STOCK TITAN

Notifications

Limited Time Offer! Get Platinum at the Gold price until January 31, 2026!

Sign up now and unlock all premium features at an incredible discount.

Read more on the Pricing page

[6-K] TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD Current Report (Foreign Issuer)

Filing Impact
(Low)
Filing Sentiment
(Neutral)
Form Type
6-K
Rhea-AI Filing Summary

Taiwan Semiconductor Manufacturing Company Limited reported corporate actions for August 2025 covering changes in shareholdings, pledges, asset transactions, capital appropriations, unsecured bonds, and share cancellations. There were no reported changes in board/executive shareholdings or pledges, no unsecured bonds issued, and no share cancellations. The company recorded a NT$13.5 billion fixed-income investment acquisition. The board approved material capital appropriations: US$7.8 billion for machinery for advanced technology capacity, US$2.0 billion for machinery for advanced packaging/mature/specialty capacity, and US$10.9 billion for real estate and capitalized leased assets.

Positive
  • Board-approved capital appropriations totaling US$20.7 billion for technology, packaging, and real estate indicate planned capacity expansion
  • NT$13.5 billion fixed-income investment acquisition shows active deployment of cash/liquid assets
  • No reported share pledges, unsecured bond issues, or share cancellations — no immediate dilution or new leverage disclosed
Negative
  • None.

Insights

TL;DR: Board-approved capital appropriations total ~US$20.7B, indicating significant investment in capacity expansion and property.

The board's approval of US$7.8B for advanced technology machinery, US$2.0B for packaging/mature/specialty machinery, and US$10.9B for real estate/leased assets represents a large, multi-year capital commitment. These appropriations are material relative to typical semiconductor capex cycles and signal continued capacity build-out. The NT$13.5B fixed-income acquisition is a modest liquidity deployment likely aimed at short-to-medium-term investment of cash balances. No share pledges, unsecured bond issues, or share cancellations were reported, so there are no immediate financing or capital-structure changes disclosed.

TL;DR: Routine corporate disclosures show substantial capital approvals but no governance shifts or insider share changes.

The filing is a standard reporting of board decisions and transactions. The absence of changes in director/executive shareholdings or share pledges reduces governance-related investor concerns. Capital appropriation approvals are significant in size but were presented without timing, funding sources, or phased schedules in this filing, limiting clarity on near-term cash flows and authorization structure. No unsecured bonds or share cancellations were disclosed, so capital structure remains unchanged by this report.


1934 Act Registration No. 1-14700
UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
_____________________________
FORM 6-K
_____________________________
REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER
THE SECURITIES EXCHANGE ACT OF 1934
For the month of September 2025
(Commission File Number: 001-14700)
_____________________________
Taiwan Semiconductor Manufacturing Company Limited
(Translation of Registrant’s Name Into English)
_____________________________
No. 8, Li-Hsin Road 6
Hsinchu Science Park
Hsinchu 300-096, Taiwan
Republic of China
(Address of Principal Executive Offices)
_____________________________
Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F  x            Form 40-F  o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):o



SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.


Taiwan Semiconductor Manufacturing Company Limited
Date:   September 25, 2025By/s/ Wendell Huang
Wendell Huang
Senior Vice President and Chief Financial Officer
   




Taiwan Semiconductor Manufacturing Company Limited
("TSMC"; NYSE: TSM)
This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors; 5) the unsecured bonds issued by TSMC and its subsidiaries and 6) the cancellation of TSMC common shares for the month of August 2025.
1.The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
TitleNameNumber of shares held as ofChanges
7/31/20258/31/2025
Vice PresidentJonathan Lee459,872460,225353 

Note: Shareholdings include shares held by the related parties.
2.The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC: None.
3.The acquisition and disposition of assets by TSMC and its subsidiaries:
Fixed-income investment: NT$13.5 billion of acquisition.
4.The capital appropriations approved by TSMC board of directors:
(1) Machinery equipment for advanced technology capacity: US$7.8 billion.
(2) Machinery equipment for advanced packaging, mature and/or specialty technology capacity: US$2.0 billion.
(3) Real estate and capitalized leased assets: US$10.9 billion.
5.The unsecured bonds issued by TSMC and its subsidiaries: None.
6.The cancellation of TSMC common shares: None.

FAQ

What capital appropriations did TSM approve in this filing?

The board approved US$7.8 billion for advanced technology machinery, US$2.0 billion for advanced packaging/mature/specialty machinery, and US$10.9 billion for real estate and capitalized leased assets.

Did TSM report any changes in director or executive shareholdings?

No. The filing states there were no changes in the shareholdings of the board of directors or executive officers.

Were any unsecured bonds issued by TSM or its subsidiaries?

No. The filing explicitly reports none for unsecured bonds issued by TSMC and its subsidiaries.

Did TSM cancel any common shares in August 2025?

No. The filing indicates there were no cancellations of TSM common shares for the month.

What asset acquisition did TSM disclose?

TSMC disclosed a fixed-income investment acquisition of NT$13.5 billion.
Taiwan Semi

NYSE:TSM

TSM Rankings

TSM Latest News

TSM Latest SEC Filings

TSM Stock Data

1.44T
5.18B
0.04%
16.42%
0.48%
Semiconductors
Technology
Link
Taiwan
Hsinchu City