Welcome to our dedicated page for Taiwan Semi SEC filings (Ticker: TSM), a comprehensive resource for investors and traders seeking official regulatory documents including 10-K annual reports, 10-Q quarterly earnings, 8-K material events, and insider trading forms.
The Taiwan Semiconductor Manufacturing Company Limited (TSMC) (NYSE: TSM) SEC filings page on Stock Titan provides access to the company’s U.S. regulatory disclosures as a foreign private issuer. TSMC files an annual report on Form 20-F with the Securities and Exchange Commission, which contains audited financial statements and detailed information about its operations as a dedicated semiconductor foundry headquartered in Hsinchu, Taiwan. The company also furnishes frequent Form 6-K reports that include monthly revenue data, capital and financing updates, and other material information.
TSMC’s 6-K filings often present consolidated revenue figures for specific months and year-to-date periods, along with tables detailing funds lent to subsidiaries, endorsements and guarantees for entities such as TSMC North America, TSMC Global, TSMC Arizona, and TSMC China, and disclosures on financial derivative transactions. Other 6-Ks report capital appropriations for machinery and equipment for advanced technology and packaging capacity, real estate and R&D investments, unsecured bond issuances in New Taiwan dollars, and changes in share capital such as the cancellation of reclaimed employee restricted stock awards.
Some 6-K submissions also include media statements and governance updates, such as legal actions related to trade secrets and non-compete agreements involving former executives, or shareholder resolutions and director elections at major subsidiaries like TSMC Arizona Corporation. These filings help investors understand how TSMC manages intellectual property protection, subsidiary governance, and expansion of its manufacturing footprint.
On Stock Titan, TSMC’s SEC filings are accompanied by AI-powered summaries that highlight the key points of each document, helping readers interpret lengthy tables and technical language. Users can quickly identify revenue trends from monthly reports, review details of bond offerings and capital spending plans, and see how derivative positions and guarantees evolve over time. This page is a central resource for tracking TSMC’s 20-F annual reports, 6-K current reports, and other SEC disclosures relevant to the company’s semiconductor foundry operations and financial structure.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD executive files initial ownership report showing existing holdings rather than new trades. SVP and Deputy Co-COO Hou Yung-Chin reports direct ownership of 662,403 Common Shares (2330.TW), plus indirect interests through employee plans and family.
The filing lists 7,130 Common Shares held through an Employee Stock Purchase Plan trust and 20,190 Common Shares held by a trust funded under the Long-Term Incentive Bonus Plan, where he has investment control. A further 60,802 Common Shares are reported as indirectly owned through his spouse.
Taiwan Semiconductor Manufacturing Co. Ltd. senior vice president and general counsel Fang Shu-Hua has filed an initial ownership report showing substantial holdings of the company’s common shares. The filing lists 858,392 common shares held directly.
In addition, the report discloses indirect ownership of common shares through several channels: an Employee Stock Purchase Plan trust, a Long-Term Incentive bonus plan trust, the filer’s spouse, an immediate family member, and entities named Ming Yuan Capital Co., Ltd. and Ming Jing Capital Co., Ltd. The entry reflects existing ownership positions rather than new reported purchases or sales.
Taiwan Semiconductor Manufacturing Co. Ltd. senior vice president Ho Li-Mei filed an initial statement of beneficial ownership of common shares. The filing reports direct ownership of 4,644,012 common shares (2330.TW), plus indirect holdings of 9,203 shares through an ESPP trust, 20,190 shares through an LTI bonus plan trust, and 2,039,530 shares held by a spouse.
Footnotes explain that the ESPP position consists of shares purchased and held under the company’s Employee Stock Purchase Plan, while the LTI trust shares were bought with cash from the Long-Term Incentive Bonus Plan, over which the filer has investment control.
Taiwan Semiconductor Manufacturing Co. senior vice president Tzonz‑Sheng Chang has filed a Form 3 reporting his share holdings. He directly holds 317,638 Common Shares (2330.TW), plus 5,146 shares held by an Employee Stock Purchase Plan trust and 10,581 shares held by a Long-Term Incentive bonus plan trust.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD Controller Chih-Ho Chen filed an initial statement of beneficial ownership of the company’s common shares. The Form 3 shows direct ownership of 5,259 common shares, plus indirect ownership of 363 common shares held by a spouse and 8,000 common shares held through Homewarm Advisory Co., Ltd. This filing establishes the controller’s equity position across both personal and related-entity holdings as of the reported date, without reporting any new share purchases or sales.
Taiwan Semiconductor Manufacturing Co. Ltd. VP Chuang Juiping has filed an initial Form 3 detailing existing ownership in the company. The filing shows direct ownership of 239,738 Common Shares (2330.TW) and 50 American Depositary Shares, each representing five Common Shares.
The disclosure also lists indirect interests, including Common Shares held through an Employee Stock Purchase Plan trust, a Long-Term Incentive bonus plan trust, and by the reporting person’s spouse. This Form 3 records current beneficial ownership and does not reflect new purchases or sales.
Taiwan Semiconductor Manufacturing Co. Ltd. VP Chen Pei-Hung filed an initial Form 3 reporting existing ownership of the company’s common shares. The filing does not show any recent buy or sell transactions; it simply establishes Chen’s current holdings.
Chen directly owns 433,414 common shares. In addition, there are indirect holdings, including 1,107 common shares held through an Employee Stock Purchase Plan trust, 7,036 common shares held by a trust funded through the Long-Term Incentive Bonus Plan over which Chen has investment control, and 83,143 common shares held by Chen’s spouse.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Hsu Kuo-Chin has filed an initial statement of beneficial ownership, reporting equity holdings in both common shares and American Depositary Shares. This Form 3 does not show any new buy or sell transactions; it records existing positions as of the reported date.
He directly holds 178,924 Common Shares (2330.TW) and 6,050 American Depositary Shares (TSM). He also has indirect interests in 6,393 common shares through an Employee Stock Purchase Plan trust, 7,036 common shares through a Long-Term Incentive trust, and 12,000 common shares held by his spouse. In addition, his spouse holds 1,988 American Depositary Shares. A footnote states that each American Depositary Share represents five Common Shares.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD executive Chin Yung-Pei, EVP and Co-COO, filed an initial ownership statement reporting common share holdings. The filing lists 5,171,935 common shares held directly, plus indirect interests of 8,059 shares through an ESPP trust, 63,345 shares through a Long-Term Incentive trust, and 4,190,107 shares held by a spouse.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD SVP and CFO Jen-Chau Huang has filed an initial ownership report on Form 3. The filing shows direct ownership of 1,811,543 Common Shares (2330.TW), plus 3,399 shares held indirectly through an Employee Stock Purchase Plan trust and 20,190 shares held indirectly through a Long-Term Incentive bonus plan trust.