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Taiwan Semiconductor Manufacturing Co Ltd reports that VP Liaw Yung-Haw submitted a Form 4 indicating no reportable insider share transactions. The report notes that Liaw retired on August 5, 2026 and is no longer subject to Section 16 insider reporting requirements.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Bor-Zen Tien bought 1,000 Common Shares (2330.TW) on August 3, 2026 at $73.0600 per share, translated from NT$2,370 at NT$32.438 to US$1. He now directly holds 14,051 common shares and 132 American Depositary Shares, plus indirect interests through an ESPP trust, spouse and an immediate family member.
Director Tseng Fang Churng of Taiwan Semiconductor Manufacturing reported two bona fide gift transactions in Common Shares (2330.TW) dated July 31, 2026. He disposed of 5,000,000 directly held shares and acquired 5,000,000 shares reported as held indirectly “By Spouse.”
After these movements, his direct holdings are 24,472,675 shares and indirect spousal holdings are 10,132,855 shares. The date reflects submission of the share gifting application to a brokerage firm; the actual stock transfer may take a few days to complete.
Tien Bor-Zen, a vice president of Taiwan Semiconductor Manufacturing, reported multiple stock purchases on July 28, 2026. He bought 15 American Depositary Shares at $390 each and 1,000 common shares at $67.9700 per share. After these trades he reported 13,051 common shares held directly, plus indirect family holdings through a spouse, an ESPP trust, and an immediate family member. These purchases were not marked as made under a Rule 10b5-1 trading plan.
Taiwan Semiconductor Manufacturing Company Limited reports June 2026 updates on insider shareholdings and asset transactions. Vice President Arthur Chuang’s holdings decreased by 1,000,000 shares, from 4,488,305 as of May 31, 2026 to 3,488,305 as of June 30, 2026.
Vice Presidents B.Z. Tien and Lipen Yuan each increased their holdings by 2,000 shares, to 13,051 and 6,650 shares, respectively, including shares held by related parties. The company records fixed-income investment acquisitions of NT$11.6 billion and dispositions of NT$0.4 billion, and notes no changes in share pledges, no capital appropriations, no unsecured bonds, and no cancellation of common shares for June 2026.
Taiwan Semiconductor Manufacturing Co. Ltd. VP Bor-Zen Tien reported a series of purchase transactions. On 2026-07-21, he bought 1,000 Common Shares (2330.TW) directly at a price of 74.13 per share, bringing his direct common-share holdings to 13,051. On the same date, he also reported spouse-held purchases of 3,000 Common Shares in three 1,000-share blocks at prices of 73.98, 74.44, and 74.75 per share, all as indirect ownership "By Spouse." As of 2026-07-21 he additionally held 228 Common Shares indirectly through an ESPP trust and 73 Common Shares through an immediate family member. On 2026-07-20, he purchased 10 American Depositary Shares (TSM) at a price of 405 per ADS, increasing his direct ADS position to 117 ADSs, with each ADS representing five Common Shares. The filing does not indicate that these purchases were made under a Rule 10b5-1 trading plan.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Lin Shyue-Shyh reported open-market purchases of a total of 2,000 Common Shares (2330.TW), buying 1,000 shares at $72.65 on July 20, 2026 and 1,000 shares at $74.13 on July 21, 2026. The U.S. dollar prices were translated from New Taiwan dollar amounts. Lin also reports indirect holdings of 249 shares held through an ESPP trust and 5,000 shares held by a spouse.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD vice president Shyue-Shyh Lin reported purchasing 3,000 Common Shares (2330.TW) on July 19, 2026, in three open-market or private transactions at per-share prices between US$71.32 and US$72.10, translated from New Taiwan dollars at NT$32.248 to US$1.
The report also shows indirect holdings of 5,000 common shares by his spouse and 249 common shares held indirectly through an Employee Stock Purchase Plan trust.
Taiwan Semiconductor Manufacturing Company Limited reported second quarter 2026 consolidated revenue of NT$1,270.38 billion (US$40.20 billion), net income of NT$706.56 billion, and diluted EPS of NT$27.25, or US$4.31 per ADR unit. Year-over-year, revenue rose 36.0%, while net income and EPS increased 77.4%. Compared with first quarter 2026, revenue grew 12.0% and net income 23.4%. All figures are prepared in accordance with TIFRS on a consolidated basis.
Profitability was high, with gross margin of 67.7%, operating margin of 60.3%, and net profit margin of 55.6%. Advanced technologies at 7-nanometer and below contributed 77% of wafer revenue, including 2-nanometer at 3%, 3-nanometer at 30%, and 5-nanometer at 33%. Cash from operating activities reached NT$783.36 billion, funding NT$496.00 billion of capital expenditures and NT$155.59 billion of cash dividends, for free cash flow of NT$287.36 billion. Management expects third quarter 2026 revenue between US$44.6 billion and US$45.8 billion, with gross margin of 65–67% and operating margin of 56–58%, and projects 2026 revenue growth slightly above 40% in US dollar terms.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD Controller Chen Chih-Ho reported small offsetting trades in Common Shares (2330.TW) held indirectly through a spouse. On 2026-07-13, the spouse account bought 50 shares at $74.60 per share; on 2026-07-14 it sold 50 shares at $75.22 per share. Net shares in that account were unchanged, with 363 shares remaining after the sale.
Chen also reported indirect holdings of 8,000 shares through Homewarm Advisory Co., Ltd. and 137 shares via an ESPP Trust, as well as 5,367 shares held directly. Footnotes state that U.S. dollar prices reflect translations from NT$2,400 and NT$2,420 per share at an exchange rate of NT$32.172 to US$1.