Taiwan Semiconductor Manufacturing Company Limited reported significantly stronger interim results for the six months ended June 30, 2026. Net revenue was NT$2,404,483,690 thousand, up from NT$1,773,045,533 thousand, with a gross margin of 67% and income from operations of NT$1,425,568,793 thousand.
Net income reached NT$1,279,582,227 thousand versus NT$758,226,085 thousand, and basic EPS was NT$49.33 compared with NT$29.31. Cash generated by operating activities rose to NT$1,482,341,242 thousand, supporting heavy capital expenditures of NT$846,764,746 thousand and lifting cash and cash equivalents to NT$3,134,218,213 thousand. Total assets were NT$9,375,654,727 thousand and equity NT$6,474,470,981 thousand as of June 30, 2026.
Taiwan Semiconductor Manufacturing Company Limited and Sony Semiconductor Solutions Corporation signed a definitive agreement to establish Advanced Vision Semiconductor Manufacturing Corporation, a joint venture in Koshi City, Kumamoto Prefecture, Japan, focused on developing and manufacturing next-generation smartphone image sensors using advanced process technology.
Sony plans to contribute approximately 465 billion yen through cash and a company split transferring its newly constructed fab, while TSMC plans cash contributions of approximately 282 billion yen, with both made in phases based on market demand and other conditions. Sony will be the sole controlling shareholder, with the JV intended to be a consolidated subsidiary of Sony Group Corporation and led by a Sony-appointed Representative Director. The JV targets volume production in 2029 and contemplates additional investment supported by the Japanese government. Completion is subject to required regulatory approvals and customary closing conditions.
Taiwan Semiconductor Manufacturing Company Limited reported strong results for the second quarter of 2026, with consolidated revenue of NT$1,270.38 billion, net income of NT$706.56 billion, and diluted earnings per share of NT$27.25. For the six months ended June 30, 2026, net sales totaled 2,404,483,690 and net income was 1,279,582,227. As of June 30, 2026, total assets were 9,375,654,727 and equity attributable to shareholders was 6,432,518,334.
The Board approved a NT$7.0 per share cash dividend for the second quarter of 2026. The record date for common shareholders is December 16, 2026, with an ex-dividend date of December 10, 2026, and payment scheduled for January 7, 2027. The shareholders’ register will be closed December 12–16, 2026, and eligible foreign shareholders will have the option to receive cash dividends in U.S. dollars. The ex-dividend and record dates for TSMC American Depositary Shares are also December 10 and December 16, 2026, respectively.
To support long-term capacity plans and its technology roadmap, the Board approved capital appropriations of approximately US$29,442.50 million for advanced technology and packaging capacity, mature and specialty technologies, and fab construction and facilities. In addition, the Board approved forming a new joint venture with Sony Semiconductor Solutions Corporation for next-generation image sensors, including a share subscription of up to 282 billion Japanese yen in the joint venture.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD executive Yeap Choh Fei reported a purchase of 57 Common Shares (2330.TW) on 2026-08-07 at $73.31 per share. The shares were bought by the administrator of the company’s Employee Stock Purchase Plan (ESPP) on the filer’s behalf and are held indirectly through an ESPP Trust.
After this ESPP purchase, indirect holdings through the ESPP Trust total 6,493 shares. Yeap also reports 213,375 shares held directly and 10,581 shares held indirectly through a trust associated with the company’s Long-Term Incentive (LTI) Bonus Plan, over which the filer has obtained investment control.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD executive Kevin Xiaoqiang Zhang, SVP and Deputy Co-COO, reported purchasing 63 Common Shares (2330.TW) on 2026-08-07 at $73.310 per share. According to the company’s Employee Stock Purchase Plan, these shares were bought by the ESPP administrator on his behalf under predetermined terms and are held indirectly via an ESPP Trust, bringing that position to 7,286 Common Shares.
Separate holdings reported as of the same date include 329,663 Common Shares held directly, 2,500 American Depositary Shares (TSM) held directly, and 20,190 Common Shares held indirectly through an LTI Trust. Each American Depositary Share represents five Common Shares. The purchase price was translated from an average price of NT$2,367.1117 using an exchange rate of NT$32.288 to US$1.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Lipen Yuan reported an indirect purchase of 42 Common Shares of TSM on 2026-08-07 at $73.31 per share. The shares were bought by the administrator of the company’s Employee Stock Purchase Plan (ESPP) and held in an ESPP trust.
After this transaction, Yuan reports 1,260 shares held indirectly via the ESPP trust, 5,000 shares held directly, and 1,650 shares held indirectly through a spouse.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD officer Wu Yi-Huang reported an indirect purchase of 41 Common Shares on 2026-08-07 at $73.31 per share. The shares were bought by the administrator of the company’s Employee Stock Purchase Plan (ESPP) under predetermined terms and are held by an ESPP trust, bringing ESPP holdings to 120 shares. Wu also reports 44,359 shares held directly and 63,000 shares held indirectly by a spouse.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Yoo Chue-San reported a purchase of 51 Common Shares (2330.TW) on 2026-08-07 at $73.31 per share. The shares were bought by the administrator of the company’s Employee Stock Purchase Plan ("ESPP") on Yoo’s behalf under terms predetermined by the issuer.
After this ESPP transaction, 6,641 shares are held indirectly through an ESPP trust. Yoo also reports 1,797,614 shares held directly, and additional indirect holdings of 7,036 shares via a Long-Term Incentive ("LTI") bonus plan trust, 219,924 shares held by a spouse, and 851,908 shares held by Yuding Investment Co., Ltd.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD executive Mii Yuh-Jier, EVP and Co-COO, reported purchasing 72 Common Shares (2330.TW) on August 7, 2026 at $73.31 per share. The shares were bought in New Taiwan dollars by the administrator of the company’s Employee Stock Purchase Plan (ESPP) under predetermined terms and are held indirectly via an ESPP trust, bringing indirect ESPP holdings to 8,099 common shares.
Mii also reports direct holdings of 1,254,057 Common Shares (2330.TW) and 25 American Depositary Shares (ADS) (TSM), with each ADS representing five Common Shares. Indirectly, a trust under the company’s Long-Term Incentive (LTI) Bonus Plan holds 63,345 Common Shares over which Mii has obtained investment control. In addition, Mii holds Equity Linked Notes issued by UBS AG with a principal amount of $150,000 that reference a basket including TSM ADS. These notes are exercisable and expire on March 4, 2027 and may, under certain conditions, be settled by delivery of up to 703 TSM ADS at a strike price of 213.2515 per ADS.
Taiwan Semiconductor Manufacturing Co. Ltd. reports that SVP Wang Ying-Lang had 55 Common Shares (2330.TW) purchased on his behalf on 2026-08-07 under the company’s Employee Stock Purchase Plan (ESPP) at $73.31 per share, translated from an average price of NT$2,367.1117 at NT$32.288 to US$1. The shares are held indirectly by an ESPP trust, bringing his ESPP-related indirect holdings to 6,445 shares, alongside 362,392 shares held directly, 10,581 shares held via an LTI bonus plan trust, and 1,135,529 shares held indirectly via his spouse. The transaction was reported as a purchase and was not marked as made under a Rule 10b5-1 trading plan.