Welcome to our dedicated page for Taiwan Semi SEC filings (Ticker: TSM), a comprehensive resource for investors and traders seeking official regulatory documents including 10-K annual reports, 10-Q quarterly earnings, 8-K material events, and insider trading forms.
Finding the EUV spending details or wafer-capacity outlook in TSMC’s 300-page reports can feel overwhelming. From multi-layer risk factors on geopolitical supply chains to intricate revenue splits by process node, TSMC’s disclosures run deep. That complexity is why investors search for "TSMC SEC filings explained simply" and why this page exists.
Stock Titan’s AI reads every 10-K, 10-Q, 8-K, and Form 4 the moment it hits EDGAR, then surfaces what matters. Need the TSMC quarterly earnings report 10-Q filing without combing through accounting footnotes? Our summaries highlight ASP trends and cap-ex shifts in plain English. Curious about TSMC insider trading Form 4 transactions? Real-time alerts flag each director’s trade, so you track TSMC Form 4 insider transactions real-time and catch patterns early. Even complex events—think fab outages or new 3 nm ramp updates—come with a plain-language card: “TSMC 8-K material events explained.”
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- TSMC annual report 10-K simplified – node road-map, customer concentration, geopolitical risk.
- TSMC earnings report filing analysis – quarter-over-quarter yield and margin trends.
- TSMC executive stock transactions Form 4 – understand leadership sentiment before earnings.
- TSMC proxy statement executive compensation – see how bonuses tie to wafer yields.
Whether you’re understanding TSMC SEC documents with AI for strategic supply-chain insight or monitoring chip-industry sentiment, Stock Titan turns dense disclosures into actionable knowledge—saving hours and sharpening decisions.
Taiwan Semiconductor Manufacturing Company (NYSE: TSM) filed a Form 6-K for June 2025 detailing corporate actions taken during May 2025.
Capital appropriations dominate the report: the board approved US$15.248 billion of new spending, including US$9.590 billion for advanced-node production equipment, US$308 million for advanced packaging and specialty processes, and US$5.350 billion for real-estate and leased assets. These investments signal continued capacity expansion to meet leading-edge demand.
The filing also discloses NT$16.3 billion in fixed-income asset purchases and NT$0.4 billion in dispositions, illustrating ongoing treasury management.
Insider ownership changes were minor: Senior Vice President Wei-Jen Lo reduced holdings by 5,000 shares, while Vice President Jonathan Lee added 1,234 shares; no pledges were reported.
The board cancelled 117,721 common shares reclaimed from lapsed employee restricted-stock awards, reducing paid-in capital by NT$1,177,210. No unsecured bonds were issued during the period.
Taiwan Semiconductor Manufacturing Company (NYSE:TSM) filed a Form 6-K for June 2025 reporting an internal capital move. A written resolution of wholly-owned subsidiary TSMC Global Ltd., dated 25 June 2025, authorized the issuance of 10,000 new shares with a par value of US$1,000,000 each to the parent company. The transaction adds up to US$10 billion of additional paid-in capital at the subsidiary level, strengthening its balance sheet without introducing external investors or shareholder dilution at the TSM level.
No other material events, financial statements, risk factors, legal proceedings, or management changes are disclosed in the submission. The report was signed by Senior Vice President & CFO Wendell Huang on behalf of the registrant.
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