Welcome to our dedicated page for Taiwan Semi SEC filings (Ticker: TSM), a comprehensive resource for investors and traders seeking official regulatory documents including 10-K annual reports, 10-Q quarterly earnings, 8-K material events, and insider trading forms.
Finding the EUV spending details or wafer-capacity outlook in TSMC’s 300-page reports can feel overwhelming. From multi-layer risk factors on geopolitical supply chains to intricate revenue splits by process node, TSMC’s disclosures run deep. That complexity is why investors search for "TSMC SEC filings explained simply" and why this page exists.
Stock Titan’s AI reads every 10-K, 10-Q, 8-K, and Form 4 the moment it hits EDGAR, then surfaces what matters. Need the TSMC quarterly earnings report 10-Q filing without combing through accounting footnotes? Our summaries highlight ASP trends and cap-ex shifts in plain English. Curious about TSMC insider trading Form 4 transactions? Real-time alerts flag each director’s trade, so you track TSMC Form 4 insider transactions real-time and catch patterns early. Even complex events—think fab outages or new 3 nm ramp updates—come with a plain-language card: “TSMC 8-K material events explained.”
Here’s what you’ll uncover:
- TSMC annual report 10-K simplified – node road-map, customer concentration, geopolitical risk.
- TSMC earnings report filing analysis – quarter-over-quarter yield and margin trends.
- TSMC executive stock transactions Form 4 – understand leadership sentiment before earnings.
- TSMC proxy statement executive compensation – see how bonuses tie to wafer yields.
Whether you’re understanding TSMC SEC documents with AI for strategic supply-chain insight or monitoring chip-industry sentiment, Stock Titan turns dense disclosures into actionable knowledge—saving hours and sharpening decisions.
Taiwan Semiconductor Manufacturing Company Limited reported corporate actions for August 2025 covering changes in shareholdings, pledges, asset transactions, capital appropriations, unsecured bonds, and share cancellations. There were no reported changes in board/executive shareholdings or pledges, no unsecured bonds issued, and no share cancellations. The company recorded a NT$13.5 billion fixed-income investment acquisition. The board approved material capital appropriations: US$7.8 billion for machinery for advanced technology capacity, US$2.0 billion for machinery for advanced packaging/mature/specialty capacity, and US$10.9 billion for real estate and capitalized leased assets.
Taiwan Semiconductor Manufacturing Company Limited filed a Form 6-K reporting several corporate actions for July 2025. The company disclosed no changes in share pledges by directors, officers or >10% shareholders and no capital appropriations approved by the board. TSMC recorded fixed-income investments of NT$10.2 billion acquired and NT$0.4 billion disposed during the month. The report lists items on shareholdings, pledge changes, asset transactions, capital appropriations, unsecured bonds and share cancellations, but the section on unsecured bonds appears incomplete in the provided text.
Taiwan Semiconductor Manufacturing Company Limited disclosed that TSMC Global Ltd.'s board adopted a written-consent resolution on August 12, 2025 to approve a capital increase of not more than US$10 billion to be contributed by Taiwan Semiconductor Manufacturing Co., Ltd. The action is conditional and subject to approval of the competent authorities. The filing identifies this decision as a board-level corporate action taken without a meeting and does not include financial statements, timing, or further transactional details.
TSMC reported strong second-quarter and six-month results and approved major capital actions to support long-term capacity. Second-quarter consolidated revenue was NT$933.79 billion with net income of NT$398.27 billion and diluted EPS of NT$15.36. The Board approved a NT$5.0 per share cash dividend, with record date set for December 17, 2025 and dividend payment on January 8, 2026.
The Board also approved significant funding and financing measures: capital appropriations of approximately US$20,657.50 million for capacity, packaging and fab construction; issuance of unsecured domestic bonds up to NT$60 billion to finance expansion and green initiatives; and a capital injection of up to US$10 billion to TSMC Global to address foreign-exchange hedging costs. Six-month consolidated figures (TIFRS) include net sales of 1,773,045,533 (in NT$ thousands) and net income of 758,226,085 (in NT$ thousands), with basic EPS of NT$29.31.
TSMC’s July 2025 6-K highlights continued top-line momentum. Consolidated revenue reached NT$323.17 bn, up 22.5% versus June and 25.8% year-on-year. Cumulative Jan-Jul revenue climbed to NT$2,096.21 bn, a 37.6% YoY increase, underscoring robust demand for the foundry’s advanced process nodes.
Liquidity activities remain routine and intra-group focused. Subsidiary lending outstanding totaled NT$15.95 bn (TSMC China NT$14.15 bn; TSMC Development NT$1.80 bn) against board-approved limits of about NT$137 bn. Guarantees to wholly-owned units stood at NT$554.34 bn, well below the aggregate limit of NT$2.50 tn.
Derivative positions were sizeable but manageable: the parent company carried NT$118.40 bn notional forward contracts with an unrealized loss of NT$3.88 bn; other subsidiaries recorded minor unrealized losses. No hedge-accounted contracts show material mark-to-market impact.
No major transactions, earnings guidance, or management changes were disclosed.
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