’s subsidiary will own the 200mm Fab 5.

The companies will sign mutual long-term supply agreements so existing Tower customers at Fab 5 and Nuvoton customers at Fab 7 continue to receive uninterrupted supply. Subject to customary conditions and regulatory approvals, the transaction is targeted to close on April 1, 2027.

Tower targets combined capacity at its existing 300mm facility in Uozu and an intended adjacent expansion to reach four times current 300mm capacity. The expansion, supported by an option to buy the Fab 7 building and land and contingent METI-backed subsidy for adjacent land, is intended to scale its optical and photonics platforms while keeping the fab cash-from-operations positive during the build-out.

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Tower Semiconductor reported a framework agreement with Nuvoton’s subsidiary NTCJ to strategically restructure their joint venture TPSCo. Tower currently owns 51% of TPSCo, which operates a 12‑inch fab in Uozu and an 8‑inch fab in Tonami, Japan.

Upon closing, Tower will gain full ownership and operational control of TPSCo’s 12‑inch fab and foundry business. The 8‑inch fab and foundry business will remain in TPSCo, which will become a wholly owned NTCJ subsidiary, with NTCJ paying $25 million to Tower at closing.

The parties plan to maintain uninterrupted customer support, operations, development programs, and employee stability, and will provide production services to each other to support existing products. The transaction is intended to better align assets with each company’s long‑term strategy and strengthen competitiveness, and is expected to close on April 1, 2027, subject to customary conditions and regulatory approvals.

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Tower Semiconductor reported a framework agreement with Nuvoton’s subsidiary NTCJ to strategically restructure their joint venture TPSCo. Tower currently owns 51% of TPSCo, which operates a 12‑inch fab in Uozu and an 8‑inch fab in Tonami, Japan.

Upon closing, Tower will gain full ownership and operational control of TPSCo’s 12‑inch fab and foundry business. The 8‑inch fab and foundry business will remain in TPSCo, which will become a wholly owned NTCJ subsidiary, with NTCJ paying $25 million to Tower at closing.

The parties plan to maintain uninterrupted customer support, operations, development programs, and employee stability, and will provide production services to each other to support existing products. The transaction is intended to better align assets with each company’s long‑term strategy and strengthen competitiveness, and is expected to close on April 1, 2027, subject to customary conditions and regulatory approvals.

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FAQ

How many Tower Semiconductor (TSEM) SEC filings are available on StockTitan?

StockTitan tracks 38 SEC filings for Tower Semiconductor (TSEM), including 10-K annual reports, 10-Q quarterly reports, 8-K current reports, and Form 4 insider trading disclosures. Each filing includes AI-generated summaries, impact scoring, and sentiment analysis.

When was the most recent SEC filing for Tower Semiconductor (TSEM)?

The most recent SEC filing for Tower Semiconductor (TSEM) was filed on May 15, 2026.